Daniel L Richardson

age ~73

from Mc Callsburg, IA

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Also known as:

Daniel Lee Richardson
Daniel T Richardson
Dan L Richardson
Dan Dan
T Richardson

Phone and address:: 15268 660Th Ave, Mc Callsburg, IA 50154
(515)2490096

Connected to:

Daniel Richardson Phones & Addresses

15268 660Th Ave, Mc Callsburg, IA 50154 • (515)2490096
Ames, IA
Coon Rapids, IA
Fairfield, CT
Ashburn, VA
Naperville, IL
Ware, IA
1580 W W Ave, Ames, IA 50014 • (515)2903245

Work

Position:

Production Occupations

Education

Degree:

High school graduate or higher

Name / Title

Company / Classification

Phones & Addresses

Daniel Richardson
President

Red Oak Builders
Entertainment · Single-Family House Construction · Garage Builders · Custom Cabinets · Contractors · Woodworking · Ceiling Fans · Ceramic Tile

6580 29 St N, Arlington, VA 22213
(703)5338426

Daniel Richardson

Richardson Software, LLC
Prepackaged Software Services

543 Helene St, Gaithersburg, MD 20878

Daniel Richardson
Systems Administrator

John Deere Financial Services, Inc
Personal Credit Institution

6400 NW 86 St, Camp Dodge, IA 50131
PO Box 6600, Camp Dodge, IA 50131
(515)2673000

Resumes

Daniel Richardson Roosevelt, NY

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Work:

Heart English School
Ibaraki prefecture, Mito City Japan
Mar 2010 to Mar 2012
English Teacher Apple Store
Garden City, NY
Aug 2007 to Jan 2010
Creative Department of Art Stony Brook University
Stony, VA
Jan 2007 to May 2007
Teach

Education:

Stony Brook University
Stony Brook, NY
2002 to 2006
BA in Studio Art Major,Japanese Studies Minor

Skills:

Animation:Flash,Sounds:LogicPr... Band,Video;Web Design,

Daniel Richardson Fredericksburg, VA

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Work:

General Dynamics Information Technology

Sep 2013 to 2000
Sr Principle Logistics Analyst General Dynamics Information Technology

Oct 2012 to 2000
Principle Logistics Analyst General Dynamics Information Technology
Stafford, VA
Mar 2010 to Oct 2012
Lead Logistician General Dynamics Land Systems
Woodbridge, VA
Aug 2006 to Mar 2010
Senior Logistics Engineer General Dynamics Land System
Woodbridge, VA
Aug 2002 to Aug 2006
Manufacturing Engineer United States Air Force (Reserves)
Hampton, VA
Feb 1998 to Present
Quality Assurance Inspector

Education:

Strayer University
Fredericksburg, VA
2009 to 2012
BS in Business Administration and Management

Skills:

Equipment Selection, Quality Assurance, Stress Analysis, Mechanical Engineering, Event Planning, Mentoring, Budget Forecast, Change Management, Cost Avoidance, Cost Containment, Cycle-Time Reduction, Inventory Control, Lean Manufacturing Practices, Logistics, Quality, Performance Improvement, Safety, Systems Integration Testing, Team Supervision, Proposal Preparation, Internal Combustion Engines, Electric Motor Drives, Compressors, Torsion Vibration Analysis, Firearm Range Safety, Physical Security, Counterintelligence, Emergency Response, Statistical Reporting, Supervision, Contract Negotiation, Vendor Relations, Troubleshooting, Project Management, Cost-Benefit Analysis, Requirements Analysis, Software Solutions Development, Deployment, Technical Design Documentation, Lifecycle Management, Leadership, Budgeting, Architecture, Data Security, Business Intelligence, Database Administration, Field Support, System Integration, Systems Administration, Migration, Data Security, Information Assurance, Automation, Troubleshooting, Data Recovery, Hardware Configuration, Industrial Automation, Performance Enhancement, Cross-Functional Leadership, Supply Chain Management, Competitive Market Positions, Quality Assurance, Regulatory Compliance, Shareholder Relationship, Six-Sigma Lean Operations, Industrial Automation, Monitoring

Us Patents

Tunable Radiation Source Providing A Vuv Wavelength Planar Illumination Pattern For Processing Semiconductor Wafers
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US Patent:

6597003, Jul 22, 2003
Filed:

Jul 12, 2001
Appl. No.:

