Daniel Whitney Ackerman

US Patent:

58528695, Dec 29, 1998

Filed:

Mar 31, 1997

Appl. No.:

8/831007

Inventors:

Koen A. Gieskes - Binghamton NY
Daniel Whitney Ackerman - Binghamton NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H05K 330

US Classification:

29834

Abstract:

A method and apparatus for automatically supplying surface mount chip components from a bulk feeder and placing the chip components on a substrate. The apparatus includes a base frame, a substrate feeding mechanism, a placement head, and a placement head positioning system. The substrate feeding mechanism delivers substrates to a component receiving position on the base frame. The placement head is translationally movable with respect to the base frame and includes a component supplying and placing mechanism, to supply components and place components on a substrate in a desired location. The component supplying and placing mechanism includes a component transfer mechanism, a component feeder, and a vacuum spindle. The transfer mechanism includes a rotatable wheel with a plurality of component holding compartments, a plurality of angularly disposed stations, and a drive mechanism for sequentially moving the compartments to at least a component receiving station and a component delivery station. The feeder receives a plurality of components from a container and feeds the components in a desired orientation to the receiving station of the transfer mechanism.

US Patent:

45852952, Apr 29, 1986

Filed:

May 21, 1984

Appl. No.:

6/612547

Inventors:

Daniel W. Ackerman - Chenango Bridge NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H01R 1311

US Classification:

339258R

Abstract:

An eyelet is mountable to a circuit board by a snap-fit upon insertion into the circuit board from only one side. The eyelet has converging, flexible gripper legs between which a wire or electrical component lead may be inserted and retained in order to connect it mechanically to a conductive portion of the circuit board. More permanent attachment to the circuit board may be achieved by filling the eyelet with solder.

US Patent:

RE336416, Jul 16, 1991

Filed:

Jun 4, 1990

Appl. No.:

7/532633

Inventors:

Daniel W. Ackerman - Binghamton NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H01L 2198

US Classification:

2281802

Abstract:

The invention is directed to a method and apparatus for handling a component having a body and one or more members protruding therefrom, such that the protruding members are put in proper, mating registration with corresponding holes of a substrate or the like. The components are handled during transport and insertion by gripping of the bodies thereof, and the method and apparatus of the invention compensates for any offset in X, Y, and. theta. between the profile of the body and a particular pattern or location of the protruding members relative to the profile of the body.

US Patent:

42602165, Apr 7, 1981

Filed:

Aug 14, 1979

Appl. No.:

6/066361

Inventors:

Daniel W. Ackerman - Chenango Bridge NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H01R 912
H01R 916

US Classification:

339258S

Abstract:

An improved spade terminal having two receptacles for use on a printed circuit board, slidingly receives the prongs of spade connectors between flat surfaces. A pair of tabs forming the base of the terminal are inserted into and extend through a hole in a printed circuit board. Each of the tabs is provided with raised abutting means which maintain separation of the tabs after insertion into a circuit board thus allowing automated mechanical clinching of the tabs to firmly hold the terminal on the board prior to soldering. A continuous strip of stamped and formed terminals feed an automatic insertion head.

US Patent:

45000328, Feb 19, 1985

Filed:

Feb 16, 1983

Appl. No.:

6/467082

Inventors:

Daniel W. Ackerman - Chenango Bridge NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H01L 2198

US Classification:

228180A

Abstract:

The invention is directed to a method and apparatus for handling a component having a body and one or more members protruding therefrom, such that the protruding members are put in proper, mating registration with corresponding holes of a substrate or the like. The components are handled during transport and insertion by gripping of the bodies thereof, and the method and apparatus of the invention compensates for any offset in X, Y, and. theta. between the profile of the body and a particular pattern or location of the protruding members relative to the profile of the body.

US Patent:

42994365, Nov 10, 1981

Filed:

Feb 6, 1980

Appl. No.:

6/119153

Inventors:

Daniel W. Ackerman - Binghamton NY

Assignee:

Universal Instruments Corporation - Binghamton NY

International Classification:

H01R 448

US Classification:

339258R

Abstract:

A female contact formed of a unitary piece of metal is provided. The contact includes an opposed pair of cantilevered contact blades so arranged as to preclude overstressing of the blades upon insertion or withdrawal of a mating male pin terminal.