Cory D Nelson

US Patent:

20220352391, Nov 3, 2022

Filed:

Apr 18, 2022

Appl. No.:

17/722465

Inventors:

- Fountain Inn SC, US
Cory Nelson - Simpsonville SC, US

International Classification:

H01L 29/94
H01L 29/66

Abstract:

A metal-oxide-semiconductor (MOS) capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a first terminal connected with the surface of the substrate, and a second terminal connected with the conductive layer. The oxide layer can be connected in series between the substrate and the conductive layer to form a capacitor between the first terminal and the second terminal. Each of the first terminal and the second terminal can be exposed along the surface of the substrate for surface mounting the capacitor. The MOS capacitor can exhibit excellent high frequency performance. For example, an insertion loss of the MOS capacitor can be greater than about −0.75 dB for frequencies ranging from about 5 GHz to about 40 GHz.

US Patent:

20220346222, Oct 27, 2022

Filed:

Apr 12, 2022

Appl. No.:

17/718368

Inventors:

- Fountain Inn SC, US
Cory Nelson - Simpsonville SC, US

International Classification:

H05K 1/02
H05K 3/34

Abstract:

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

US Patent:

20230071682, Mar 9, 2023

Filed:

Aug 19, 2022

Appl. No.:

17/891197

Inventors:

- Fountain Inn SC, US
Cory Nelson - Simpsonville SC, US

International Classification:

H05K 1/02
H05K 1/18
H05K 1/11
H05K 3/40
H05K 3/30

Abstract:

A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.

US Patent:

20230076503, Mar 9, 2023

Filed:

Aug 19, 2022

Appl. No.:

17/891193

Inventors:

- Fountain Inn SC, US
Cory Nelson - Simpsonville SC, US
Ronald S. Demcko - Raleigh NC, US

International Classification:

H05K 7/20
H05K 1/02

Abstract:

A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a first end of the body. At least one second terminal formed over a second end of the body. The second end of the body can be opposite the first end of the body in an X-direction. The heat sink component can have a length in the X-direction and a width in a Y-direction that is parallel with the top surface and perpendicular to the X-direction. A ratio of the width to the length can be greater than about 1.