Daniel C Yang

US Patent:

7652539, Jan 26, 2010

Filed:

Oct 31, 2005

Appl. No.:

11/264291

Inventors:

Huai Gao - Irvine CA, US
Huinan Guan - Irvine CA, US
Li-Wu Yang - Cerritos CA, US
Daniel Yang - Los Angeles CA, US

International Classification:

H03F 3/68

US Classification:

330311

Abstract:

Provided herein are multi-stage broadband amplifier configured to achieve a high gain-bandwidth product in a non-distributed architecture and methods for designing the same. The broadband amplifier can include an input stage having a broadband matching unit and an input buffer unit, a gain stage having an RLC network and a amplifier unit and an output stage having a common collector amplifier and an RC compensation unit.

US Patent:

20090032483, Feb 5, 2009

Filed:

Jul 30, 2007

Appl. No.:

11/888025

Inventors:

Eric Yang - Beverly Hills CA, US
Daniel Sunghyun Yang - Beverly Hills CA, US

International Classification:

A63F 1/06

US Classification:

211 594

Abstract:

A chip stacker for a stack of chips includes an elongated chip counter having an upper end and a bottom end to define a height between the upper and bottom end corresponding to an integer number of the chips in a stacking manner. The chip counter has a plurality of longitudinal edges extended from the upper end to the bottom end and a plurality of guiding sidewalls formed between every two of the longitudinal edges, wherein each of the guiding sidewalls has a stacking surface has a predetermined curvature matching with a curvature of the chip, in such a manner that the chip counter is adapted for not only precisely counting the chips between the upper and bottom ends the chip counter but also easily stacking up the chips in an ordered manner when the chips are biased against the stacking surfaces of the guiding sidewalls to space apart the stacked chips side-by-side.

US Patent:

62014536, Mar 13, 2001

Filed:

Nov 19, 1998

Appl. No.:

9/195931

Inventors:

Steven S. Chan - Alhambra CA
Daniel C. Yang - Los Angeles CA
Jerry M. Dickson - Memphis TN

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01P 5107

US Classification:

333 26

Abstract:

An H-plane waveguide probe includes a microstrip formed on a dielectric substrate with a loop conductor generally configured in the shape of waveguide on one side and adapted to capture an incoming H-plane signal. A transition conductor formed on an opposing side of the substrate with a first leg and a second leg, connected together by a bend portion. The first leg of the transition conductor is generally parallel to the H-plane for coupling microwave energy from the waveguide to the microstrip. The second leg of the transition conductor is parallel to the E-field and is used to change the direction of the captured microwave energy along the H-plane direction to the E-plane direction. In order to optimize power transfer, the impedance of the loop conductor is selected to be about the same as the waveguide. The transition conductor is used to convert the E-field energy to a 50. OMEGA.