Daniel J Miley

US Patent:

51569965, Oct 20, 1992

Filed:

Apr 12, 1991

Appl. No.:

7/684610

Inventors:

Daniel J. Miley - Fort Wayne IN

Assignee:

ITT Corporation - New York NY

International Classification:

H01L 21283
H01L 2144

US Classification:

437182

Abstract:

To fabricate a ribbon connector for microwave integrated circuit use, an as fired, unclad alumina substrate is coated with a thin film of gold applied by sputter metallization. The thin layer of gold is then built up to a required ribbon thickness by an electroplating process. The thicker layer of gold is then etched by means of standard gold etching techniques where dimensions of the formed ribbons are determined by the precision process of photo reduction and masking rather than cutting and shaping of parts. This process also provides a convenient way to store and transfer these specially shaped ribbons and is amenable to use in mass production environments.