David Timothy Jacobs

US Patent:

7745281, Jun 29, 2010

Filed:

Feb 14, 2008

Appl. No.:

12/031092

Inventors:

John D. Prymak - Greer SC, US
Chris Stolarski - Greenville SC, US
David Jacobs - Greer SC, US
Chris Wayne - Moore SC, US
Philip Lessner - Newberry SC, US
John T. Kinard - Greer SC, US
Alethia Melody - Greenville SC, US
Gregory Dunn - Arlington Heights IL, US
Robert T. Croswell - Elgin IL, US
Remy J. Chelini - Crystal Lake IL, US

Assignee:

Kemet Electronics Corporation - Greenville SC
Motorola, Inc. - Schaumburg IL

International Classification:

H01L 21/8242

US Classification:

438244, 438171, 438210, 438238, 438239, 257E27024, 257E51003, 257E51025

Abstract:

An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

US Patent:

7929274, Apr 19, 2011

Filed:

Apr 3, 2008

Appl. No.:

12/061964

Inventors:

Erik Reed - Simpsonville SC, US
David Jacobs - Greer SC, US
Randolph S. Hahn - Simpsonville SC, US

Assignee:

Kemet Electronics Corporation - Greenville SC

International Classification:

H01G 9/04
H01G 9/145
H01G 4/228
H01G 9/00
H01G 9/10
H05K 5/03

US Classification:

361528, 361540, 361538

Abstract:

The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

US Patent:

8262745, Sep 11, 2012

Filed:

Jul 21, 2010

Appl. No.:

12/840756

Inventors:

Erik Reed - Simpsonville SC, US
David Jacobs - Greer SC, US
Randolph S. Hahn - Simpsonville SC, US

Assignee:

Kemet Electronics Corporation - Greenville SC

International Classification:

H01G 9/00

US Classification:

29 2503

Abstract:

The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

US Patent:

8520366, Aug 27, 2013

Filed:

Dec 22, 2010

Appl. No.:

12/975662

Inventors:

Brandon Summey - Simpsonville SC, US
Jeffrey Poltorak - Fountain Inn SC, US
Philip M. Lessner - Newberry SC, US
Yongjian Qiu - Greenville SC, US
Randolph S. Hahn - Simpsonville SC, US
David Jacobs - Greer SC, US
Keith R. Brenneman - Simpsonville SC, US
Albert Harrington - Fountain Inn SC, US
Chris Stolarski - Greenville SC, US

Assignee:

Kemet Electronics Corporation - Simpsonville SC

International Classification:

H01G 9/15

US Classification:

361528, 361523, 361525, 361529, 361516, 361519, 29 2501, 29 2503

Abstract:

An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

US Patent:

20040030441, Feb 12, 2004

Filed:

Aug 12, 2002

Appl. No.:

10/216323

Inventors:

Henry Bullock - Fountain Inn SC, US
Douglas Byrd - Simpsonville SC, US
David Jacobs - Greer SC, US

Assignee:

Kemet Electronics Corporation - Greenville SC

International Classification:

B29C039/00

US Classification:

700/197000, 264/040300

Abstract:

A transfer mold apparatus comprising at least one mold cavity, at least one resin chamber, and at least one channel communicating between the at least one mold cavity and the at least one resin chamber; a piston in communication with each resin chamber to force the resin through the at least one channel into the at least one mold cavity; and a device to drive the piston; further comprising at least one pressure transducer connected to at least one channel and positioned to determine the pressure in the channel. A method for encapsulating electrical components comprising placing resin into a chamber of a molding device; applying an compressive force to the resin to force the resin through channels into mold cavities; measuring the pressure in at least one channel using a pressure transducer; determining the amount of compressive force to apply to the resin based on the pressure measured by the pressure transducer; and adjusting the compressive force based thereon.

US Patent:

20130250486, Sep 26, 2013

Filed:

May 15, 2013

Appl. No.:

13/894679

Inventors:

Jeffrey Poltorak - Simpsonville SC, US
Philip M. Lessner - Simpsonville SC, US
Yongjian Qiu - Simpsonville SC, US
Randolph S. Hahn - Simpsonville SC, US
David Jacobs - Simpsonville SC, US
Keith R. Brenneman - Simpsonville SC, US
Albert K. Harrington - Simpsonville SC, US
Chris Stolarski - Simpsonville SC, US

Assignee:

Kemet Electronics Corporation - Simpsonville SC

International Classification:

H01G 9/15
H01G 9/00

US Classification:

361528, 29 2503

Abstract:

An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

US Patent:

20210057167, Feb 25, 2021

Filed:

Nov 5, 2020

Appl. No.:

17/089875

Inventors:

- Fort Lauderdale FL, US
Randolph S. Hahn - Simpsonville SC, US
David Jacobs - Simpsonville SC, US
Brandon Summey - Simpsonville SC, US

International Classification:

H01G 9/10
H01G 9/00
H01G 9/15
H01G 9/04
H01G 9/042

Abstract:

An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

US Patent:

20160329156, Nov 10, 2016

Filed:

Apr 4, 2016

Appl. No.:

15/090165

Inventors:

- Simpsonville SC, US
Randolph S. Hahn - Simpsonville SC, US
David Jacobs - Simpsonville SC, US
Brandon Summey - Simpsonville SC, US

International Classification:

H01G 9/10
H01G 9/042
H01G 9/04
H01G 9/00
H01G 9/15

Abstract:

An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.