Darryl A Peters

US Patent:

6558879, May 6, 2003

Filed:

Sep 25, 2000

Appl. No.:

09/668929

Inventors:

Darryl W. Peters - Stewartsville NJ
Floyd L. Riddle - Hellertown PA

Assignee:

Ashland Inc. - Dublin OH

International Classification:

G03F 742

US Classification:

430331, 134 3, 134 39, 134 40, 430329, 510176, 510255, 510258, 510259

Abstract:

A stripping and cleaning composition for the removal of residue from metal and dielectric surfaces in the manufacture of semi-conductors and microcircuits. The composition is an aqueous system including organic polar solvents including corrosive inhibitor component from a select group of aromatic carboxylic acids used in effective inhibiting amounts. A method in accordance with this invention for the removal of residues from metal and dielectric surfaces comprises the steps of contacting the metal or dielectric surface with the above inhibited compositions for a time sufficient to remove the residues.

US Patent:

6656894, Dec 2, 2003

Filed:

Dec 7, 2000

Appl. No.:

09/732414

Inventors:

Darryl W. Peters - Stewartsville NJ
Roberto J. Rovito - Quakertown PA

Assignee:

Ashland Inc. - Dublin OH

International Classification:

C11D 752

US Classification:

510175, 510176, 510177, 510504, 438622, 438706, 438708, 438709, 438710

Abstract:

The invention relates to a method useful in removing etch residue from etcher equipment parts. The compositions used are aqueous, acidic compositions containing flouride and polar, organic solvents. The compositions are free of glycols and hydroxyl amine and have a low surface tension and viscosity.

US Patent:

6828289, Dec 7, 2004

Filed:

Jan 27, 1999

Appl. No.:

09/238851

Inventors:

Darryl W. Peters - Stewartsville NJ
Irl E. Ward - Bethlehem PA

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 330

US Classification:

510175, 510176

Abstract:

The present invention relates to compositions useful in removing photoresist and organic and inorganic residues and processes for removal of photoresists and etch residues. The compositions are aqueous, acidic compositions containing fluoride and organic polar solvents. The compositions are free of glycols and have a low surface tension and viscosity. Corrosion inhibitors are optionally present.

US Patent:

6943142, Sep 13, 2005

Filed:

Jan 9, 2002

Appl. No.:

10/042612

Inventors:

Matthew I. Egbe - West Norriton PA, US
Darryl W. Peters - Stewartsville NJ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D007/50
C11D007/34

US Classification:

510495, 510175, 510176, 510461, 510492, 510493

Abstract:

The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water.

US Patent:

7807613, Oct 5, 2010

Filed:

Jun 25, 2004

Appl. No.:

10/877305

Inventors:

Roberto J. Rovito - Quakertown PA, US
Jennifer M. Rieker - Bethlehem PA, US
Darryl W. Peters - Stewartsville NJ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 7/50

US Classification:

510175, 510176

Abstract:

The invention relates to aqueous, buffered, fluoride containing compositions having a pH of greater than 7. 0 to about 11. In certain embodiments, the buffered compositions have an extended worklife because pH dependent attributes such as oxide and metal etch rates are stable so long as the pH remains stable.

US Patent:

7922823, Apr 12, 2011

Filed:

Jan 26, 2006

Appl. No.:

11/814714

Inventors:

Elizabeth Walker - Stockertown PA, US
Shahri Naghshineh - Allentown PA, US
Jeffrey A. Barnes - Bath PA, US
Ewa Oldak - Bethlehem PA, US
Darryl W. Peters - Stewartsville NJ, US
Kevin P. Yanders - Germansville PA, US

Assignee:

Advanced Technology Materials, Inc. - Danbury CT

International Classification:

C11D 7/32

US Classification:

134 13, 510175

Abstract:

Compositions useful in microelectronic device manufacturing for surface preparation and/or cleaning of wafer substrates such as microelectronic device precursor structures. The compositions can be employed for processing of wafers that have, or are intended to be further processed to include, copper metallization, e. g. , in operations such as surface preparation, pre-plating cleaning, post-etching cleaning, and post-chemical mechanical polishing cleaning of microelectronic device wafers. The compositions contain (i) alkanolamine, (ii) quaternary ammonium hydroxide and (iii) a complexing agent, and are storage-stable, as well as non-darkening and degradation-resistant in exposure to oxygen.

US Patent:

8231733, Jul 31, 2012

Filed:

May 27, 2005

Appl. No.:

11/139950

Inventors:

Matthew I. Egbe - West Norriton PA, US
Darryl W. Peters - Stewartsville NJ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C23G 1/00
C23G 1/02
B08B 3/00

US Classification:

134 3, 134 2, 134 36, 134 41, 134902

Abstract:

The present invention relates to a method used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. In one aspect, the method involves contacting the substrate with a composition are comprised of a water soluble organic solvent, a sulfonic acid and water.

US Patent:

7361631, Apr 22, 2008

Filed:

Sep 15, 2004

Appl. No.:

10/942290

Inventors:

Matthew I. Egbe - West Norriton PA, US
Jennifer M. Rieker - Bethlehem PA, US
Darryl W. Peters - Stewartsville NJ, US
Irl E. Ward - Bethlehem PA, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

C11D 3/30

US Classification:

510175, 510176, 252 793

Abstract:

A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.