Chirag B Patel

US Patent:

6690081, Feb 10, 2004

Filed:

Nov 19, 2001

Appl. No.:

09/993100

Inventors:

Muhannad S. Bakir - Atlanta GA
Hollie Reed - Atlanta GA
Paul Kohl - Atlanta GA
Chirag S. Patel - Peekskill NY
Kevin P. Martin - Atlanta GA
James Meindl - Marietta GA

Assignee:

Georgia Tech Research Corporation - Atlanta GA

International Classification:

H01L 2900

US Classification:

257522, 257792, 257506, 438461, 438421

Abstract:

Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.

US Patent:

6785458, Aug 31, 2004

Filed:

Feb 11, 2002

Appl. No.:

10/074420

Inventors:

Chirag Patel - College Park GA
James D. Meindl - Marietta GA
Thomas K. Gaylord - Atlanta GA
Elias N. Glytsis - Dunwoody GA
Kevin P. Martin - Atlanta GA
Stephen M. Schultz - Tucson AZ
Muhannad Bakir - Atlanta GA
Hollie Reed - Smyrna GA
Paul Kohl - Atlanta GA

Assignee:

Georgia Tech Research Corporation - Atlanta GA

International Classification:

G02B 610

US Classification:

385131, 385132

Abstract:

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.

US Patent:

6954576, Oct 11, 2005

Filed:

Jul 21, 2004

Appl. No.:

10/895685

Inventors:

Chirag Patel - College Park GA, US
James D. Meindl - Marietta GA, US
Thomas K. Gaylord - Atlanta GA, US
Elias N. Glytsis - Dunwoody GA, US
Kevin P. Martin - Atlanta GA, US
Stephen M. Schultz - Tucson AZ, US
Muhannad Bakir - Atlanta GA, US
Hollie Reed - Smyrna GA, US
Paul Kohl - Atlanta GA, US

Assignee:

Georgia Tech Research Corporation - Atlanta GA

International Classification:

G02B006/10

US Classification:

385131, 438 31

Abstract:

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.

US Patent:

7132736, Nov 7, 2006

Filed:

Oct 31, 2002

Appl. No.:

10/285034

Inventors:

Muhannad S. Bakir - Atlanta GA, US
James D. Meindl - Marietta GA, US
Chirag S. Patel - College Park GA, US

Assignee:

Georgia Tech Research Corporation - Atlanta GA

International Classification:

H01L 29/40
H01L 23/02
H01L 23/48

US Classification:

257678, 257621, 257696, 257773, 257667, 257798, 257777, 257784, 257786, 257783, 257776, 257775, 361776, 361774, 361784, 361773, 174262, 174260, 174250, 385 14

Abstract:

Devices and methods of fabrication thereof are disclosed. A representative device includes a complaint wafer-level package having one or more lead packages. A representative lead package includes a substrate having a plurality of die pads disposed thereon and a plurality of leads attached to the plurality of die pads. In addition, the lead package includes a plurality of pillars made of a low modulus material. Each pillar is disposed between the substrate and at least one lead, and each lead is disposed upon one of the pillars that compliantly support the lead.

US Patent:

7663750, Feb 16, 2010

Filed:

Jun 30, 2006

Appl. No.:

11/480287

Inventors:

Dar Bahatt - Foster City CA, US
Chirag Patel - Foster City CA, US
Roy H. Tan - Union City CA, US
Derek Prothro - San Francisco CA, US

Assignee:

Applied Biosystems, LLC - Carlsbad CA

International Classification:

G01J 3/28

US Classification:

356328

Abstract:

Systems, including methods, apparatus, and algorithms, for spectrally imaging a two-dimensional array of samples.

US Patent:

7817273, Oct 19, 2010

Filed:

Jun 30, 2006

Appl. No.:

11/479962

Inventors:

Dar Bahatt - Foster City CA, US
Chirag Patel - Foster City CA, US
Derek K. Prothro - San Francisco CA, US
Roy H. Tan - Union City CA, US

Assignee:

Life Technologies Corporation - Carlsbad CA

International Classification:

G01J 3/28

US Classification:

356328

Abstract:

Systems, including methods, apparatus, and algorithms, for spectrally imaging a two-dimensional array of samples are disclosed. In one such system, a method of sample analysis includes directing light from a two-dimensional array of examination sites onto a detection area such that dispersed light of known spectral composition from each site falls on the detection area. The method further includes assigning a corresponding two-dimensional array of regions of the detection area for detecting spectra from the examination sites based, at least in part, on the known spectral composition. The method also includes placing samples into the two dimensional array of examination sites and obtaining spectral data for each sample based on the detection area.

US Patent:

8139213, Mar 20, 2012

Filed:

Feb 19, 2009

Appl. No.:

12/389292

Inventors:

Dar Bahatt - Foster City CA, US
Chirag Patel - Foster City CA, US
Roy H. Tan - Union City CA, US
Derek Prothro - San Francisco CA, US

Assignee:

Life Technologies Corporation - Carlsbad CA

International Classification:

G01J 3/28

US Classification:

356328

Abstract:

Systems, including methods, apparatus, and algorithms, for spectrally imaging a two-dimensional array of samples.

US Patent:

20070026426, Feb 1, 2007

Filed:

Apr 26, 2006

Appl. No.:

11/412030

Inventors:

Hans Fuernkranz - Saratoga CA, US
Chirag Patel - Foster City CA, US

Assignee:

Applera Corporation - Foster City CA

International Classification:

C12Q 1/68
G06F 19/00

US Classification:

435006000, 702020000

Abstract:

A genetic surveillance system comprises a communications network and at least one reader-analyzer instrument. The reader-analyzer instrument has a communication interface to communicate over the network. The reader-analyzer instrument is adapted to perform genetic assay analysis of a sample obtained from a member of a population and to generate detection-related data based upon the analysis. The reader-analyzer instrument is adapted to associate qualifying information with the detection-related data and to communicate the associated qualifying information and detection-related data over the network.