Christopher Eric Rosenthal

age ~56

from Troy, IL

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Also known as:

Christopher E Rosenthal
Chris E Rosenthal
Christoph Rosenthal
Christophe E Rosenthal

Phone and address:: 1171 Springvalley Rd, Troy, IL 62294
(618)6676480

Connected to:

Christopher Rosenthal Phones & Addresses

1171 Springvalley Rd, Troy, IL 62294 • (618)6676480
1215 Canteen Rd, Troy, IL 62294 • (618)6676480
187 Pumice Dr, Sherwood, AR 72120 • (501)8355684
4097 Willow Glen Cir, Sherwood, AR 72120 • (501)8343660
Las Vegas, NV
Seguin, TX
Plattsburgh, NY
Del Rio, TX
Corpus Christi, TX
Madison, IL
Haughton, LA

Work

Company:

University of missouri
May 2004
Position:

Mail courier/office clerk

Education

School / High School:

University of Missouri
2009
Specialities:

Bachelor of Arts in English

Name / Title

Company / Classification

Phones & Addresses

Christopher Rosenthal
Principal

Big Bend Property Management
Management Services

134 Jubilee Hl Dr, Wildwood, MO 63040
PO Box 9459, Saint Louis, MO 63117

Resumes

Christopher Rosenthal

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Director Of Purchasing At Watson Label Products

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Location:

Greater St. Louis Area

Industry:

Printing

Owner/Broker, Big Bend Property Management

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Location:

Greater St. Louis Area

Industry:

Real Estate

Christopher Rosenthal

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Location:

Greater St. Louis Area

Industry:

Real Estate

Referral Coordinator At Slmc

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Location:

Greater St. Louis Area

Industry:

Medical Practice

Referral Coordinator At St. Louis Medical Clinic

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Location:

Greater St. Louis Area

Industry:

Medical Practice

Christopher Rosenthal O'Fallon, MO

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Work:

University of Missouri

May 2004 to 2000
Mail Courier/Office Clerk University of Missouri

Aug 2008 to May 2009
Programs Coordinator Intern

Education:

University of Missouri
2009
Bachelor of Arts in English St. Louis
Medical

Us Patents

Debonding Temporarily Bonded Semiconductor Wafers
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US Patent:

20130048224, Feb 28, 2013
Filed:

Oct 26, 2012
Appl. No.:

13/662307
Inventors:

Gregory George - Colchester VT, US
Christopher Rosenthal - San Jose CA, US
International Classification:

B32B 38/10
US Classification:

156752, 156750, 156761
Abstract:

Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.