David M Randolph

US Patent:

20200313016, Oct 1, 2020

Filed:

Mar 27, 2020

Appl. No.:

16/832762

Inventors:

- San Jose CA, US
Jeffrey El Cotter - San Jose CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Taeseok Kim - Pleasanton CA, US

International Classification:

H01L 31/048
H01L 31/077
H01L 31/18

Abstract:

A solar cell, and methods of fabricating said solar cell, are disclosed. The solar cell can include a first emitter region over a substrate, the first emitter region having a perimeter around a portion of the substrate. A first conductive contact is electrically coupled to the first emitter region at a location outside of the perimeter of the first emitter region.

US Patent:

20190312157, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377053

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Boris Bastien - Monte Sereno CA, US

International Classification:

H01L 31/02
H01L 31/18

Abstract:

A method for fabricating a solar cell and the and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, are described. The method can include: providing a solar cell having metal foil having first regions that are electrically connected to semiconductor regions on a substrate at a plurality of conductive contact structures, and second regions; locating a carrier sheet over the second regions; bonding the carrier sheet to the second regions; and removing the carrier sheet from the substrate to selectively remove the second regions of the metal foil.

US Patent:

20190312163, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377000

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Marc Robinson - Cedar Park TX, US
Paul W. Loscutoff - Castro Valley CA, US
Ryan Reagan - Hayward CA, US
David Okawa - Redwood City CA, US
Tamir Lance - Los Gatos CA, US
Thierry Nguyen - San Francisco CA, US

International Classification:

H01L 31/0465
H01L 31/049
H01L 31/0475

Abstract:

Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

US Patent:

20190312166, Oct 10, 2019

Filed:

Apr 5, 2019

Appl. No.:

16/377074

Inventors:

- San Jose CA, US
Benjamin I. Hsia - Fremont CA, US
David Aaron Randolph Barkhouse - Oakland CA, US
David C. Okawa - Redwood City CA, US
David F. Kavulak - Fremont CA, US
Lewis C. Abra - San Francisco CA, US
George G. Correos - Corralitos CA, US
Richard Hamilton Sewell - Los Altos CA, US
Ryan Reagan - Hayward CA, US
Tamir Lance - Los Gatos CA, US
Thierry Nguyen - San Francisco CA, US

International Classification:

H01L 31/05
H01L 31/0224
H01L 31/068
H01L 31/18
H02S 40/34

Abstract:

A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.

US Patent:

20190074400, Mar 7, 2019

Filed:

Oct 29, 2018

Appl. No.:

16/174030

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US

International Classification:

H01L 31/18
H01L 21/02
H01L 31/05

Abstract:

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.

US Patent:

20180097141, Apr 5, 2018

Filed:

Sep 30, 2016

Appl. No.:

15/283249

Inventors:

- SAN JOSE CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US

International Classification:

H01L 31/18
H01L 31/05

Abstract:

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.

US Patent:

20180006170, Jan 4, 2018

Filed:

Jul 1, 2016

Appl. No.:

15/201324

Inventors:

- San Jose CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US
Todd Richards Johnson - San Jose CA, US
Michael Cudzinovic - Sunnyvale CA, US

International Classification:

H01L 31/0224
H01L 31/0216
H01L 31/0236
H01L 31/0232
H01L 31/18
H01L 31/068

Abstract:

Methods of fabricating a solar cell including metallization techniques and resulting solar cells, are described. In an example, a first and second semiconductor regions can be formed in or above a substrate, where a separation region is disposed between the first and second semiconductor regions. A protective region can be formed over the separation region. A first metal layer can be formed over the substrate, where the protective region prevents and/or inhibits damage to the separation region during the formation of the first metal layer. Conductive contacts can be formed over the first and second semiconductor regions.

US Patent:

20160380122, Dec 29, 2016

Filed:

Jun 25, 2015

Appl. No.:

14/751095

Inventors:

Robert Woehl - San Jose CA, US
David Aaron Randolph Barkhouse - Menlo Park CA, US
Paul Loscutoff - Castro Valley CA, US

International Classification:

H01L 31/02
H01L 21/3213
H01L 31/18

Abstract:

Fabricating a semiconductor device can include forming a metal seed region over a substrate. The method can include forming a mask over a first portion of the metal seed region. The method can also include forming a metal region over the metal seed region and removing the mask. The method can include forming metal contact fingers on the semiconductor device, where the forming includes etching the first portion of the metal seed region with an etchant comprising an acid, an oxidizer and chloride ions.