David R Dawson

US Patent:

20070217467, Sep 20, 2007

Filed:

Mar 20, 2006

Appl. No.:

11/384940

Inventors:

Mark DeFranza - Ridgefield WA, US
David Dawson - Brush Prairie WA, US
Jason Farmer - Vancouver WA, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 5/00

US Classification:

372050120

Abstract:

A laser diode package is provided. The laser diode package includes a plurality of laser diode submount assemblies, each assembly including a submount to which one or more laser diodes are attached. An electrically isolating pad is attached to the same surface of the submount as the laser diode. A metallization layer is deposited onto the outermost surface of the electrically isolating pad, to which an electrical contact pad is bonded. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the metallization layer. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

US Patent:

20070217468, Sep 20, 2007

Filed:

May 4, 2006

Appl. No.:

11/417581

Inventors:

Mark DeFranza - Ridgefield WA, US
David Dawson - Brush Prairie WA, US
Jason Farmer - Vancouver WA, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 3/04
H01S 5/00

US Classification:

372050120, 372036000

Abstract:

A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each submount assembly includes a submount. At least one laser diode is attached to a front portion of each submount while a spacer, preferably comprised of an electrically isolating pad and an electrical contact pad, is attached to a rear portion of each submount. Electrical interconnects, such as wire or ribbon interconnects, connect the laser diode or diodes to the electrical contact pad, either directly or indirectly. Preferably the laser diode stack is formed by electrically and mechanically bonding together the bottom surface of each submount to the electrical contact pad of an adjacent submount assembly. The laser diode stack is thermally coupled to a cooling block. Preferably thermally conductive and electrically isolating members are interposed between the laser diode stack and the cooling block.

US Patent:

20070217469, Sep 20, 2007

Filed:

May 4, 2006

Appl. No.:

11/417726

Inventors:

Mark DeFranza - Ridgefield WA, US
David Dawson - Brush Prairie WA, US
Jason Farmer - Vancouver WA, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 3/04
H01S 5/00

US Classification:

372050120, 372036000

Abstract:

A side-pumped solid state laser utilizing a laser diode stack of laser diode submount assemblies is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode submount assembly includes a submount to which one or more laser diodes are attached. The radiation-emitting active layer of each laser diode is positioned substantially parallel to the mounting surfaces of the submount, causing the fast axis of each laser diode's output beam to be substantially orthogonal to the submount mounting surfaces. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.

US Patent:

20070217470, Sep 20, 2007

Filed:

May 18, 2006

Appl. No.:

11/436232

Inventors:

Mark DeFranza - Ridgefield WA, US
David Dawson - Brush Prairie WA, US
Jason Farmer - Vancouver WA, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 3/04
H01S 5/00

US Classification:

372050120, 372036000

Abstract:

An end-pumped solid state laser utilizing a laser diode stack of laser diode subassemblies as the pump source is provided. The laser gain medium of the solid state laser is contained within a laser cavity defined by a pair of reflective elements. Each laser diode subassembly includes a submount to which one or more laser diodes are attached. The fast axis corresponding to each output beam of each laser diode is substantially perpendicular to the mounting surfaces of the submount. The laser diodes can be of one wavelength or multiple wavelengths. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. On top of the submount, adjacent to the laser diode, is a spacer. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. Preferably the laser diode stack is thermally coupled to a cooling block.

US Patent:

20070217471, Sep 20, 2007

Filed:

Jul 24, 2006

Appl. No.:

11/492140

Inventors:

Mark DeFranza - Ridgefield WA, US
David Dawson - Brush Prairie WA, US
Jason Farmer - Vancouver WA, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 3/04
H01S 5/00

US Classification:

372050120, 372036000

Abstract:

A laser diode package is provided, the package including a plurality of laser diode submount assemblies. Each laser diode submount assembly includes a submount comprised of a non-conductive material. At least one laser diode is attached to a first portion of one surface of each submount while a spacer is attached to a second portion of the same submount surface. Preferably the submount has a high thermal conductivity and a CTE that is matched to that of the laser diode. The laser diode stack is formed by mechanically coupling the bottom surface of each submount to the spacer of an adjacent submount assembly. The individual laser diodes of the fabricated stack can be serially coupled together, coupled together in parallel, or individually addressable. To provide package cooling, the laser diode stack is thermally coupled to a cooling block.

US Patent:

20080117944, May 22, 2008

Filed:

Nov 16, 2006

Appl. No.:

11/601555

Inventors:

David Clifford Dawson - Brush Prairie WA, US
David R. Balsley - Portland OR, US

Assignee:

nLight Photonics Corporation - Vancouver WA

International Classification:

H01S 3/00

US Classification:

372 3804, 372 3807

Abstract:

Method and apparatus are provided that limit the current ramp rate applied to a laser bar or a single emitter laser diode to a predetermined value of 150 milliamps per millisecond or less. In addition to the laser diode and its power supply, the apparatus includes a power supply control circuit that performs the function of limiting the power supply ramp rate. The power supply control circuit can be separate from, or integrated within, the power supply.

US Patent:

20190229499, Jul 25, 2019

Filed:

Apr 2, 2019

Appl. No.:

16/372963

Inventors:

David C. Dawson - Brush Prairie WA, US
Wolfram Urbanek - Camas WA, US
David Martin Hemenway - Beaverton OR, US

Assignee:

nLIGHT, Inc. - Vancouver WA

International Classification:

H01S 5/40
H01S 5/022
H01S 5/042
H01S 5/024

Abstract:

Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

US Patent:

20190221990, Jul 18, 2019

Filed:

Dec 3, 2018

Appl. No.:

16/208111

Inventors:

- Vancouver WA, US
David C. Dawson - Brush Prairie WA, US
Wolfram Urbanek - Camas WA, US
Roger L. Farrow - Vancouver WA, US
Dahv A.V. Kliner - Portland OR, US

Assignee:

nLIGHT, Inc. - Vancouver WA

International Classification:

H01S 3/094
H01S 3/102
H01S 5/40
G02B 6/036
H01S 3/10
H01S 3/0941
H01S 3/067
G02B 27/14
H01S 3/16
H01S 3/23
H01S 5/022
H01S 5/024
H01S 5/14

Abstract:

A method of spectrally multiplexing diode pump modules to increase brightness includes generating one or more pump beams from respective diode lasers at a first wavelength in a diode laser package, generating one or more pump beams from respective diode lasers at a second wavelength different from the first wavelength in the diode laser package, wavelength combining at least one of the pump beams at the first wavelength with at least one of the pump beams at the second wavelength to form one or more combined pump beams, and receiving the combined pump beams in a pump fiber coupled to the diode laser package. Laser systems can include multi-wavelength pump modules and a gain fiber having a core actively doped so as to have an absorption spectrum corresponding to the multiple wavelength, the gain fiber situated to receive the pump light and to produce an output beam at an output wavelength.