Chris R Wagner

US Patent:

8616067, Dec 31, 2013

Filed:

Nov 30, 2011

Appl. No.:

13/307834

Inventors:

Chris Daniel Wagner - San Jose CA, US
Dale Alan Gee - Los Gatos CA, US
Derek Hubert McReavy - Minden NV, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

G01L 7/00

US Classification:

73756

Abstract:

A pressure sensor assembly is disclosed wherein the substrate to which the pressure sensing die is mounted is decoupled from the package.

US Patent:

20130263671, Oct 10, 2013

Filed:

Apr 10, 2012

Appl. No.:

13/443029

Inventors:

Chris Daniel Wagner - San Jose CA, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

G01L 9/06
G01L 7/00

US Classification:

73707

Abstract:

A fluid pressure spike attenuation device and a method of attenuating a fluid pressure spike are provided. A fluid channel extends through an inlet body from a first open end to a second open end. The inlet body can be connected to a fluid pressure source and receive a fluid from the fluid pressure source. The fluid channel has an increased cross-sectional area to attenuate a fluid pressure spike entering the fluid channel at the first open end. A sensing element is in fluid communication with the second open end. The sensing element senses a property of the fluid in the fluid channel. The method includes providing an inlet body defining a fluid channel. The method also includes attenuating a fluid pressure spike by dissipating a pressure wave as it moves through the increased cross-sectional area of the fluid channel.

US Patent:

20140000375, Jan 2, 2014

Filed:

Jun 29, 2012

Appl. No.:

13/538146

Inventors:

Calin Victor Miclaus - Fremont CA, US
Brian Allen Engle - Armada MI, US
Chris Daniel Wagner - San Jose CA, US
Dale Alan Gee - Los Gatos CA, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

G01L 7/00

US Classification:

73706

Abstract:

A pressure sensor assembly comprises a fluid channel having an inlet portion and an outlet portion, wherein the outlet portion is larger than the inlet portion.

US Patent:

20200284668, Sep 10, 2020

Filed:

Dec 20, 2019

Appl. No.:

16/724166

Inventors:

- Milpitas CA, US
Gertjan van Sprakelaar - Fremont CA, US
Chris Wagner - San Jose CA, US

Assignee:

Silicon Microstructures, Inc. - Milpitas CA

International Classification:

G01L 1/22

Abstract:

Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.

US Patent:

20200284677, Sep 10, 2020

Filed:

Jan 3, 2020

Appl. No.:

16/734229

Inventors:

- Milpitas CA, US
Chris Wagner - San Jose CA, US

Assignee:

Silicon Microstructures, Inc. - Milpitas CA

International Classification:

G01L 9/00
G01L 13/02

Abstract:

Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.