David C Crouthamel

US Patent:

20070216034, Sep 20, 2007

Filed:

Mar 14, 2006

Appl. No.:

11/375302

Inventors:

Mark Bachman - Sinking Spring PA, US
David Crouthamel - Bethlehem PA, US

International Classification:

H01L 23/48

US Classification:

257778000

Abstract:

An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the first region, while the IC chip overlies at least a portion of each of the first and second regions. Moreover, the assembly further comprises a plurality of first solder bumps and a plurality of second solder bumps. The first solder bumps contact both the IC chip and the circuit substrate. The second solder bumps are larger than the first solder bumps, contact the IC chip and are disposed above the second region of the stiffener.