Ching W Lo

US Patent:

6560108, May 6, 2003

Filed:

Feb 16, 2000

Appl. No.:

09/504637

Inventors:

Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - West Hills CA
Pete Hudson - Escondido CA

Assignee:

Hughes Electronics Corporation - El Segundo CA

International Classification:

H05K 720

US Classification:

361704, 361702, 257707, 174 163

Abstract:

A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

US Patent:

6573124, Jun 3, 2003

Filed:

May 3, 1999

Appl. No.:

09/304459

Inventors:

Shih Chou - Cerritos CA
Steven R. Felstein - Redondo Beach CA
Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - Canoga Park CA
Richard Fanucchi - Fountain Valley CA
Gregory L. Mayhew - El Segundo CA
Lydia H. Simanyi - late of Santa Ana CA

Assignee:

Hughes Electronics Corp. - Los Angeles CA

International Classification:

H01L 2148

US Classification:

438126, 438127, 295272, 29841, 29855

Abstract:

A chip-on-board electronic device includes an electronic device die affixed to a printed circuit board, and electrically interconnected thereto by wirebonds. The electronic device is protected by coating it with a layer of silicon oxynitride and, optionally, an overlying thin layer of a conformal coating such as parylene. Under some circumstances, a protective layer of an organic material may be used instead of the layer of silicon oxynitride. The chip-on-board electronic device may be protected with an overlying layer of the conformal coating.

US Patent:

6757968, Jul 6, 2004

Filed:

Aug 30, 2002

Appl. No.:

10/232273

Inventors:

Ching P. Lo - Rancho Palos Verdes CA
Daniel A. Huang - West Hills CA
Pete Hudson - Escondido CA

Assignee:

The Boeing Company - Chicago IL

International Classification:

H05K 334

US Classification:

29840, 29831, 29832, 29847, 29852, 361702, 361704, 361719, 257E2151, 257E23063, 174 163, 174260

Abstract:

A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

US Patent:

45138486, Apr 30, 1985

Filed:

Jun 15, 1981

Appl. No.:

6/273406

Inventors:

Ching P. Lo - Culver City CA

Assignee:

Amerosa Enterprises, Inc. - Palos Verdes Estates CA

International Classification:

B60K 4124

US Classification:

192 18R

Abstract:

A clutch/brake assembly for coupling and decoupling (and simultaneously braking the rotation of) a rotary implement to a drive shaft. The clutch portion of the assembly operates in one mode during low rotational speeds of the implement and at higher rotational speeds changes modes to become a centrifugal clutch. The clutch is also torque sensitive such that when the implement is subjected to high loads and low rotational speeds, the clutch is more tightly engaged to avoid clutch slippage. The brake portion of the assembly has some components common to the clutch assembly. The brake portion is self-energized and constructed to obtain braking assistance from centrifugal force such as at high rotational speeds of the implement and is torque sensitive so that at low rotational speeds and high braking force, the braking surfaces are maintained in tight engagement.

US Patent:

43421954, Aug 3, 1982

Filed:

Aug 15, 1980

Appl. No.:

6/178398

Inventors:

Ching P. Lo - Culver City CA

International Classification:

F01N 710

US Classification:

60313

Abstract:

An exhaust system for a motorcycle having at least two exhaust conduits connected to different cylinders of a multiple cylinder motorcycle engine. Each exhaust conduit includes a curved flow divider for directing a portion of the exhaust gases through a crossover pipe for passage through the other exhaust conduit.

US Patent:

59532106, Sep 14, 1999

Filed:

Jul 8, 1997

Appl. No.:

8/889429

Inventors:

Ching P. Lo - Palos Verdes Estates CA

Assignee:

Hughes Electronics Corporation - Los Angeles CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.