Christophe E Zinck from Orlando, FL, age 46

Us Patents

Wafer Level Package And Manufacturing Method Using Photodefinable Polymer For Enclosing Acoustic Devices
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US Patent:

20120094418, Apr 19, 2012
Filed:

Oct 18, 2010
Appl. No.:

12/906689
Inventors:

George Grama - Sanford FL, US
Christophe Zinck - Orlando FL, US
Charles Carpenter - Orlando FL, US
International Classification:

H01L 21/50
US Classification:

438 51, 438118, 257E21499
Abstract:

A wafer level package is produced by forming a photo definable polymer into a frame structure around a device located on a device wafer while maintaining the polymer in a partially cured state. Additional polymer material is used form a cap structure on a carrier wafer. The cap structure is attached to the frame structure so as to place the device within a cavity, wherein sufficient pressure is applied to the cap structure to hold the frame structure via a bonding of the partially cured photo definable polymers. The bonding is characterized by adhesion strength greater than the adhesion strength securing the cap structure to the carrier wafer. The carrier wafer is separated from the device wafer with a force sufficient for separating the carrier wafer from the cap structure while the cap structure remains attached to the frame structure.

Resumes

Staff Engineer - Wafer Level Packaging Development At Triquint Semiconductor

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Location:

Orlando, Florida Area

Industry:

Semiconductors

Experience:

TriQuint Semiconductor (Public Company; TQNT; Semiconductors industry): Staff Engineer - Wafer Level Packaging development, (November 2007-Present) I am in charge of Wafer Level Packaging for SAW devices: architecture definition, process development and optimization, tools selec...