David B Harr

US Patent:

20090200647, Aug 13, 2009

Filed:

Feb 8, 2008

Appl. No.:

12/028650

Inventors:

Jyoti P. Mondal - Palatine IL, US
David B. Harr - Spring Grove IL, US

Assignee:

FREESCALE SEMICONDUCTOR, INC. - Austin TX

International Classification:

H01L 23/552
H01L 21/44

US Classification:

257659, 438612, 257E23114, 257E21476

Abstract:

An integrated circuit pad structure includes a ground strip () positioned below a pad (). In one example a conductive element () is coupled to the pad (), and at least two tiled layers, positioned below the first conductive element () and positioned above the ground strip () are included. A conductor (), may run beneath the ground strip (). In a second example, a pad () is seated on a ground shield cage having a bottom conductive ground element () including several ground strips where at least one ground strip () is along a signal routing path. The ground shield cage further includes a set of stacked conductive ground elements, stacked to form sidewalls () of the cage. The top conductive ground element () of the stacked elements has an inner perimeter and an outer perimeter, such that the inner perimeter surrounds the pad () and the top conductive ground element () is in the plane of the conductive element () coupled to the pad ().