David A Randolph

US Patent:

20220190179, Jun 16, 2022

Filed:

Dec 6, 2021

Appl. No.:

17/543438

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Douglas Rose - Vista CA, US
Lewis Abra - San Francisco CA, US

International Classification:

H01L 31/05
H01L 31/02
H01L 31/18

Abstract:

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

US Patent:

20190312157, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377053

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Boris Bastien - Monte Sereno CA, US

International Classification:

H01L 31/02
H01L 31/18

Abstract:

A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.

US Patent:

20190312163, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377000

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Marc Robinson - Cedar Park TX, US
Paul W. Loscutoff - Castro Valley CA, US
Ryan Reagan - Hayward CA, US
David Okawa - Redwood City CA, US
Tamir Lance - Los Gatos CA, US
Thierry Nguyen - San Francisco CA, US

International Classification:

H01L 31/0465
H01L 31/049
H01L 31/0475

Abstract:

Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

US Patent:

20190312166, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377074

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
David C. Okawa - Redwood City CA, US
David F. Kavulak - Fremont CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Richard Hamilton Sewell - Los Altos CA, US
Ryan Reagan - Hayward CA, US
Tamir Lance - Los Gatos CA, US
Thierry Nguyen - San Francisco CA, US

International Classification:

H01L 31/05
H01L 31/0224
H01L 31/068
H01L 31/18
H02S 40/34

Abstract:

A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.

US Patent:

20190305167, Oct 3, 2019

Filed:

Mar 29, 2019

Appl. No.:

16/370422

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Douglas Rose - Vista CA, US
Lewis Abra - San Francisco CA, US

International Classification:

H01L 31/05
H01L 31/18
H01L 31/02

Abstract:

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

US Patent:

20190074400, Mar 7, 2019

Filed:

Oct 29, 2018

Appl. No.:

16/174030

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US

International Classification:

H01L 31/18
H01L 21/02
H01L 31/05

Abstract:

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.

US Patent:

20180097141, Apr 5, 2018

Filed:

Sep 30, 2016

Appl. No.:

15/283249

Inventors:

- SAN JOSE CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US

International Classification:

H01L 31/18
H01L 31/05

Abstract:

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.

US Patent:

20180006170, Jan 4, 2018

Filed:

Jul 1, 2016

Appl. No.:

15/201324

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US
Todd Richards Johnson - San Jose CA, US
Michael Cudzinovic - Sunnyvale CA, US

International Classification:

H01L 31/0224
H01L 31/0216
H01L 31/0236
H01L 31/0232
H01L 31/18
H01L 31/068

Abstract:

Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.