Christopher A Lopez

US Patent:

7123037, Oct 17, 2006

Filed:

Aug 17, 2004

Appl. No.:

10/920531

Inventors:

Christopher A. Lopez - Phoenix AZ, US

Assignee:

WELLS-CTI, LLC - Vancouver WA

International Classification:

G01R 31/02

US Classification:

324760, 3241581

Abstract:

An integrated circuit (IC) temperature sensing device includes a temperature sensor positioned within a conductive temperature sensor housing and a thermal insulator surrounding the conductive temperature sensor housing. The sensor housing and thermal insulator are positioned within an IC temperature control block that heats or cools the IC. The temperature sensor housing comes into thermal contact with an IC undergoing burning-in, testing or programming. The temperature sensor housing provides a short thermal path between the IC under test and the temperature sensor. The thermal insulator thermally isolates the temperature sensor from the temperature control block so that the temperature sensor predominantly measures the temperature of the IC. The method of sensing the temperature of an IC includes actively changing the temperature of an IC with a heater or cooler, sensing the temperature of the IC with a temperature sensor positioned within a conductive sensor housing in thermal contact with the IC and thermally insulating the sensor housing and temperature sensor from the heater or cooler.

US Patent:

7187189, Mar 6, 2007

Filed:

Mar 3, 2006

Appl. No.:

11/367983

Inventors:

Christopher A. Lopez - Phoenix AZ, US
Brian J. Denheyer - Portland OR, US
Gordon B. Kuenster - Kirkland WA, US

Assignee:

Wells CTI-LLC - Vancouver WA

International Classification:

G01R 31/02

US Classification:

324760

Abstract:

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

US Patent:

7312620, Dec 25, 2007

Filed:

Nov 21, 2006

Appl. No.:

11/562294

Inventors:

Christopher A. Lopez - Phoenix AZ, US
Brian J. Denheyer - Portland OR, US
Gordon B. Kuenster - Mednia WA, US

Assignee:

Wells-CTI, LLC - Vancouver WA

International Classification:

G01R 31/02

US Classification:

324760

Abstract:

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

US Patent:

7394271, Jul 1, 2008

Filed:

Mar 3, 2006

Appl. No.:

11/368283

Inventors:

Christopher A. Lopez - Phoenix AZ, US
Brian J. Denheyer - Portland OR, US

Assignee:

Wells-CTI, LLC - Vancouver WA

International Classification:

G01R 31/02
H05B 1/00
G01K 1/00
G06F 1/26
G06F 1/00

US Classification:

324760, 219209, 702130, 713321, 713322

Abstract:

An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device includes a current sensing device that measures current passing through an IC, and a temperature control apparatus that measures a surface temperature of the IC. The device further includes an electronic controller that calculates the power consumed by the IC according to the measured current and adjusts the temperature of a heater or cooler responsive to the measured surface temperature and power consumption.

US Patent:

7482825, Jan 27, 2009

Filed:

Oct 30, 2007

Appl. No.:

11/929569

Inventors:

Christopher A. Lopez - Phoenix AZ, US
Brian J. Denheyer - Portland OR, US
Gordon B. Kuenster - Mednia WA, US

Assignee:

Wells-CTI, LLC - Vancouver WA

International Classification:

G01R 31/02

US Classification:

324760

Abstract:

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

US Patent:

20020150375, Oct 17, 2002

Filed:

Apr 13, 2001

Appl. No.:

09/835219

Inventors:

Henry Hung - Phoenix AZ, US
Christopher Lopez - Phoenix AZ, US
Majid Malakia - Scottsdale AZ, US

International Classification:

G02B006/36

US Classification:

385/138000

Abstract:

A method and apparatus for sealing an optical fiber in the wall of a modulator housing utilizes a metal crimp to compress sealingly a elastomer sleeve against the optical fiber.

US Patent:

20050206368, Sep 22, 2005

Filed:

Feb 28, 2005

Appl. No.:

11/069589

Inventors:

Christopher Lopez - Phoenix AZ, US
Brian Denheyer - Portland OR, US
Gordon Kuenster - Kirkland WA, US

Assignee:

WELLS-CTI, LLC, an Oregon limited liability company - Vancouver WA

International Classification:

G01R031/02

US Classification:

324158100

Abstract:

An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

US Patent:

20060290370, Dec 28, 2006

Filed:

Jul 21, 2006

Appl. No.:

11/459288

Inventors:

Christopher Lopez - Phoenix AZ, US

Assignee:

WELLS-CTI, LLC, AN OREGON LIMITED LIABILITY COMPANY - Vancouver WA

International Classification:

G01R 31/26

US Classification:

324765000

Abstract:

A system and method are provided which provides more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heater or cooler to directly contact the IC package, and an electronic controller to receive signals from the temperature sensor. The electronic controller is programmed to change the temperature of the heater or cooler responsive to the measured surface temperature of the IC package. A plurality of cooling devices individually removes heat generated by the plurality of IC packages. The electronic controller in each IC testing socket lid is further programmed to control a corresponding cooling device to maintain the surface temperature of the plurality of IC packages within a desired temperature range.