David R Mccoy

US Patent:

20110022972, Jan 27, 2011

Filed:

Jul 24, 2009

Appl. No.:

12/508925

Inventors:

David F. McCoy - Garland TX, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

G06F 3/048

US Classification:

715764

Abstract:

A method for facilitating interactive review of data includes receiving multiple examples of a target associated with a set of data; comparing the examples of the target to the set of data to identify multiple potential matches; assigning, for each respective potential match, a priority value to the respective potential match based on a comparison of the examples of the target to the respective potential match; displaying the potential matches in a first display area, wherein the first display area organizes the potential matches according to the priority value assigned to each respective potential match; receiving a selection of at least one of the potential matches displayed in the first display area; and displaying, in response to the selection, the selected potential matches in a second display area, wherein the second display area organizes the selected potential matches according to a relationship between the selected potential matches.

US Patent:

20190043747, Feb 7, 2019

Filed:

Apr 2, 2016

Appl. No.:

16/075095

Inventors:

- Santa Clara CA, US
Richard J. HARRIES - Chandler AZ, US
Robert L. SANKMAN - Phoenix AZ, US
David C. MCCOY - Phoenix AZ, US

International Classification:

H01L 21/683
H01L 23/31
H01L 23/48
H01L 23/538
H01L 21/56
H01L 23/00

Abstract:

Techniques and mechanisms for providing flexible packaged circuit structures. In an embodiment, a flexible circuit device includes first and second conductive contacts and an interconnect that is coupled between such conductive contacts. While the flexible circuit device is in a baseline (“flat”) configuration, a first side of the flexible circuit device extends at least in part in a flat plane, and a portion of the interconnect includes a point that, with respect to a distance from the flat plane, is a maximum or a minimum of the interconnect. A mold compound of a flexible package encapsulates the portion of the interconnect. In another embodiment, a range spanned by the interconnect along a line orthogonal to the flat plane is at least two times an average height of the interconnect.

US Patent:

20170269017, Sep 21, 2017

Filed:

Mar 18, 2016

Appl. No.:

15/075083

Inventors:

- Santa Clara CA, US
Rajendra C. DIAS - Phoenix AZ, US
David C. MCCOY - Phoenix AZ, US
Lars D. SKOGLUND - Chandler AZ, US
Vijay SUBRAMANIAN - Gilber AZ, US
Aleksander ALEKSOV - Chandler AZ, US
Pramod MALATKAR - Chandler AZ, US
Ravindranath V. MAHAJAN - Chandler AZ, US
Robert L. SANKMAN - Phoenix AZ, US

International Classification:

G01N 27/20

Abstract:

Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.