09/905058
Inventors:

Alan C. Janos - Darnestown MD
Daniel B. Richardson - Westminster MD
Assignee:

Axcelis Technologies, Inc. - Beverly MA
International Classification:

H01J 3732
US Classification:

2504922
Abstract:

A radiation source constructed in accordance with the invention is particularly suited for use in processing semiconductor wafers. An exemplary embodiment of the invention includes a base electrode having a two dimensional surface bounding one side of a radiation emitting region. An ionizable, excimer gas is present in the radiation emitting region. The excimer gas, when energized, emits radiation in the UV and/or VUV wavelengths. A two dimensional dielectric radiation transmissive layer bounds an opposite side of the radiation emitting region and transmits radiation to a wafer treatment region. Disposed between the dielectric radiation transmissive layer and a protective radiation transmissive window is a two dimensional matrix or screen electrode defining a plane generally parallel to the two dimensional surface of the base electrode region. A power supply coupled to the base and matrix electrodes to energize the electrodes and the eximer gas causing emission of UV and/or VUV radiation. The range of wavelengths transmitted to the wafer treatment region can be âtunedâ by using a filter disposed adjacent to the protective window which functions to block transmission of selected wavelengths of emitted radiation.

Wafer Transport Apparatus
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US Patent:

6663333, Dec 16, 2003
Filed:

Jul 13, 2001
Appl. No.:

09/905031
Inventors:

David William Kinnard - Olney MD
Daniel Richardson - Westminster MD
Assignee:

Axcelis Technologies, Inc. - Beverly MA
International Classification:

B65G 4907
US Classification:

414217, 4147443, 4147445, 414939, 901 23
Abstract:

A loadlock chamber assembly includes a loadlock chamber, a sub-chamber removably attached to the loadlock chamber and a first robot arm having a primary pivot axis within the sub-chamber, wherein the first robot arm can move a substrate from a position approximately in a center of the loadlock chamber to a position outside the loadlock chamber.

Actively-Cooled Distribution Plate For Reducing Reactive Gas Temperature In A Plasma Processing System
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US Patent:

6782843, Aug 31, 2004
Filed:

Apr 1, 2003
Appl. No.:

10/404510
Inventors:

David W. Kinnard - Olney MD
Daniel B. Richardson - Westminster MD
Assignee:

Axcelis Technologies, Inc. - Beverly MA
International Classification:

C23C 1600
US Classification:

118723E, 118724, 15634534, 15634535
Abstract:

A plasma processing system is provided, having processor integral cooling passages for reducing an operating temperature thereof during processing of a wafer by the system. Cooling medium inlets and outlets are connected to the cooling passages to permit circulation of a cooling medium through the cooling passages. The baffle plate comprises a generally planar, apertured, gas distribution central portion surrounded by a flange into both of which the cooling passages may extend. Further, the baffle plate may have a non-apertured plate overlying and covering apertures in a central portion of the baffle plate.

Wafer Transport Apparatus
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US Patent:

6877946, Apr 12, 2005
Filed:

Sep 16, 2003
Appl. No.:

10/663088
Inventors:

David William Kinnard - Olney MD, US
Daniel Richardson - Westminster MD, US
Assignee:

Axcelis Technologies, Inc. - Beverly MA
International Classification:

B65G049/07
US Classification:

414805, 414217, 4147443, 414939
Abstract:

A loadlock chamber assembly includes a loadlock chamber, a sub-chamber removably attached to the loadlock chamber and a first robot arm having a primary pivot axis within the sub-chamber, wherein the first robot arm can move a substrate from a position approximately in a center of the loadlock chamber to a position outside the loadlock chamber.

Wafer Transport Apparatus
view source
US Patent:

6969227, Nov 29, 2005
Filed:

Sep 16, 2003
Appl. No.:

10/663519
Inventors:

David William Kinnard - Olney MD, US
Daniel Richardson - Westminster MD, US
Assignee:

Axcolis Technologies, Inc. - Beverly MA
International Classification:

B25J018/00
US Classification:

4147442, 4147445, 4147446, 901 19
Abstract:

A loadlock chamber assembly includes a loadlock chamber, a sub-chamber removably attached to the loadlock chamber and a first robot arm having a primary pivot axis within the sub-chamber, wherein the first robot arm can move a substrate from a position approximately in a center of the loadlock chamber to a position outside the loadlock chamber.