Christopher M Mcconnell

US Patent:

6491763, Dec 10, 2002

Filed:

Mar 13, 2001

Appl. No.:

09/805348

Inventors:

Steven Verhaverbeke - San Francisco CA
Lewis Liu - Paoli PA
Alan Walter - Chester Springs PA
C. Wade Sheen - Chester Springs PA
Christopher McConnell - Berwyn PA

Assignee:

Mattson Technology IP - Wilmington DE

International Classification:

B08B 300

US Classification:

134 26, 134 30, 134 31, 134 2, 134 3

Abstract:

A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.

US Patent:

20050180464, Aug 18, 2005

Filed:

Feb 2, 2005

Appl. No.:

11/048948

Inventors:

Christopher McConnell - Berwyn PA, US
Thomas Pleatman - Media PA, US

Assignee:

Adondo Corporation - Wayne PA

International Classification:

H04J001/02

US Classification:

370494000

Abstract:

In one embodiment, a first communications channel with a user is established and an audio user request to establish a second communications channel to enable communications with a party is received. The audio user request is recognized, and the second communications channel is established. In another embodiment, a communications channel between a computer and a user communications device is established, and a user input having an audio request is detected and stored. A user profile is accessed and a first grammar is selected based on the user profile. An attempt is made to recognize the audio request using the first, active grammar. If the audio request is not recognized, the first grammar is deactivated, a second grammar is activated and an attempt is made to recognize the audio request using the second grammar.

US Patent:

20050272415, Dec 8, 2005

Filed:

Oct 1, 2003

Appl. No.:

10/529415

Inventors:

Christopher McConnell - Berwyn PA, US
Thomas Pleatman - Media PA, US
Jennifer Parker - Wallingford PA, US
Chad Billmyer - Bryn Mawr PA, US

International Classification:

H04B007/00
H04M003/00

US Classification:

455418000, 455414100, 455066100

Abstract:

A method and system for interacting with a computer is provided. In one embodiment, a communications connection between the computer and a communications device is established. An audio signal from the user is received and processed to determine a desired function. A determination is made as to whether the desired function requires a spoken response and, if so, a spoken response to the user is provided by way of the remote communications device and the desired function is performed. In an alternate embodiment, an entry in a data file is read and a communications connection initiated between the computer and a remote communications device responsive to the entry. An audio notification is generated according to the entry and transmitted by way of the remote communications device.

US Patent:

20060276230, Dec 7, 2006

Filed:

Dec 13, 2005

Appl. No.:

11/300042

Inventors:

Christopher McConnell - Berwyn PA, US

International Classification:

H04B 1/38

US Classification:

455563000

Abstract:

A computer-readable medium, a method and a personal computer for enabling a portable communications device to access media content. In the computer-readable medium, media content is accessed using a personal computer, and information contained in the media content is extracted. A signal representative of the extracted information is generated and transmitted to a remote communications device by way of a communication channel.

US Patent:

48997676, Feb 13, 1990

Filed:

Dec 12, 1988

Appl. No.:

7/283465

Inventors:

Christopher F. McConnell - Gulph Mills PA
Alan E. Walter - Exton PA

Assignee:

CFM Technologies, Inc. - Lionville PA

International Classification:

B08B 302

US Classification:

134 56R

Abstract:

A system for the fluid treatment of semiconductor wafers includes a treatment vessel having opposed first and second ports, and means for holding wafers in a flow path therebetween. A flow segment comprising in sequence, a first vent, a first valve, an inlet, a second valve and a second vent extends between the first and the second port so as to constitute, together with the vessel, a closed fluid loop. A fluid delivery system for the delivery of a sequence of high purity treatment fluids to a treatment vessel includes a measuring tank having opposed ports and configured for plug flow between the ports, and a metering pump having its inlet connected to a said port for withdrawing metered amounts of fluid from the tank. A plurality of reservoirs of treatment fluid are each connected via a respective associated valve to one of the said ports. The tank is maintained hydraulically full, so that actuating the pump to withdraw a metered volume of fluid from the tank, and opening a valve associated with a selected treatment fluid draws the metered volume of the selected treatment fluid into the tank.

US Patent:

47954973, Jan 3, 1989

Filed:

Dec 4, 1985

Appl. No.:

6/805203

Inventors:

Christopher F. McConnell - Gulph Mills PA
Alan E. Walter - Exton PA

International Classification:

B08B 504

US Classification:

134 18

Abstract:

A method for the fluid treatment of semiconductor wafers includes a treatment vessel having opposed first and second ports, and means for holding wafers in a flow path therebetween. A flow segment comprising in sequence, a first vent, a first valve, an inlet, a second valve and a second vent extends between the first and the second port so as to constitute, together with the vessel, a closed fluid loop. Preferably, the first and second ports are top and bottom ports, with a flow path extending vertically therebetween. The loop is maintained hydraulically full, whereby filling the vessel with a treatment fluid at the inlet, flushes a preceding treatment fluid from the system. A sequence of treatment fluids of differing densities may be provided at the inlet, and a vent and a valve are controlled to fill the loop from the bottom, in the event the treatment fluid is denser than the preceding fluid, or from the top, in the event the fluid is lighter than the preceding fluid. A circulation pump recirculates fluid within the loop.

US Patent:

47382724, Apr 19, 1988

Filed:

Jun 24, 1985

Appl. No.:

6/747895

Inventors:

Christopher F. McConnell - Gulph Mills PA

International Classification:

B08B 304

US Classification:

134 59

Abstract:

Disclosed is apparatus for treating semiconductor wafers with fluids. The device comprises one or more vessels having lateral walls defining open ends. The vessels are arranged serially, and the open ends are engaged with a treatment fluid inlet and a treatment fluid outlet. Wafers or a wafer carrier are introduced into the vessels for treatment. The vessels are constructed of material that is inert to the treatment fluids and designed to minimize creation of eddy currents and fluid traps. Hydraulically full fluid flow through the vessel uniformly contacts the wafers with the fluid and results in improved and more reproducible prediffusion cleaning, rinsing, etc.

US Patent:

61659126, Dec 26, 2000

Filed:

Sep 14, 1999

Appl. No.:

9/395398

Inventors:

Christopher F. McConnell - Berwyn PA
Steven Verhaverbeke - Radnor PA

Assignee:

CFMT, Inc. - Wilmington DE

International Classification:

H01L 2131
B05D 118
B05D 310

US Classification:

438758

Abstract:

The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components using an enclosable single vessel. The methods of the present invention include contacting the electronic components with an activation solution followed by contacting the electronic components with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.