Chirag N Patel

US Patent:

7276787, Oct 2, 2007

Filed:

Dec 5, 2003

Appl. No.:

10/729254

Inventors:

Daniel Charles Edelstein - White Plains NY, US
Paul Stephen Andry - Mohegan Lake NY, US
Leena Paivikki Buchwalter - Hopewell Junction NY, US
Jon Alfred Casey - Poughkeepsie NY, US
Sherif A. Goma - Hawthorne NY, US
Raymond R. Horton - Dover Plains NY, US
Gareth Geoffrey Hougham - Ossining NY, US
Michael Wayne Lane - Cortlandt Manor NY, US
Xiao Hu Liu - Croton on Hudson NY, US
Chirag Suryakant Patel - Peekskill NY, US
Edmund Juris Sprogis - Underhill VT, US
Michelle Leigh Steen - Danbury CT, US
Brian Richard Sundlof - Beacon NY, US
Cornelia K. Tsang - Mohegan Lake NY, US
George Frederick Walker - New York NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/48
H01L 23/498
H01L 21/4763
H01L 29/40
H01L 23/52

US Classification:

257698, 257E23067, 257E23075, 257E23011, 257E25013, 257E21597, 257E23006, 257E23172, 257E23174, 257774, 257773, 257702, 257680, 257700, 257758

Abstract:

A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

US Patent:

8328156, Dec 11, 2012

Filed:

Feb 13, 2012

Appl. No.:

13/371840

Inventors:

Bing Dang - Chappaqua NY, US
Peter A. Gruber - Mohegan Lake NY, US
Luc Guerin - Quebec, CA
Chirag S. Patel - Peekskill NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B28B 7/22
E04G 11/50

US Classification:

249 60, 249117, 257E21586

Abstract:

Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.

US Patent:

20220217529, Jul 7, 2022

Filed:

Jan 4, 2021

Appl. No.:

17/140975

Inventors:

- Basking Ridge NJ, US
Brendan Rohan - Long Island City NY, US
Sindhurani M - Santhosapuram, Chennai, IN
Chinnangari Krishna Kishore Reddy - YSR Kadapa, IN
Chirag Patel - Iselin NJ, US
Stephanie Miki Arndt - New York NY, US

Assignee:

Verizon Patent and Licensing Inc. - Basking Ridge NJ

International Classification:

H04W 8/28
H04M 1/72403
G06F 3/14

Abstract:

A system described herein may provide a technique for providing status updates relating to the fulfillment of an inter-entity service request. The status updates may be provided by a first entity associated with a first portion of the request, and may include updates indicating the fulfillment of a second portion of the request associated with a second entity. The status updates may be provided via a status tracker user interface (“UI”) that is updated based on the progress of the fulfillment of the request. The status tracker UI may be updated to include input elements to receive updated request parameters in situations where the second entity indicates to the first entity that one or more request parameters are invalid or otherwise in need of correction or modification.