Chuan Yang

US Patent:

20120038918, Feb 16, 2012

Filed:

Aug 12, 2011

Appl. No.:

13/208922

Inventors:

Zhiwen Liu - State College PA, US
Chuan Yang - State College PA, US
Kebin Shi - Beijing, CN
Perry Edwards - State College PA, US

International Classification:

G01J 3/18
B29D 11/00
G02B 5/18

US Classification:

356328, 359571, 264 27

Abstract:

Embodiments of the invention provide a device called a “G-Fresnel” device that performs the functions of both a linear grating and a Fresnel lens. We have fabricated the G-Fresnel device by using PDMS based soft lithography. Three-dimensional surface profilometry has been performed to examine the device quality. We have also conducted optical characterizations to confirm its dual focusing and dispersing properties. The G-Fresnel device can be useful for the development of miniature optical spectrometers as well as emerging optofluidic applications. Embodiments of compact spectrometers using diffractive optical elements are also provided. Theoretical simulation shows that a spectral resolution of approximately 1 nm can be potentially achieved with a millimeter-sized G-Fresnel. A proof-of-concept G-Fresnel-based spectrometer with subnanometer spectral resolution is experimentally demonstrated.

US Patent:

20190001442, Jan 3, 2019

Filed:

Sep 8, 2016

Appl. No.:

15/750140

Inventors:

- Portland OR, US
Chuan Yang - Portland OR, US
Jan Kleinert - Portland OR, US
Mark Peeples - Portland OR, US
Hugh Owens - Portland OR, US
Gwendolyn Byrne - Portland OR, US
Haibin Zhang - Portland OR, US
Justin Redd - Portland OR, US
Corie Neufeld - Portland OR, US
James D. Brookhyser - Portland OR, US
Yasu Osako - Portland OR, US
Mehmet Alpay - Portland OR, US
Zhibin Lin - Portland OR, US
Patrick Riechel - Portland OR, US
Tim Nuckolls - Portland OR, US
Hisashi Matsumoto - Portland OR, US
Chris Ryder - Portland OR, US

International Classification:

B23K 26/382
B23K 26/082
B23K 26/70
B23K 26/0622

Abstract:

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

US Patent:

20160250714, Sep 1, 2016

Filed:

Feb 26, 2016

Appl. No.:

15/055037

Inventors:

- Portland OR, US
Chuan Yang - Beaverton OR, US
Mark Alan Unrath - Portland OR, US
Martin Orrick - Hillsboro OR, US

International Classification:

B23K 26/0622
B23K 26/06
B23K 26/352
B23K 26/00

Abstract:

A laser processing system includes a first positioning system () for imparting first relative movement of a beam axis along a beam trajectory () with respect to a workpiece (), a processor for determining a second relative movement of the beam axis () along a plurality of dither rows, a second positioning system () for imparting the second relative movement, and a laser source () for emitting laser beam pulses. The laser beam pulses of individually selected energies can be directed to individually selected transverse spot locations () one or more times during a primary laser pass to permit three-dimensional patterning. The laser beam pulses can also be directed to the spatially identical, overlapping, or non-overlapping neighboring spot area locations on the workpiece in a temporally nonsequential order.

US Patent:

20150050468, Feb 19, 2015

Filed:

Aug 15, 2014

Appl. No.:

14/461171

Inventors:

- Portland OR, US
Chuan YANG - Portland OR, US
Fang SHAN - San Jose CA, US

International Classification:

B41J 2/455

US Classification:

4281951, 347225

Abstract:

Laser output () is employed to mark an article () including a layer () supported by a substrate (), wherein the layer () has a thickness (t) that is less than or equal to 50 microns. The laser output () is focused to a numerical aperture diffraction-limited spot size () of less than or equal to 5 microns at a focal point () of the beam waist () and directed into the layer () to form a plurality of structures comprising a plurality of laser-induced cracks within the layer () and within a region of the article (), wherein the laser-induced cracks terminate within the layer () without extending to the substrate () or an outer surface () of the layer (), and wherein the plurality of structures are configured to scatter light incident upon the article ().

US Patent:

20140146159, May 29, 2014

Filed:

Nov 29, 2013

Appl. No.:

14/093188

Inventors:

Zhiwen Liu - State College PA, US
Chuan Yang - State College PA, US
Kebin Shi - Beijing, CN
Mingda Zhou - State College PA, US
Siyang Zheng - State College PA, US
Shizhuo Yin - State College PA, US

Assignee:

The Penn State Research Foundation - University Park PA

International Classification:

G02B 21/36

US Classification:

348 79, 430 8, 427162

Abstract:

We present a method for parallel axial imaging, or z-microscopy, utilizing an array of tilted micro mirrors arranged along the axial direction. Image signals emitted from different axial positions can be orthogonally reflected by the corresponding micro mirrors and spatially separated for parallel detection, essentially converting the more challenging axial imaging to a lateral imaging problem. Each micro mirror also provides optical sectioning capability due to its finite dimension.