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Clint A Beliveau

age ~64

from Bend, OR

Also known as:
  • Clint Alan Beliveau
Phone and address:
2987 NE Stanton Ave, Bend, OR 97701
(541)3229772

Clint Beliveau Phones & Addresses

  • 2987 NE Stanton Ave, Bend, OR 97701 • (541)3229772
  • Beaverton, OR
  • Wilsonville, OR
  • Portland, OR
  • 2987 NE Stanton Ave, Bend, OR 97701

Work

  • Position:
    Professional/Technical

Education

  • Degree:
    Graduate or professional degree

Us Patents

  • Hydrogen-Producing Fuel Processing Systems And Fuel Cell Systems With A Liquid Leak Detection System

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  • US Patent:
    7629067, Dec 8, 2009
  • Filed:
    May 18, 2007
  • Appl. No.:
    11/750833
  • Inventors:
    Clint A. Beliveau - Bend OR, US
    Scott C. Elliot - Bend OR, US
    Vernon Wade Popham - Bend OR, US
  • Assignee:
    Idatech, LLC - Bend OR
  • International Classification:
    H01M 8/04
    G01M 3/04
    G08B 21/00
  • US Classification:
    429 22, 73 405 R, 340605
  • Abstract:
    Liquid leak detection systems, and fuel cell systems and hydrogen-producing fuel processing systems containing the same. The liquid leak detection systems are adapted to detect liquid leaks from the fuel cell and/or fuel processing systems and to respond thereto, such as by interrupting the delivery of liquid reactants, by generating an alert, by transitioning the fuel processing system to a different operating state, and/or by shutting down the fuel processing and/or fuel cell system. The liquid leak detection systems may include a controller and at least one liquid detector, and in some embodiments may include a cover. In some embodiments, the liquid detector includes a signal emitter and a signal detector. In some embodiments, the liquid detector includes at least a pair of spaced-apart conductive members that nominally define an open circuit. In some embodiments, the cover is adapted to repel water and/or includes conductive particulate.
  • Hydrogen-Producing Fuel Processing Systems With A Liquid Leak Detection System

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  • US Patent:
    8438907, May 14, 2013
  • Filed:
    Dec 3, 2009
  • Appl. No.:
    12/630762
  • Inventors:
    Clint A. Beliveau - Bend OR, US
    Scott C. Elliot - Bend OR, US
    Vernon Wade Popham - Bend OR, US
  • Assignee:
    Idatech, LLC - Bend OR
  • International Classification:
    G01M 3/04
  • US Classification:
    73 40
  • Abstract:
    Liquid leak detection systems, and fuel cell systems and hydrogen-producing fuel processing systems containing the same. The liquid leak detection systems are adapted to detect liquid leaks from the fuel cell and/or fuel processing systems and to respond thereto, such as by interrupting the delivery of liquid reactants, by generating an alert, by transitioning the fuel processing system to a different operating state, and/or by shutting down the fuel processing and/or fuel cell system. The liquid leak detection systems may include a controller and at least one liquid detector, and in some embodiments may include a cover. In some embodiments, the liquid detector includes a signal emitter and a signal detector. In some embodiments, the liquid detector includes at least a pair of spaced-apart conductive members that nominally define an open circuit. In some embodiments, the cover is adapted to repel water and/or includes conductive particulate.
  • Signal Busses On Printed Board Structures Mounting Asic Chips With Signal Termination Resistor Devices Using Planar Signal Terminating Devices

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  • US Patent:
    6351391, Feb 26, 2002
  • Filed:
    May 15, 2000
  • Appl. No.:
    09/571956
  • Inventors:
    Clint A. Beliveau - Beaverton OR
    Wallace D. Doeling - Hillsboro OR
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H05K 710
  • US Classification:
    361767, 361795, 361764, 174255, 257723, 257703
  • Abstract:
    A printed circuit board structure is provided where there is a circuitized dielectric substrate having a plurality of signal traces thereon. The circuitized substrate has first and second opposite faces. An ASIC chip assembly is mounted on the first face and connected to the surface by solder connections. Preferably, the ASIC chip assembly is mounted on the substrate as an IC chip mounted on a chip carrier with the chip carrier being mounted to the circuit board by solder connections, preferably in the form of a ball grid array. In one embodiment, a discrete signal termination device is provided which is disposed on the second face of the circuitized substrate directly opposite the ASIC chip assembly. In another embodiment, a discrete signal termination device is disposed between the ASIC chip assembly and the printed circuit board. The signal termination device includes a plurality of planar resistors embedded in a dielectric material with the resistors being electrically connected to the signal lines on the circuitized substrate, preferably by solder connections, again in the form of a ball grid array.

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