Christopher Andrew Frank

US Patent:

20040130057, Jul 8, 2004

Filed:

Aug 4, 2003

Appl. No.:

10/634104

Inventors:

Reza Mehrabi - Tujunga CA, US
David Edwards - La Canada Flintridge CA, US
Robert Fermin - La Verne CA, US
Ali Mehrabi - Los Angeles CA, US
Chunhwa Wang - Diamond Bar CA, US
Rishikesh Bharadwaj - Arcadia CA, US
Ronald Sieloff - Chardon OH, US
Hsiao Chuang - Arcadia CA, US
Dennis Couzin - Evanston IL, US
Karen Spilizewski - Euclid OH, US
William Buttermore - Painesville Township OH, US
Donald Davis - Conneaut Lake PA, US
Christopher Frank - Stow OH, US
Barbara Hyde - Chardon OH, US
Michael Lang - Chagrin Falls OH, US
Keith Lutz - Lakewood OH, US
Austin Short - Mentor OH, US
Mark Wisniewski - Mentor OH, US

International Classification:

H05B006/00
B29C059/04
B29C047/06
B29C071/00

US Classification:

264/171130, 156/209000, 156/220000, 156/553000, 156/583500, 156/581000, 264/481000, 264/284000, 264/173160, 264/348000, 425/373000

Abstract:

A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.

US Patent:

59632895, Oct 5, 1999

Filed:

Oct 27, 1997

Appl. No.:

8/957984

Inventors:

Michael E. Stefanov - Stow OH
John H. Erdmann - Hudson OH
Christopher Frank - Kent OH
Yimin Ji - Hudson OH

Assignee:

S Vision - Santa Clara CA

International Classification:

G02F 113

US Classification:

349187

Abstract:

A method of manufacturing liquid crystal on silicon devices uses asymmetric placement of scribes on silicon and glass substrate layers to maximize the yield of processed active matrix silicon wafers. Asymmetrical scribing minimizes a dimension from a gasket seal between the substrates to a lower bond pad edge. An opposite glass overhang provides an interconnect redundancy for an ITO plate or a repair site for electrical contact to the ITO plate. Methods of device separation employing partial sawing are also employed.