Daniel Y Lin

US Patent:

8200404, Jun 12, 2012

Filed:

Jan 13, 2010

Appl. No.:

12/686542

Inventors:

Jianping Zhang - Ann Arbor MI, US
Joseph F. Kucharski - Livonia MI, US
Charles W. Suter - South Lyon MI, US
Daniel T. Lin - Ann Arbor MI, US
David M. Dillon - Canton MI, US
Michael J. O'Day - Dexter MI, US
Nicholas J. Witte - Wixom MI, US

Assignee:

Ford Global Technologies, LLC - Dearborn MI

International Classification:

G06F 19/00

US Classification:

701 54, 701 84, 701 87

Abstract:

A method for controlling wheel-hop in a vehicle driveline includes detecting that a wheel-hop condition occurs upon determining an amplitude and frequency of speed oscillations of a component that transmits power to wheels of the driveline, engaging a transmission friction clutch that transmits torque in the driveline between an engine and the wheels, and modulating requested engine torque.

US Patent:

20130109532, May 2, 2013

Filed:

Nov 1, 2011

Appl. No.:

13/286488

Inventors:

Chad E. Griffin - Pinckney MI, US
Bradley D. Riedle - Northville MI, US
Jeffrey M. Jarvi - Plymouth MI, US
James B. Keyse - Farmington Hills MI, US
Daniel T. Lin - Ann Arbor MI, US

Assignee:

FORD GLOBAL TECHNOLOGIES, LLC - DEARBORN MI

International Classification:

B60W 10/02

US Classification:

477 79

Abstract:

A method for controlling a vehicle powertrain during launch includes controlling slip across a first clutch that transmits engine torque through the first clutch and the current gear while a transmission operates in a current gear other than a launch gear, disengaging the first clutch, engaging the launch gear, and controlling slip across a second clutch that transmits engine torque through the second clutch and the launch gear.

US Patent:

20210243895, Aug 5, 2021

Filed:

Feb 5, 2020

Appl. No.:

16/782526

Inventors:

- Santa Clara CA, US
Daniel Lin - Santa Clara CA, US
Sunil Sudhakaran - Santa Clara CA, US

International Classification:

H05K 1/11
H05K 1/02
H05K 1/14

Abstract:

This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.

US Patent:

20200290549, Sep 17, 2020

Filed:

Mar 12, 2019

Appl. No.:

16/351080

Inventors:

- Franklin TN, US
Jeffrey CLARK - Windsor, Ontario, CA
Daniel HOISINGTON - Novi MI, US
Daniel LIN - Troy MI, US

International Classification:

B60R 21/214
B60R 21/015
B60R 21/0136
B60R 21/26

Abstract:

A vehicle airbag system includes an airbag module, a seat detector, and an electronic controller. The airbag module has an airbag that is configured to be movably mounted to a vehicle roof structure. The seat detector detects a position of a vehicle seat. The electronic controller is in communication with the airbag module and the seat detector. The controller controls the airbag module to inflate the airbag in a predetermined direction based on detected position of the vehicle seat by the seat detector.

US Patent:

20200083149, Mar 12, 2020

Filed:

Nov 12, 2019

Appl. No.:

16/681221

Inventors:

- Dallas TX, US
Daniel Yong Lin - Plano TX, US

International Classification:

H01L 23/495
H01L 23/31

Abstract:

A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

US Patent:

20190157195, May 23, 2019

Filed:

Jan 18, 2019

Appl. No.:

16/252412

Inventors:

- Dallas TX, US
Daniel Yong Lin - Plano TX, US

International Classification:

H01L 23/495
H01L 23/31

Abstract:

A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

US Patent:

20180240741, Aug 23, 2018

Filed:

Mar 6, 2018

Appl. No.:

15/913648

Inventors:

- Dallas TX, US
Daniel Yong Lin - Plano TX, US

International Classification:

H01L 23/495
H01L 23/29
H01L 21/56
H01L 21/48
H01L 21/67
H01L 23/00

Abstract:

Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.

US Patent:

20180190577, Jul 5, 2018

Filed:

Dec 14, 2017

Appl. No.:

15/842608

Inventors:

- Dallas TX, US
Daniel Yong Lin - Plano TX, US

International Classification:

H01L 23/495

Abstract:

A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.