Dat Vu Quach

US Patent:

20110220166, Sep 15, 2011

Filed:

Mar 3, 2011

Appl. No.:

13/039506

Inventors:

Ruxandra Vidu - Citrus Heights CA, US
Dat Quach - Sacramento CA, US
Pieter Stroeve - Davis CA, US

International Classification:

H01L 35/20
C09K 3/00
C25D 5/02
C25D 5/18
C25D 1/04

US Classification:

136240, 252 623 T, 205118, 205104, 205108

Abstract:

This invention pertains generally to compositions and a method for making films, nanostructures and nanowires in templates and on substrates, including but not limited to metal-semiconductor nanostructures and semiconductor nanostructures on semiconductor substrates, and a device having the same. Particularly described are methods for making cobalt antimonide nanostructures on gold and Co—Sb substrates.

US Patent:

20200090687, Mar 19, 2020

Filed:

Oct 23, 2019

Appl. No.:

16/661564

Inventors:

- Cupertino CA, US
Dat Quach - Savage MN, US
Andrew Habermas - Bloomington MN, US
Joel William Hoehn - Hudson WI, US

International Classification:

G11B 5/31
B24B 37/04
C09J 133/10
C09J 7/38
H01L 21/683

Abstract:

Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

US Patent:

20190381628, Dec 19, 2019

Filed:

Jun 4, 2019

Appl. No.:

16/430540

Inventors:

- Cupertino CA, US
Dat Quach - Savage MN, US
Jeff O'Konski - Savage MN, US
Yuhong Xiong - Maple Grove MN, US
Ricky Anderson - Bloomington MN, US
Joshua Zierhut - Minneapolis MN, US

International Classification:

B24B 37/04
G11B 5/60
G11B 5/31

Abstract:

The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/−5 C., or even +/−5 C.