Daniel I Hong

US Patent:

8257075, Sep 4, 2012

Filed:

Nov 9, 2009

Appl. No.:

12/615141

Inventors:

Paul Choiniere - Livermore CA, US
Glenn Aune - Bellingham WA, US
John DiFonzo - Emerald Hills CA, US
Daniel Hong - Cupertino CA, US
Kevin Kenney - San Jose CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

B29C 45/40

US Classification:

425438, 249 68, 425556

Abstract:

A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.

US Patent:

20080265672, Oct 30, 2008

Filed:

Apr 24, 2007

Appl. No.:

11/739206

Inventors:

Daniel HONG - San Ramon CA, US

International Classification:

G06F 1/26
H02J 3/38

US Classification:

307 19, 713300

Abstract:

A system comprises a first power supply, a second power supply, and a load coupled to the first and second power supplies via separate power connectors. The load receives separate operating power from each of the first and second power supplies.

US Patent:

20120302670, Nov 29, 2012

Filed:

Aug 3, 2012

Appl. No.:

13/566251

Inventors:

Paul CHOINIERE - Livermore CA, US
Glenn AUNE - Bellingham WA, US
John DIFONZO - Emerald Hills CA, US
Daniel HONG - Cupertino CA, US
Kevin KENNEY - San Jose CA, US

Assignee:

APPLE INC. - Cupertino CA

International Classification:

B28B 13/06
C08K 7/06

US Classification:

524 1, 264334, 264316

Abstract:

A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection.