Christopher Michael Gonzales

US Patent:

7209364, Apr 24, 2007

Filed:

Dec 29, 2004

Appl. No.:

11/024625

Inventors:

James C. Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A. Gonzales - Chandler AZ, US
Christopher D. Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/14

US Classification:

361801, 361759, 361747, 361740, 361732, 361726

Abstract:

A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.

US Patent:

7215552, May 8, 2007

Filed:

Mar 23, 2005

Appl. No.:

11/087256

Inventors:

James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361721, 361695, 361719, 165 802, 16510433, 165122, 174 161, 454184

Abstract:

In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.

US Patent:

7316606, Jan 8, 2008

Filed:

Feb 8, 2005

Appl. No.:

11/053727

Inventors:

James C Shipley - Gilbert AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US
Christopher D Lucero - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 5/00

US Classification:

454184, 454185, 361695, 361696, 312236

Abstract:

A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

US Patent:

7420804, Sep 2, 2008

Filed:

Jun 30, 2004

Appl. No.:

10/881884

Inventors:

Javier Leija - Chandler AZ, US
Christopher D. Lucero - Phoenix AZ, US
Christopher A. Gonzales - Chandler AZ, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361687, 361699, 165 804

Abstract:

The specification discloses an apparatus comprising a cold plate having an inlet and an outlet, the cold plate being attachable to a heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger. The specification also discloses a process comprising cooling a heat source using a closed-loop cooling system comprising a cold plate having an inlet and an outlet, the cold plate being attachable to the heat source, a heat exchanger having an inlet and an outlet, wherein the outlet of the heat exchanger is coupled to the inlet of the cold plate, and a hot-swappable pump module including at least one pump, the pump module being coupled to the cold plate and to the heat exchanger, and removing or installing the pump module while the cooling system is operating. Other embodiments are described and claimed.

US Patent:

7652891, Jan 26, 2010

Filed:

Dec 6, 2004

Appl. No.:

11/005910

Inventors:

Christopher D Lucero - Chandler AZ, US
Javier Leija - Chandler AZ, US
Christopher A Gonzales - Chandler AZ, US

Assignee:

RadiSys Corporation - Hillsboro OR

International Classification:

H05K 5/00

US Classification:

361752, 361796, 361800

Abstract:

A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

US Patent:

7864541, Jan 4, 2011

Filed:

Jan 12, 2010

Appl. No.:

12/686255

Inventors:

Christopher D. Lucero - Chandler AZ, US
Javier Leija - Chandler AZ, US
James C. Shipley - Gilbert AZ, US
Christopher A. Gonzales - Chandler AZ, US

Assignee:

Radisys Corporation - Hillsboro OR

International Classification:

H05K 5/00

US Classification:

361752, 361800, 361687

Abstract:

A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

US Patent:

20050199368, Sep 15, 2005

Filed:

Mar 11, 2004

Appl. No.:

10/798073

Inventors:

Christopher Gonzales - Chandler AZ, US
Javier Leija - Chandler AZ, US

International Classification:

F28F007/00

US Classification:

165080300

Abstract:

A heat sink may transfer heat from electronic devices. A heat conductive base may have integrally attached thereto a plurality of parallel fins. The fins may be made up of two sheets of material. One sheet may be a metal having significant structural integrity and the other sheet of material may be a pyrolytic graphite material having excellent heat transfer characteristics. The two layers may be integrally bonded together.

US Patent:

20060138905, Jun 29, 2006

Filed:

Dec 28, 2004

Appl. No.:

11/024297

Inventors:

Christopher Gonzales - Chandler AZ, US
Leija Javier - Chandler AZ, US
James Shipley - Gilbert AZ, US
Chris Lucero - Chandler AZ, US

International Classification:

H01L 41/08

US Classification:

310331000

Abstract:

According to some embodiments, a piezoelectric fan is attached to an integrated circuit chip. The piezoelectric fan may, for example, be soldered to the chip and receive power through a via of the integrated circuit chip.

Address:

5305 S 8 Dr, Phoenix, AZ 85041

VIN:

1HGCM66537A006257

Make:

HONDA

Model:

ACCORD

Year:

2007