An enclosure apparatus for containing dust and debris such as may be generated while repairing a drywall surface. The enclosure apparatus includes a flexible, transparent body and may include a sealable slit, glove and pouch. The method of use allows the enclosure apparatus to be securely affixed to the drywall surface with a pressure sensitive adhesive. Tools or otherwise can be placed within the enclosure body prior to attachment to the drywall surface. Once the dust generating work is completed the enclosure apparatus can be removed, cleaned and properly disposed.