David B Blumel

US Patent:

20010003058, Jun 7, 2001

Filed:

Dec 6, 2000

Appl. No.:

09/730995

Inventors:

Kenneth Gilleo - Cranston RI, US
David Blumel - New York NY, US

International Classification:

H01L021/44
B32B005/00
H01L021/48
H01L021/50
B32B005/16
H01L023/48
H01L023/52
H01L029/40
H01L023/29

US Classification:

438/612000, 428/626000, 428/209000, 428/929000, 428/323000, 428/457000, 438/613000, 438/108000, 438/127000, 257/737000, 257/773000, 257/778000, 257/789000

Abstract:

A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

US Patent:

61947881, Feb 27, 2001

Filed:

Mar 10, 1999

Appl. No.:

9/266232

Inventors:

Kenneth Burton Gilleo - Cranston RI
David Blumel - New York NY

Assignee:

Alpha Metals, Inc. - Jersey City NJ

International Classification:

H01L 2329
H01L 23495

US Classification:

257789

Abstract:

A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

US Patent:

62286781, May 8, 2001

Filed:

Mar 10, 1999

Appl. No.:

9/266166

Inventors:

Kenneth Burton Gilleo - Cranston RI
David Blumel - New York NY

Assignee:

Fry's Metals, Inc. - Jersey City NJ

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438108

Abstract:

A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

US Patent:

63230623, Nov 27, 2001

Filed:

Sep 14, 1999

Appl. No.:

9/395553

Inventors:

Kenneth Burton Gilleo - Cranston RI
David Blumel - New York NY
James McLenaghan - North Kingstown RI

Assignee:

Alpha Metals, Inc. - Jersey City NJ

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438114

Abstract:

A method for applying an underfill and edge coating to a flip chip is described. The method includes the steps of adhering a bumped wafer to an expandable carrier substrate, sawing the wafer to form individual chips, stretching the carrier substrate in a bidirectional manner to form channels between each of the individual chips, applying an underfill material to the bumped surfaces of the chips and around the edges of the chips, cutting the underfill material in the channels between the chips and removing the individual, underfill coated chips from the carrier.

US Patent:

55713408, Nov 5, 1996

Filed:

Sep 9, 1994

Appl. No.:

8/303668

Inventors:

Alvin F. Schneider - Warren NJ
David B. Blumel - New York NY
Jack Brous - Livingston NJ

Assignee:

Fry's Metals, Inc. - Providence RI

International Classification:

B23K 3534

US Classification:

148 23

Abstract:

A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10% by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

US Patent:

52977218, Mar 29, 1994

Filed:

Nov 19, 1992

Appl. No.:

7/976931

Inventors:

Alvin F. Schneider - Edison NJ
David B. Blumel - New York NY
John V. Tomczak - Dolton IL

Assignee:

Fry's Metals, Inc. - Providence RI

International Classification:

B23K 35363

US Classification:

2281801

Abstract:

A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantially VOC-free and is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary. The absence of significant amounts of VOC's and the elimination of post-soldering cleaning result in substantial environmental and production-related benefits.

US Patent:

62286811, May 8, 2001

Filed:

Sep 14, 1999

Appl. No.:

9/395558

Inventors:

Kenneth Burton Gilleo - Cranston RI
David Blumel - New York NY

Assignee:

Fry's Metals, Inc. - Jersey City NJ

International Classification:

H01L 2144
H01L 2148
H01L 2150

US Classification:

438108

Abstract:

The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can then be applied to the bumps.