Daniel S Koch

US Patent:

6544810, Apr 8, 2003

Filed:

Aug 31, 2000

Appl. No.:

09/652615

Inventors:

Daniel J. Koch - Lakeville MN
Paul L. Bergstrom - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2100

US Classification:

438 48, 438 50, 438763, 438659, 438532

Abstract:

A capacitively sensed micromachined component includes an electrically insulative substrate ( ) having a first side ( ) and a second side ( ) opposite the first side. The component also includes a first layer ( ) adjacent to the second side of the electrically insulative substrate where at least a first portion of the first layer located adjacent to the second side of the electrically insulative substrate is infra-red light absorbing and is also electrically conductive. The component further includes a diffusion and chemical barrier layer ( ) encapsulating the first layer and the electrically insulative substrate. The component still further includes a capacitively sensed micromachined device ( ) on the diffusion and chemical barrier layer.

US Patent:

7187535, Mar 6, 2007

Filed:

Jan 30, 2006

Appl. No.:

11/343109

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
Daniel J. Koch - Lakeville MN, US
Shawn D. Knowles - Saint Francis MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

H01G 4/35
H01G 4/228

US Classification:

361302, 361307, 3613061, 607 5

Abstract:

A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.

US Patent:

7499817, Mar 3, 2009

Filed:

Sep 27, 2005

Appl. No.:

11/235944

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
Ryan J. Jensen - White Bear Township MN, US
Curtis E. Burgardt - Sauk Rapids MN, US
Susan A. Tettemer - Fridley MN, US
Daniel J. Koch - Lakeville MN, US
Simon E. Goldman - St. Louis Park MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

G06F 19/00

US Classification:

702 65, 703 1

Abstract:

A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.

US Patent:

7538563, May 26, 2009

Filed:

Sep 27, 2005

Appl. No.:

11/236369

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
Ryan J. Jensen - White Bear Township MN, US
Curtis E. Burgardt - Sauk Rapids MN, US
Susan A. Tettemer - Fridley MN, US
Daniel J. Koch - Lakeville MN, US
Simon E. Goldman - St. Louis Park MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

G01R 27/08
G01R 31/02
G01R 25/00

US Classification:

324691, 324707, 324549, 702 65

Abstract:

A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.

US Patent:

7816928, Oct 19, 2010

Filed:

Mar 2, 2009

Appl. No.:

12/396215

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
Ryan J. Jensen - White Bear Township MN, US
Curtis E. Burgardt - Sauk Rapids MN, US
Susan A. Tettemer - Fridley MN, US
Daniel J. Koch - Lakeville MN, US
Simon E. Goldman - St. Louis Park MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

G01R 27/08
G01R 27/00

US Classification:

324691, 324707, 702 65

Abstract:

A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.

US Patent:

8160707, Apr 17, 2012

Filed:

Jan 30, 2006

Appl. No.:

11/343106

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
Daniel J. Koch - Lakeville MN, US
Simon E. Goldman - St. Louis Park MN, US
Shawn D. Knowles - St. Francis MN, US
William J. Taylor - Anoka MN, US
Joyce K. Yamamoto - Maple Grove MN, US
Gregory J. Haubrich - Champlin MN, US
Michael Nowak - Andover MN, US
David Nghiem - Shoreview MN, US
Roger L. Hubing - Hastings MN, US
Len D. Twetan - Excelsior MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/00
H03H 7/00

US Classification:

607 37, 607 36, 333182

Abstract:

An implantable medical device is provided including a housing, an external circuit element extending outwardly from the housing, an internal circuit enclosed by the housing, a feedthrough array disposed along the housing having at least one filtered feedthrough and at least one unfiltered feedthrough, wherein the unfiltered feedthrough is adapted for connection to the outwardly extending circuit element; and including means for minimizing electromagnetic coupling between the filtered feedthrough and the unfiltered feedthrough.

US Patent:

8285379, Oct 9, 2012

Filed:

Jan 30, 2006

Appl. No.:

11/343107

Inventors:

Rajesh V. Iyer - Eden Prairie MN, US
William J. Taylor - Anoka MN, US
Joseph F. Lessar - Coon Rapids MN, US
Mark D. Breyen - Champlin MN, US
Daniel J. Koch - Lakeville MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/00
H01G 4/35

US Classification:

607 36, 607 37, 361302

Abstract:

An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.

US Patent:

20040119485, Jun 24, 2004

Filed:

Dec 20, 2002

Appl. No.:

10/325409

Inventors:

Daniel Koch - Lakeville MN, US
David Keenan - Northfield MN, US
Greg Gephart - Lakeville MN, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

A method for making a probe finger structure including the steps of providing a wafer or wafer portion having an upper layer, a lower layer and an insulating or etch stop layer located between the upper and lower layers. The method further includes the step of etching the lower layer to form a mounting portion, and etching the upper layer to form a plurality of probe fingers. The method also includes the step of locating an electrically conductive material on each of the probe fingers.