Christopher S Wolf

US Patent:

53409477, Aug 23, 1994

Filed:

Jun 22, 1992

Appl. No.:

7/902082

Inventors:

Kenneth Credle - Highland Park IL
Christopher G. Wolf - Beach Park IL
John McConnell - Zion IL

Assignee:

Cirqon Technologies Corporation - Gurnee IL

International Classification:

H05K 100

US Classification:

174262

Abstract:

A ceramic substrate is provided with filled via holes for electrical or thermal feedthrough to or from an electronic device, each via hole having at least one dimension from about 4 to about 50 mils. The via holes are filled with copper, silver or gold for high conductivity and the filling is without visible voids at a magnification of 1000 diameters. The filling is preferably hermetic and is achieved by first electrodepositing metal into the holes and extending therefrom as dumbbell shaped plugs and then heating the substrate to the melting point of the metal so that metal from the dumbbell ends enters the connecting portion within the via hole to seal any aperture therein.

US Patent:

48312134, May 16, 1989

Filed:

Oct 15, 1987

Appl. No.:

7/108880

Inventors:

Craig S. Espevik - Chicago IL
Christopher R. Wolf - Oak Creek WI

Assignee:

Cooper Industries, Inc. - Houston TX

International Classification:

H02G 306

US Classification:

174 65R

Abstract:

A swivel fitting for an electrical conduit and the like including a first fitting part including a generally cylindrical tubular section extending axially with respect to a central longitudinal axis of said first fitting part; a second fitting part having a head portion and a generally cylindrical section extending axially from said head portion and in sleeved relationship within said tubular section of said first fitting part; cooperable means on said first fitting part and said second fitting part for retaining said fitting parts in assembled relationship to each other while permitting rotation of one fitting part relative to the other fitting part about said axis, said cooperable means including a generally circumferential groove formed in said cylindrical section of said second fitting part and radially inwardly extending projection means on said tubular section of said first fitting part extending into said groove to prevent axial separation of said fitting parts; and means for exerting an axial tensioning force on said first fitting part and said second fitting part.

US Patent:

54549272, Oct 3, 1995

Filed:

Aug 23, 1994

Appl. No.:

8/294263

Inventors:

Kenneth Credle - Highland Park IL
Christopher G. Wolf - Beach Park IL
John McConnell - Zion IL

Assignee:

Cirqon Technologies Corporation - Gurnee IL

International Classification:

C25D 502
C25D 550

US Classification:

205123

Abstract:

A ceramic substrate is provided with filled via holes for electrical or thermal feedthrough to or from an electronic device, each via hole having at least one dimension from about 4 to about 50 mils. The via holes are filled with copper, silver or gold for high conductivity and the filling is without visible voids at a magnification of 1000 diameters. The filling is preferably hermetic and is achieved by first electrodepositing metal into the holes and extending therefrom as dumbbell shaped plugs and then heating the substrate to the melting point of the metal so that metal from the dumbbell ends enters the connecting portion within the via hole to seal any aperture therein.