Connie Chihuen Wong

US Patent:

6469394, Oct 22, 2002

Filed:

Jan 31, 2000

Appl. No.:

09/494756

Inventors:

Connie M. Wong - Fremont CA
Michael G. Lee - San Jose CA

Assignee:

Fujitsu Limited

International Classification:

H01L 2348

US Classification:

257780, 257778, 257789, 438108, 438612

Abstract:

Interconnect structures and methods for making interconnect structures are disclosed. A typical interconnect structure has a tapered first end portion having a first substantially planar surface and a concave surface adjacent to the first planar surface. A second end portion of the interconnect structure includes a second substantially planar surface. The second planar surface has a larger area than the first planar surface. An intermediate portion is disposed between the first end portion and the second end portion.

US Patent:

6543674, Apr 8, 2003

Filed:

Feb 6, 2001

Appl. No.:

09/778658

Inventors:

Michael G. Lee - San Jose CA
Connie M. Wong - Fremont CA
Wen-chou Vincent Wang - Cupertino CA

Assignee:

Fujitsu Limited

International Classification:

B23K 3102

US Classification:

22818022, 228164, 228215

Abstract:

A method for electrically coupling electrode pads comprising forming a reflowed solder bump on a first electrode pad supported by a first substrate. The reflowed solder bump includes a solder material having a solder melting temperature. The method further includes forming a second electrode pad on a second substrate. The second electrode pad has an electrode structure defined by at least one converging continuous arcuate surface terminating in an apex and having an electrode material whose melting temperature is greater than the solder melting temperature of the solder material. The solder bump is heated to reflow or to soften the solder material, and subsequently the apex of the second electrode pad is pressed or inserted into the heated solder bump to couple the first electrode pad to the second electrode pad. A method for solder bump reflow comprising pressing or inserting the apex of an electrode into a reflowed solder bumps, and then reflowing solder material of the reflowed solder bump. A semiconductor assembly including a semiconductor device having an electrode pad coupled to a semiconductor substrate and comprising an electrode structure defined by a pair of arcuate surfaces generally tangentially terminating in an apex.

US Patent:

7963906, Jun 21, 2011

Filed:

Dec 30, 2010

Appl. No.:

12/982341

Inventors:

Connie C. Wong - Palo Alto CA, US
Kevin E. Loewke - Menlo Park CA, US
Barry Behr - Palo Alto CA, US
Thomas M. Baer - Palo Alto CA, US

Assignee:

The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA

International Classification:

A61B 17/43
A61D 7/00
C12N 5/00
C12N 5/02

US Classification:

600 33, 600 34, 600 35, 435375, 435 83

Abstract:

Methods, compositions and kits for determining the developmental potential of one or more embryos or pluripotent cells and/or the presence of chromosomal abnormalities in one or more embryos or pluripotent cells are provided. These methods, compositions and kits find use in identifying embryos and oocytes in vitro that are most useful in treating infertility in humans.

US Patent:

8323177, Dec 4, 2012

Filed:

Nov 22, 2011

Appl. No.:

13/302908

Inventors:

Connie C. Wong - Arlington MA, US
Kevin E. Loewke - Menlo Park CA, US
Thomas M. Baer - Mountain View CA, US
Barry Behr - Palo Alto CA, US

Assignee:

The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA

International Classification:

A61D 19/00

US Classification:

600 34, 600 33, 435375

Abstract:

Methods, compositions and kits for determining the developmental potential of one or more embryos or pluripotent cells and/or the presence of chromosomal abnormalities in one or more embryos or pluripotent cells are provided. These methods, compositions and kits find use in identifying embryos and oocytes in vitro that are most useful in treating infertility in humans.

US Patent:

8337387, Dec 25, 2012

Filed:

Nov 22, 2011

Appl. No.:

13/302914

Inventors:

Connie C. Wong - Arlington MA, US
Kevin E. Loewke - Menlo Park CA, US
Thomas M. Baer - Mountain View CA, US
Barry Behr - Palo Alto CA, US

Assignee:

The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA

International Classification:

A61D 19/00

US Classification:

600 33

Abstract:

Methods, compositions and kits for determining the developmental potential of one or more embryos or pluripotent cells and/or the presence of chromosomal abnormalities in one or more embryos or pluripotent cells are provided. These methods, compositions and kits find use in identifying embryos and oocytes in vitro that are most useful in treating infertility in humans.

US Patent:

20080141175, Jun 12, 2008

Filed:

Oct 21, 2005

Appl. No.:

11/577577

Inventors:

Lalit Sarna - Mountain View CA, US
David M. Westwood - Palo Alto CA, US
Connie Wong - Mercer Island WA, US
Gregory L. Lutter - Palo Alto CA, US

International Classification:

G06F 3/048

US Classification:

715848

Abstract:

Mobile 3D graphical communication is provided in a communication network for wireless devices. A sender can create and customize a 3D graphical representation that will convey the sender's content, and then provide the animation for the 3D graphical representation locally on a sender device or have a remote server provide the animation. The server provides the animated 3D graphical representation to a recipient device so that the recipient device can render the animated 3D graphical for presentation of the sender's content. Transformation (including transcoding) techniques can be used, by the user devices and/or the server, to change the message (from text to audio, from 3D to 2D, etc., for example) to be consistent with animated 3D graphical presentation capabilities of the user devices and/or to match user preferences. Transformation can be performed prior to or during delivery of the content. The 3D graphical communication can also be used to provide content from a content provider to any user device whether wireless or hardwire, such as with a subscription service, or can be used to post animated 3D graphical content at a network location, such as a blog.

US Patent:

20110092762, Apr 21, 2011

Filed:

Aug 23, 2010

Appl. No.:

12/861571

Inventors:

Connie C. Wong - Palo Alto CA, US
Kevin E. Loewke - Menlo Park CA, US
Thomas M. Baer - Palo Alto CA, US
Barry Behr - Palo Alto CA, US

Assignee:

The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA

International Classification:

A61B 17/435
C12Q 1/02
C12Q 1/68
C12M 1/34
C12M 1/22

US Classification:

600 34, 435 29, 435 6, 4352883, 4353052

Abstract:

Methods, compositions and kits for determining the developmental potential of one or more embryos or pluripotent cells and/or the presence of chromosomal abnormalities in one or more embryos or pluripotent cells are provided. These methods, compositions and kits find use in identifying embryos and oocytes in vitro that are most useful in treating infertility in humans.

US Patent:

53348044, Aug 2, 1994

Filed:

Nov 17, 1992

Appl. No.:

7/977571

Inventors:

David G. Love - Pleasanton CA
Larry L. Moresco - San Carlos CA
William T. Chou - Cupertino CA
David A. Horine - Los Altos CA
Connie M. Wong - Fremont CA
Solomon I. Beilin - San Carlos CA

Assignee:

Fujitsu Limited - Kanagawa

International Classification:

H05K 0100

US Classification:

174267

Abstract:

An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an interconnect substrate having a first post disposed on one of its surfaces and a second post disposed on another of its surfaces. One post is for contacting the IC chip and the other is for contacting the major substrate. Each post comprises an elongated body having top and bottom ends, with the bottom end being mounted to one of the substrate surfaces and the top end having a substantially flat surface which is substantially co-planer with the substrate surface. The interconnect substrate further comprises a device for de-concentrating the mechanical stain present at one or both of the top and bottom ends of each post. The first and second posts are electrically coupled to one anther so that an electrical signal may pass from IC chip to the supporting substrate, and vice-versa.