Chuan H Yang

US Patent:

20190001442, Jan 3, 2019

Filed:

Sep 8, 2016

Appl. No.:

15/750140

Inventors:

- Portland OR, US
Chuan Yang - Portland OR, US
Jan Kleinert - Portland OR, US
Mark Peeples - Portland OR, US
Hugh Owens - Portland OR, US
Gwendolyn Byrne - Portland OR, US
Haibin Zhang - Portland OR, US
Justin Redd - Portland OR, US
Corie Neufeld - Portland OR, US
James D. Brookhyser - Portland OR, US
Yasu Osako - Portland OR, US
Mehmet Alpay - Portland OR, US
Zhibin Lin - Portland OR, US
Patrick Riechel - Portland OR, US
Tim Nuckolls - Portland OR, US
Hisashi Matsumoto - Portland OR, US
Chris Ryder - Portland OR, US

International Classification:

B23K 26/382
B23K 26/082
B23K 26/70
B23K 26/0622

Abstract:

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

US Patent:

20160250714, Sep 1, 2016

Filed:

Feb 26, 2016

Appl. No.:

15/055037

Inventors:

- Portland OR, US
Chuan Yang - Beaverton OR, US
Mark Alan Unrath - Portland OR, US
Martin Orrick - Hillsboro OR, US

International Classification:

B23K 26/0622
B23K 26/06
B23K 26/352
B23K 26/00

Abstract:

A laser processing system includes a first positioning system () for imparting first relative movement of a beam axis along a beam trajectory () with respect to a workpiece (), a processor for determining a second relative movement of the beam axis () along a plurality of dither rows, a second positioning system () for imparting the second relative movement, and a laser source () for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations () one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

US Patent:

20150050468, Feb 19, 2015

Filed:

Aug 15, 2014

Appl. No.:

14/461171

Inventors:

- Portland OR, US
Chuan YANG - Portland OR, US
Fang SHAN - San Jose CA, US

International Classification:

B41J 2/455

US Classification:

4281951, 347225

Abstract:

Laser output () is employed to mark an article () including a layer () supported by a substrate (), wherein the layer () has a thickness (t) that is less than or equal to 50 microns. The laser output () is focused to a numerical aperture diffraction-limited spot size () of less than or equal to 5 microns at a focal point () of the beam waist () and directed into the layer () to form a plurality of structures comprising a plurality of laser-induced cracks within the layer () and within a region of the article (), wherein the laser-induced cracks terminate within the layer () without extending to the substrate () or an outer surface () of the layer (), and wherein the plurality of structures are configured to scatter light incident upon the article ().