Chinh H Doan

US Patent:

7904117, Mar 8, 2011

Filed:

Aug 12, 2005

Appl. No.:

11/202995

Inventors:

Chinh H. Doan - Santa Clara CA, US
John Marshall - Danville CA, US
Chuen-Shen Shung - San Jose CA, US
Tim Arthur Williams - Danville CA, US
Robert W. Brodersen - Berkeley CA, US
Jeffrey M. Gilbert - Cupertino CA, US
Ada Shuk Yan Poon - San Leandro CA, US

Assignee:

SIBEAM - Sunnyvale CA

International Classification:

H04M 1/00
H04W 4/00
H03C 7/00

US Classification:

4555621, 4555757, 370334, 375315

Abstract:

A method and apparatus is disclosed herein for wireless communication with adaptive beamforming. In one embodiment, the apparatus comprises a processor, a radio frequency (RF) transmitter having a digitally controlled phased array antenna coupled to and controlled by the processor to transmit content using adaptive beamforming, and an interface to a wireless communication channel coupled to the processor to communicate antenna information relating to the use of the phased array antenna and to communicate information to facilitate playing the content at another location.

US Patent:

8170522, May 1, 2012

Filed:

Nov 9, 2007

Appl. No.:

11/938126

Inventors:

Xiang Guan - Mountain View CA, US
Chinh Huy Doan - Santa Clara CA, US

Assignee:

SiBeam, Inc. - Sunnyvale CA

International Classification:

H04B 1/26

US Classification:

455330, 455326, 455333, 455327

Abstract:

A circuit features a balun having an unbalanced input and a balanced output, and a differential coupler having a symmetrical structure about a center axis. The differential coupler has a differential input and a differential output, the differential input being coupled to the balanced output of the balun. An impedance element is coupled to a circuit node of the differential coupler at a point along the center axis. Other embodiments are also described and claimed.

US Patent:

8229352, Jul 24, 2012

Filed:

Jul 2, 2008

Appl. No.:

12/167195

Inventors:

Chinh Doan - Santa Clara CA, US
Sohrab Emami - San Francisco CA, US

Assignee:

SiBeam, Inc. - Sunnyvale CA

International Classification:

H04B 7/24

US Classification:

455 39, 455 91, 455120, 473353

Abstract:

A device has an RF mixer, an IF mixer module, a single synthesizer, a frequency divider, a single side band mixer and a frequency quadrupler. The single synthesizer generates a signal to the IF mixer module, the frequency divider, and the single side band mixer. The single side band mixer mixes signals from the single synthesizer and the frequency divider. The frequency quadrupler receives the output of the single side band mixer. The RF mixer is coupled to the frequency quadrupler and the IF mixer module.

US Patent:

20080112101, May 15, 2008

Filed:

Nov 14, 2007

Appl. No.:

11/939726

Inventors:

Patrick T. McElwee - Sunnyvale CA, US
Chinh Huy Doan - Santa Clara CA, US
Jeffrey M. Gilbert - Palo Alto CA, US

International Classification:

H02H 7/00
H03H 7/01

US Classification:

361 56, 333175

Abstract:

An integrated circuit chip has on-chip millimeter wave (mmW) circuitry. An on-chip electro static discharge, ESD, protection network couples a signal pad of the chip to the mmW circuitry. The ESD protection network has a shorted stub being a low impedance path to ground for ESD events. Other embodiments are also described and claimed.

US Patent:

20080290959, Nov 27, 2008

Filed:

May 22, 2007

Appl. No.:

11/752073

Inventors:

Mohammed Ershad Ali - San Jose CA, US
Rokhsareh Zarnaghi - Santa Clara CA, US
Chinh Huy Doan - Santa Clara CA, US

International Classification:

H03H 7/38

US Classification:

333 32

Abstract:

A millimeter-wave integrated circuit (IC) package is disclosed. The package includes a substrate having a plurality of layers and a vertical interconnection. The vertical interconnection comprises a shielded transition between the plurality of layers and a compensation structure to minimize the parasitic effect of the transition.

US Patent:

20080291115, Nov 27, 2008

Filed:

May 22, 2007

Appl. No.:

11/752083

Inventors:

Chinh Huy Doan - Santa Clara CA, US
Mohammed Ershad Ali - San Jose CA, US

International Classification:

H01Q 21/00

US Classification:

343893

Abstract:

An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate. In one embodiment, the second level interconnect for surface-mounting on a printed circuit board (PCB) is provided on the bottom layer of the substrate.

US Patent:

20210096074, Apr 1, 2021

Filed:

Sep 25, 2020

Appl. No.:

17/033589

Inventors:

- San Jose CA, US
Chinh Doan - San Jose CA, US

International Classification:

G01N 21/59
G01N 21/55

Abstract:

Embodiments herein provide a test apparatus and system for a millimeter wave reflection test to measure propagation of millimeter wave signal through a material at various incident angles. In one example, the test apparatus may include a mechanized arch over a base plate, the mechanized arch including antenna carriers coupled to the mechanized arch and configured to hold respective antennas. A motor assembly moves the antenna carriers along the mechanized arch while maintaining the antenna carriers at symmetrical (equal and opposite) angles with respect to the base plate.

US Patent:

20190028301, Jan 24, 2019

Filed:

Aug 29, 2018

Appl. No.:

16/116782

Inventors:

- Portland OR, US
Shi Cheng - Cupertino CA, US
Dmitry Cherniavsky - San Jose CA, US
Chinh Huy Doan - San Jose CA, US
Sohrab Emami - San Francisco CA, US
Ricky Keangpo Ho - San Jose CA, US
Nishit Kumar - San Jose CA, US
Patrick Thomas McElwee - Sunnyvale CA, US
James R. Parker - Palo Alto CA, US
Nitesh Singhal - Santa Clara CA, US
Ron Zeng - Saratoga CA, US

International Classification:

H04L 12/46
H04L 27/06
H04L 5/14
H04L 27/04

Abstract:

Disclosed wireless tunneling system includes two wireless tunneling apparatuses that communicate with each other through the wireless link. A local wireless tunneling apparatus is coupled to a local processing apparatus through a wired connection and a remote wireless tunneling apparatus is coupled to the remote processing apparatus through another wired connection. The two processing apparatuses bi-directionally communicate with each other through the wireless link using the two wireless tunneling apparatuses as if the two processing apparatuses were connected through a wired connection.