An apparatus for measuring a gap between a first mating surface of a first component and a second mating surface of a second component has a substrate. A plurality of capacitive sensors is coupled to the substrate. A controller is coupled to the plurality of capacitive sensors. The controller is used to select each individual capacitive sensor to measure the gap between the first mating surface of the first component and the second mating surface of the second component.
- Chicago IL, US Bela Laszlo Zold - Stanwood WA, US Peter H. Bui - Lynnwood WA, US David James Odendahl - Kirkland WA, US Frederick James Richter - Everett WA, US
International Classification:
G05B 19/19
Abstract:
A method and apparatus for machining a part for an assembly. First sensor data is acquired for a surface of a first part from a first sensor system. Second sensor data is acquired for a set of existing holes in a second part from a second sensor system. A surface model of the surface of the first part is generated using the first sensor data. First offset data is computed based on a nominal model of a third part that is nominally positioned relative to the surface model within a three-dimensional virtual environment. Second offset data is computed for the set of existing holes using the second sensor data. Overall offset data is generated using the first and second offset data, wherein the overall offset data is used to drill a set of holes in the third part for use in fastening the third part to the second part.
The Boeing Company - , US Rich H. Morihara - Bellevue WA, US David J. Odendahl - Kirkland WA, US Frederick J. Richter - Everett WA, US Chris Stedman - Bellevue WA, US Sidlaghatta N. Venkatesh - Renton WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
G06F 17/50
US Classification:
700 97
Abstract:
Manufacturing systems and methods are disclosed. In one example, a computer based system comprises a non-transitory computer readable memory, a processor, and logic instructions stored in the non-transitory computer readable memory. When executed by the processor, the logic instructions configure the processor to perform operations, comprising receiving a first digital map of a first component and a second digital map of a second component, defining a first surface on the first component and a second surface on the second component, wherein at least a portion of the first surface is to adjoin at least a portion of the second surface in a manufactured assembly, updating a first part definition for the first component to include the first surface and, optionally, updating a second part definition for the second component to include the second surface.
David Odendahl (1976-1980), Denise Dyar (1977-1981), Jan Batty (1982-1986), Cheryl Hyduk (1978-1982), Peter Cianci (1982-1986), Matthew Noppenberger (1984-1988)
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