David E Houser

US Patent:

6453549, Sep 24, 2002

Filed:

Dec 13, 1999

Appl. No.:

09/460278

Inventors:

Anilkumar C. Bhatt - Johnson City NY
David E. Houser - Apalachin NY
John A. Welsh - Easley SC

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 330

US Classification:

29837, 29840, 29846

Abstract:

A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.

US Patent:

6483046, Nov 19, 2002

Filed:

Apr 24, 2000

Appl. No.:

09/559018

Inventors:

David E. Houser - Apalachin NY
James M. Larnerd - Binghamton NY
Jeffrey L. Lee - Vestal NY
Francis S. Poch - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 909

US Classification:

174266, 174262

Abstract:

The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge of the plated through hole from a surface of the circuit board.

US Patent:

6501171, Dec 31, 2002

Filed:

Jan 30, 2001

Appl. No.:

09/774152

Inventors:

Donald S. Farquhar - Endicott NY
David E. Houser - Apalachin NY
Konstantinos I. Papathomas - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2334

US Classification:

257706, 257717, 257712, 257783

Abstract:

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, resulting in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

US Patent:

6522014, Feb 18, 2003

Filed:

Sep 27, 2000

Appl. No.:

09/670968

Inventors:

Frank D. Egitto - Binghamton NY
Elizabeth Foster - Friendsville PA
Raymond T. Galasco - Binghamton NY
David E. Houser - Apalachin NY
Mark L. Janecek - Endicott NY
Thomas E. Kindl - Endwell NY
Jeffrey A. Knight - Endwell NY
Stephen W. MacQuarrie - Vestal NY
Voya R. Markovich - Endwell NY
Luis J. Matienzo - Endicott NY
Amarjit S. Rai - Vestal NY
David J. Russell - Apalachin NY
William T. Wike - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2348

US Classification:

257774, 438639, 438677

Abstract:

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e. g. , copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

US Patent:

6527686, Mar 4, 2003

Filed:

Feb 2, 2000

Appl. No.:

09/496488

Inventors:

David Erle Houser - Apalachin NY
Joseph Duane Kulesza - Binghamton NY
Candido Tiberia - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23Q 3157

US Classification:

483 1, 483 34, 483 13, 483 37, 483902, 33639, 408 97, 294104, 2941193, 294902

Abstract:

A movable spindle tool machine, such as a printed circuit board line drilling machine includes a base and a spindle mounted to the base. A magazine is mounted proximate the spindle for storing a supply of tools. A pitch independent tool changer is moveably mounted relative to the base for transferring tools from the magazine for insertion into the spindle. A tool locator is mounted in line with the spindle. The tool changer is operable to initially transfer a tool from the magazine to the tool locator to align the tool with the spindle and thereafter transfer the tool to the spindle for insertion into the spindle. The spindle is mounted to a nested outrigger guide. A positioning system can move two or more spindles simultaneously. A bit detector in a pressure foot button uses fiber optics to detect broken bits.

US Patent:

6576549, Jun 10, 2003

Filed:

Oct 28, 2002

Appl. No.:

10/282275

Inventors:

Frank D. Egitto - Binghamton NY
Elizabeth Foster - Friendsville PA
Raymond T. Galasco - Binghamton NY
David E. Houser - Apalachin NY
Mark L. Janecek - Endicott NY
Thomas E. Kindl - Endwell NY
Jeffrey A. Knight - Endwell NY
Stephen W. MacQuarrie - Vestal NY
Voya R. Markovich - Endwell NY
Luis J. Matienzo - Endicott NY
Amarjit S. Rai - Vestal NY
David J. Russell - Apalachin NY
William T. Wike - Endicott NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2131

US Classification:

438678, 257774, 438639, 438675, 438677

Abstract:

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e. g. , copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer.

US Patent:

60272457, Feb 22, 2000

Filed:

Jul 26, 1999

Appl. No.:

9/361052

Inventors:

David E. Houser - Apalachin NY
Francis S. Poch - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01K 1100
G01N 2520

US Classification:

374162

Abstract:

The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

US Patent:

59845236, Nov 16, 1999

Filed:

Feb 3, 1998

Appl. No.:

9/017741

Inventors:

David E. Houser - Apalachin NY
Francis S. Poch - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01K 1700
G01K 1300
G01K 1112

US Classification:

374 31

Abstract:

The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.