Cindy S Chou

US Patent:

8279620, Oct 2, 2012

Filed:

Dec 7, 2009

Appl. No.:

12/632067

Inventors:

Nicholas Hayden Herron - Redondo Beach CA, US
Brooks S. Mann - Redondo Beach CA, US
Mark D. Korich - Chino Hills CA, US
Cindy Chou - Lakewood CA, US
David Tang - Fontana CA, US
Douglas S. Carlson - Hawthorne CA, US
Alan L. Barry - Torrance CA, US

Assignee:

GM Global Technology Operations LLC - Detroit MI

International Classification:

H05K 1/11

US Classification:

361803, 361784

Abstract:

A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.

US Patent:

20110168435, Jul 14, 2011

Filed:

Jan 13, 2010

Appl. No.:

12/686775

Inventors:

ALAN L. BARRY - TORRANCE CA, US
ELI B. SMITH - BELLFLOWER CA, US
BROOKS S. MANN - REDONDO BEACH CA, US
NICHOLAS HAYDEN HERRON - REDONDO BEACH CA, US
MARK D. KORICH - CHINO HILLS CA, US
DAVID TANG - FONTANA CA, US
CINDY CHOU - LAKEWOOD CA, US

Assignee:

GM GLOBAL TECHNOLOGY OPERATIONS, INC. - DETROIT MI

International Classification:

H05K 1/09
H05K 1/00

US Classification:

174257, 174250

Abstract:

A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.