Ciprian Marcoci

US Patent:

7436282, Oct 14, 2008

Filed:

Jul 6, 2007

Appl. No.:

11/774180

Inventors:

Ronald W. Whittaker - Ninichik AK, US
Joe D. Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

Multi-Fineline Electronix, Inc. - Anaheim CA

International Classification:

H01F 5/00

US Classification:

336200, 336229

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

7602272, Oct 13, 2009

Filed:

Aug 24, 2007

Appl. No.:

11/895447

Inventors:

Ronald W. Whittaker - Escondido CA, US
Joe D Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

Multi-Fineline Electronix, Inc. - Anaheim CA

International Classification:

H01F 5/00

US Classification:

336200

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

7656263, Feb 2, 2010

Filed:

Sep 18, 2008

Appl. No.:

12/233553

Inventors:

Ronald W. Whittaker - Escondido CA, US
Joe D. Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

Multi-Fineline Electronix, Inc. - Anaheim CA

International Classification:

H01F 5/00

US Classification:

336200

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

7690110, Apr 6, 2010

Filed:

Aug 24, 2007

Appl. No.:

11/895355

Inventors:

Ronald W. Whittaker - Escondido CA, US
Joe D Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

Multi-Fineline Electronix, Inc. - Anaheim CA

International Classification:

H05K 3/42

US Classification:

29852, 29847, 174264, 427 972

Abstract:

A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.

US Patent:

20060152322, Jul 13, 2006

Filed:

Dec 7, 2005

Appl. No.:

11/296579

Inventors:

Ronald Whittaker - Escondido CA, US
Joe Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

International Classification:

H01F 5/00

US Classification:

336200000

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

20100127814, May 27, 2010

Filed:

Dec 16, 2009

Appl. No.:

12/639886

Inventors:

Ronald W. Whittaker - Ninichilk AK, US
Joe D. Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

Multi-Fineline Electronix, Inc. - Anaheim CA

International Classification:

H01F 27/28

US Classification:

336229

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

20100146782, Jun 17, 2010

Filed:

Feb 23, 2010

Appl. No.:

12/711180

Inventors:

Ronald W. Whittaker - Ninichik AK, US
Joe D. Guerra - Lake Forest CA, US
Ciprian Marcoci - Anaheim CA, US

Assignee:

MULTI-FINELINE ELECTRONIX, INC. - Anaheim CA

International Classification:

H05K 3/42

US Classification:

29852, 29846

Abstract:

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

US Patent:

20140259643, Sep 18, 2014

Filed:

Mar 15, 2013

Appl. No.:

14/112979

Inventors:

- Irvine CA, US
Ciprian Marcoci - Placentia CA, US

Assignee:

MULTI-FINELINE ELECTRONIX, INC. - Irvine CA

International Classification:

H01F 41/02

US Classification:

29607

Abstract:

A method of manufacturing a substrate includes providing a substrate with a cavity and a post in the cavity, dispensing an elastic filling material in the cavity, inserting a magnetic core including a core hole such the post extends through the core hole, curing the elastic filling material, forming holes in the substrate outside of the cavity and in the post, and forming via-in-via structures in the holes.