Danny Wayne Massey

US Patent:

6385044, May 7, 2002

Filed:

Jul 27, 2001

Appl. No.:

09/917446

Inventors:

John Lee Colbert - Byron MN
Roger Duane Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind Kumar Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361700, 361704, 361699, 361707, 361709, 257714, 257718, 257719, 257727, 174 152, 165 804, 16510434, 165185

Abstract:

An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

US Patent:

6449155, Sep 10, 2002

Filed:

Aug 9, 2001

Appl. No.:

09/927056

Inventors:

John Lee Colbert - Byron MN
Roger Duane Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind Kumar Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361704, 361707, 361709, 361712, 361715, 361718, 165 802, 165 803, 165185, 174 163, 257718, 257719

Abstract:

A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.

US Patent:

6475011, Nov 5, 2002

Filed:

Sep 7, 2001

Appl. No.:

09/948195

Inventors:

Arvind K. Sinha - Rochester MN
Roger D. Hamilton - Eyota MN
John L. Colbert - Byron MN
Danny E. Massey - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1362

US Classification:

439330, 439 762, 439342

Abstract:

An apparatus for applying force to a multi-chip module, a printed wiring board and an interposer to facilitate electrical contact there-between, includes a plurality of load posts, a load transfer plate, a spring member, a backside stiffener plate and a spring actuator. The load posts are affixed to the multi-chip module and pass through the printed wiring board. The load transfer plate has a first stiffness. The spring member is disposed adjacent the load transfer plate and has a second stiffness that is less than the first stiffness. The a backside stiffener plate is disposed between the spring member and the printed wiring board and has a third stiffness that is greater than the second stiffness. The spring actuator engages the spring member to apply force to the backside stiffener plate, causing the substrate, the interposer and the printed wiring board to be held in contact.

US Patent:

6634095, Oct 21, 2003

Filed:

Jun 27, 2001

Appl. No.:

09/892967

Inventors:

John L. Colbert - Byron MN
Roger D. Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind K. Sinha - Rochester MN
Charles C. Stratton - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23P 1900

US Classification:

29740, 29760, 29832, 257726, 257727, 269199, 269229, 269903

Abstract:

An installation apparatus of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

US Patent:

6757965, Jul 6, 2004

Filed:

Jun 5, 2003

Appl. No.:

10/455538

Inventors:

John L. Colbert - Byron MN
Roger D. Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind K. Sinha - Rochester MN
Charles C. Stratton - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 330

US Classification:

29836, 29174, 29837, 361709

Abstract:

A method of installing a land grid array (LGA) multi-chip module assembly to a printed wiring board is provided. A module holding member is attached to the printed wiring board. The module assembly is inserted into the module holding member. The module assembly is retained to the module holding member, which facilitates mechanical actuation of the LGA compression hardware. The module assembly is electrically grounded to the printed wiring board while the module assembly is retained to the module holding member.

US Patent:

6802733, Oct 12, 2004

Filed:

Aug 16, 2001

Appl. No.:

09/931299

Inventors:

John L. Colbert - Byron MN
Roger D. Hamilton - Eyota MN
Danny E. Massey - Austin TX
Arvind K. Sinha - Rochester MN

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1362

US Classification:

439331

Abstract:

An installation apparatus and method for actuating the electrical connection of a land grid array module to a printed wiring board is provided. A backside stiffener with load posts is attached to a printed wiring board. A load plate, module, plurality of load columns, and springplate are operably connected to the load posts. An actuation screw operably connected to the springplate is rotated imparting an actuation force to the module. The backside stiffener includes a local stiffener, wherein the local stiffener causes a deflection in the printed wiring board complementary to the deflection of the module when the actuation force is applied.

US Patent:

57385319, Apr 14, 1998

Filed:

Sep 9, 1996

Appl. No.:

8/709960

Inventors:

Daniel Paul Beaman - Austin TX
John Saunders Corbin - Austin TX
Danny Edward Massey - Georgetown TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

439 71

Abstract:

A self-aligning low profile socket for connecting a ball grid array type device through a dendritic interposer to a printed circuit board, the socket providing resources for attaching a heat sink to the electronic device with minimum thermal impedance. Compressive forces are evenly distributed over the pattern of the interposer array, and thermal conductivity is provided between the top of the electronic device and a heat sink, through the use of complementary concave and convex surfaces engaged by a flat screw mechanism. The socket exhibits a low profile while providing the flexibility of a dendritic interposer and effective heat sink attachment.

US Patent:

56910410, Nov 25, 1997

Filed:

Sep 29, 1995

Appl. No.:

8/536880

Inventors:

Richard Francis Frankeny - Elgin TX
Jerome Albert Frankeny - Taylor TX
Danny Edward Massey - Georgetown TX
Keith Allan Vanderlee - Austin TX

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 300
H01R 458
H05K 500
H05K 716

US Classification:

428209

Abstract:

A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact. The socket applies an evenly distributed force to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interposer situated between and aligned to each such solder pattern.