Daniel M Koch

US Patent:

6720635, Apr 13, 2004

Filed:

Dec 17, 1999

Appl. No.:

09/466337

Inventors:

Daniel J. Koch - Mesa AZ
Bishnu Prasanna Gogoi - Scottsdale AZ
Raymond M. Roop - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2984

US Classification:

257417, 257467, 257469

Abstract:

An electronic component includes a composite semiconductor substrate ( ) having a first side ( ) opposite a second side ( ), a semiconductor device ( ) at the first side of the composite semiconductor substrate, and a transducer ( ) at the second side of the composite semiconductor substrate.

US Patent:

58898727, Mar 30, 1999

Filed:

Jul 2, 1996

Appl. No.:

8/674382

Inventors:

Daniel J. Koch - Mesa AZ
Kenneth G. Goldman - Chandler AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04R 2500

US Classification:

381174

Abstract:

A capacitive microphone (10) utilizes a polysilicon diaphragm (14) that overlies an atmospheric cavity (34). The diaphragm is doped and annealed to form a sensitivity of the microphone (10). A silicon cap covers and protects the diaphragm (14) and a fixed plate (18).

US Patent:

60230916, Feb 8, 2000

Filed:

Nov 30, 1995

Appl. No.:

8/565735

Inventors:

Daniel J. Koch - Mesa AZ
Kenneth G. Goldman - Chandler AZ
Keith G. Kamekona - Scottsdale AZ
Mark D. Summers - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2900

US Classification:

257536

Abstract:

A sealable air gap (14) is formed between a heating element (16) and a base (11) to improve the thermal isolation of a semiconductor heater (10). A top layer (17) is formed over the heating element (16) which seals the air gap (14) so that the sealable air gap (14) can be at either atmospheric pressure or under a vacuum. The semiconductor heater (10) can be used in a variety of applications including as a heat source to adjust the resistivity of an overlying resistive layer (18). The embodiments of the semiconductor heater (10) also include a chemical sensor (20). Heat from a heating element (26) is used to keep an overlying layer of chemical sensing material (28) at an optimal temperature. The embodiments of the present invention also include a transducer (40) to heat a fluid (52) in a well (55) such as in an ink jet application.

US Patent:

59145218, Jun 22, 1999

Filed:

Jul 30, 1997

Appl. No.:

8/903087

Inventors:

Ronald James Gutteridge - Paradise Valley AZ
Daniel Nicolas Koury - Mesa AZ
Daniel Joseph Koch - Mesa AZ
Jonathan Hale Hammond - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2982

US Classification:

257415

Abstract:

A sensor (11) has a movable plate (16) that moves in response to an external acceleration. The movable plate (16) has a finger (17) that is capacitively coupled to fingers (13,14) that are attached to a substrate (12). A travel stop (19) is used to stop the movable plate (16) before the finger (17) on the movable plate (16) collides into the fingers (13,14) on the substrate (12).

US Patent:

62282751, May 8, 2001

Filed:

Dec 10, 1998

Appl. No.:

9/208924

Inventors:

Daniel J. Koch - Mesa AZ
Jonathan H. Hammond - Scottsdale AZ
Daniel N. Koury - Mesa AZ
Jonathan F. Gorrell - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 21302

US Classification:

216 2

Abstract:

A sensor has a support substrate (200), an electrode (110, 510, 710) movable relative to a surface (201) of the support substrate (200) and comprised of a first material, a structure (160, 460, 560, 760) over a portion of the electrode (110, 510, 710) to limit mobility of the electrode (110, 510, 710) and comprised of a second material different from the first material, and bonding pads (170, 470) outside a perimeter of the electrode (110, 510, 710) and comprised of the second material.