Chung Suk Lee

US Patent:

49979086, Mar 5, 1991

Filed:

Nov 13, 1989

Appl. No.:

7/434144

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

C08G 802
C08G 6926
C08G 6928
C08G 7704

US Classification:

528353

Abstract:

Disclosed is a substantially fully imidized diglyme-insoluble, N-methylpyrrolidone-soluble polyimidesiloxane which is the reaction product of a dianhydride, about 1 to about 5% by weight of a mono-anhydride, and a mixture of about 20 to about 50% by weight siloxane diamine and about 50 to about 70% by weight non-siloxane diamine. The non-siloxane diamine is a mixture of about 33 to about 50 mole percent of a first diamine having the general formula ##STR1## and about 50 to about 67 mole percent of a second diamine having the general formula ##STR2## were each "X" is independently selected from hydrogen and halogen and each "Y" is independently selected from --CH. sub. 2 --, ##STR3## The polyimidesiloxanes are very useful in coating wire, cable, and circuit boards.

US Patent:

RE337978, Jan 14, 1992

Filed:

Feb 15, 1991

Appl. No.:

7/655888

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

B05D 302
C08F 246
C08G 7704

US Classification:

528 26

Abstract:

Substantially fully imidized polyimidesiloxanes which are based on a selected pyridine compound are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the dianhydride, a difunctional siloxane monomer and an organic diamine that has the formula ##STR1## wherein X is hydrogen, halide, phenyl or combinations thereof, Z=--O--, --S--, ##STR2## >C(CX. sub. 3). sub. 2, --, or --Y--Ar--Y--. Ar= ##STR3## Y=--O--, --S--, ##STR4## >C(CH. sub. 3). sub. 2, or --. n=0 or 1. The preferred diamine has the formula ##STR5## Other diamines can be used to provide an asymmetrical structure in the polyimidesiloxane polymer chain. The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable.

US Patent:

50083619, Apr 16, 1991

Filed:

Jan 2, 1990

Appl. No.:

7/459498

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

C08G 7704

US Classification:

528 26

Abstract:

Novel crystalline polyimidesiloxanes are prepared by reacting BTDA, and a siloxane monomer with a diamine selected from bis-4(4-aminophenoxy) phenyl sulfone and 2,2-bis-4(4-aminophenoxy) phenyl propane. The products have low water absorption.

US Patent:

49564234, Sep 11, 1990

Filed:

Oct 29, 1985

Appl. No.:

6/792430

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

C08L 7700

US Classification:

525432

Abstract:

Improved hot melt adhesives comprise a blend of a polyamide and a polyetheramide. The polyamides have the following general structure ##STR1## wherein A is a linear, branched or cyclic aliphatic hydrocarbon radical, which can be substituted with a halogen such as chlorine or bromine, when fire retardant products are desired, and wherein B is a linear or branched, saturated or unsaturated, aliphatic hydrocarbon radical, which can be substituted with halogen such as chlorine or bromine when fire retardant products are desired. The polyamides can also contain a residue of a saturated aliphatic hydrocarbon dicarboxylic acid. The value of x of the polymer formula is generally in the range of 5 to about 500, more usually in the range of about 20 to about 100. The polyetheramides have the following general structure: (PA--Y--PE). sub. m wherein PA represents a polyamide segment and PE represents a polyether segment, m is an integer ranging from 5 to about 100, Y is a group selected from ##STR2## The compositions of the invention can further include polyphenol compositions and pigments.

US Patent:

49736450, Nov 27, 1990

Filed:

Sep 1, 1988

Appl. No.:

7/239372

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Grand Island NY

International Classification:

C08G 7726

US Classification:

528 26

Abstract:

Fully imidized polyimidisiloxanes which are based on oxydiphthalic anhydride are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from oxydiphthalic anhydride, a difunctional siloxane monomer and an organic diamine that provides an assymetrical structure in the polyimidesiloxane polymer chain. The polyimide-siloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

US Patent:

48291315, May 9, 1989

Filed:

Feb 9, 1988

Appl. No.:

7/154168

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

C08F28304

US Classification:

525426

Abstract:

Substantilly fully imidized polyimidesiloxanes which are based on a mixture consisting essentially of a biphenyl tetracarboxylic dianhydride and a benzophenone tetracarboxylic dianhydride, are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the mixture of dianhydrides, a difunctional siloxane monomer and an organic diamine. Diamines can be used to provide an asymmetrical structure in the polyimidesiloxane polymer chain. The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

US Patent:

50773704, Dec 31, 1991

Filed:

Aug 17, 1990

Appl. No.:

7/568800

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

C08G 7700

US Classification:

528 26

Abstract:

Substantially fully imidized polyimidesiloxanes which are based on a selected pyridine compound are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the dianhydride, a difunctional siloxane monomer and an organic dimaine that has the formula ##STR1## wherein X is hydrogen, halide, phenyl, or combinations thereof ##STR2## The preferred dimaine has the formula ##STR3## Other diamines can be used to provide an asymmetrical structure in the polyimidesiloxane polymer chain. The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxane can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The products of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.

US Patent:

48534528, Aug 1, 1989

Filed:

Feb 9, 1988

Appl. No.:

7/153898

Inventors:

Chung J. Lee - Amherst NY

Assignee:

Occidental Chemical Corporation - Niagara Falls NY

International Classification:

B05D 302
C08F 246
C08G 7704

US Classification:

528 26

Abstract:

Substantially fully imidized polyimidesiloxanes which are based on 6FDA and optionally also a mixture of a biphenyl tetracarboxylic dianhydride and a benzophenone tetracarboxylic dianhydride, are soluble in diglyme which gives them particular utility in the micro-electronics industry. The polymers are prepared from the mixture of dianhydrides, a difunctional siloxane monomer and an organic diamine. Diamines can be used to provide an asymmetrical structure in the polyimidesiloxane polymer chain. The polyimidesiloxane can be prepared with functional groups which render them directly curable. The polyimidesiloxanes can also be prepared with functional groups which when reacted with an unsaturated compound renders the polymers curable. The product of the invention can be used in the form of solutions in the micro-electronic industry. The polymers can also be used in wire and cable coating and to prepare films, fibers, and molded and extruded articles.