Christopher P Mcconnell

US Patent:

6491763, Dec 10, 2002

Filed:

Mar 13, 2001

Appl. No.:

09/805348

Inventors:

Steven Verhaverbeke - San Francisco CA
Lewis Liu - Paoli PA
Alan Walter - Chester Springs PA
C. Wade Sheen - Chester Springs PA
Christopher McConnell - Berwyn PA

Assignee:

Mattson Technology IP - Wilmington DE

International Classification:

B08B 300

US Classification:

134 26, 134 30, 134 31, 134 2, 134 3

Abstract:

A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.

US Patent:

47402490, Apr 26, 1988

Filed:

Oct 24, 1986

Appl. No.:

6/922882

Inventors:

Christopher F. McConnell - Boston MA

International Classification:

B08B 304

US Classification:

134 254

Abstract:

Disclosed is apparatus for treating semiconductor wafers with fluids. The device comprises a plurality of vessel segments having lateral walls for enclosing the wafers defining open ends. Sealing structure is provided at the ends so that the segments may be serially nested together and engaged with a fluid inlet and a fluid outlet in a wafer treatment fluid flow line. The vessel segments are constructed of material that is inert to the treatment fluids and designed to minimize creation of eddy currents and fluid traps. Fluid flowing through the vessel uniformly contacts the wafers and results in improved and more reproducible pre-diffusion cleaning, rinsing, etc.

Address:

3255 Cold Spg Rd, Charlottesvle, VA 22903

VIN:

2HJYK16277H508365

Make:

HONDA

Model:

RIDGELINE

Year:

2007