David J Sanders

US Patent:

7615942, Nov 10, 2009

Filed:

Nov 14, 2006

Appl. No.:

11/599797

Inventors:

David M. Sanders - Livermore CA, US
Stephen Sampayan - Manteca CA, US
Kirk Slenes - Albuquerque NM, US
H. M. Stoller - Albuquerque NM, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA
TPL, Inc. - Albuquerque MN

International Classification:

H05H 9/00

US Classification:

315505, 315500, 156288

Abstract:

A linear accelerator having cast dielectric composite layers integrally formed with conductor electrodes in a solventless fabrication process, with the cast dielectric composite preferably having a nanoparticle filler in an organic polymer such as a thermosetting resin. By incorporating this cast dielectric composite the dielectric constant of critical insulating layers of the transmission lines of the accelerator are increased while simultaneously maintaining high dielectric strengths for the accelerator.

US Patent:

7624026, Nov 24, 2009

Filed:

Nov 21, 2001

Appl. No.:

09/990123

Inventors:

Albert R. DiPiero - Portland OR, US
David G. Sanders - Portland OR, US

Assignee:

The TriZetto Group, Inc. - Greenwood Village CO

International Classification:

G06Q 10/00

US Classification:

705 2, 705 4, 705 35, 235379

Abstract:

Techniques and apparatus for managing contributions to an accruable health spending account in an employer-sponsored plan offering a member an employer-funded defined contribution, at least one insurance premium option and the ability to specify an allocation of the defined contribution for payment of option premiums and, in turn, a directed contribution amount designated to such accruable account are disclosed. The accruable account may be used to reimburse the member for qualified medical expenses, and the member may pay any premium shortfall using a tax-advantaged process such as a premium only payment plan. Also disclosed are techniques and apparatus directed to presenting member-specific out-of-pocket expenses for a selected procedure offered by at least one health-care provider.

US Patent:

7893541, Feb 22, 2011

Filed:

Oct 24, 2006

Appl. No.:

11/586468

Inventors:

George J. Caporaso - Livermore CA, US
Stephen E. Sampayan - Manteca CA, US
James S. Sullivan - Livermore CA, US
David M. Sanders - Livermore CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257778, 257 82, 257433

Abstract:

An improved photoconductive switch having a SiC or other wide band gap substrate material, such as GaAs and field-grading liners composed of preferably SiN formed on the substrate adjacent the electrode perimeters or adjacent the substrate perimeters for grading the electric fields.

US Patent:

8125089, Feb 28, 2012

Filed:

Nov 23, 2010

Appl. No.:

12/952949

Inventors:

George J. Caporaso - Livermore CA, US
Stephen E. Sampayan - Manteca CA, US
James S. Sullivan - Livermore CA, US
David M. Sanders - Livermore CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257778, 257 82, 257433

Abstract:

An improved photoconductive switch having a SIC or other wide band gap substrate material, such as GaAs and field-grading liners composed of preferably SiN formed on the substrate adjacent the electrode perimeters or adjacent the substrate perimeters for grading the electric fields.

US Patent:

8214230, Jul 3, 2012

Filed:

Oct 9, 2009

Appl. No.:

12/576985

Inventors:

Albert R. DiPiero - Portland OR, US
David G. Sanders - Portland OR, US

Assignee:

The TriZetto Group, Inc. - Greenwood Village CO

International Classification:

G06Q 10/00

US Classification:

705 2, 705 4, 705 35, 705 36 R, 235379

Abstract:

Techniques and apparatus for managing contributions to an accruable health spending account in an employer-sponsored plan offering a member an employer-funded defined contribution, at least one insurance premium option and the ability to specify an allocation of the defined contribution for payment of option premiums and, in turn, a directed contribution amount designated to such accruable account are disclosed. The accruable account may be used to reimburse the member for qualified medical expenses, and the member may pay any premium shortfall using a tax-advantaged process such as a premium only payment plan. Also disclosed are techniques and apparatus directed to presenting member-specific out-of-pocket expenses for a selected procedure offered by at least one health-care provider.

US Patent:

20120082411, Apr 5, 2012

Filed:

Jun 28, 2011

Appl. No.:

13/171372

Inventors:

James S. Sullivan - Livermore CA, US
David M. Sanders - Livermore CA, US
Steven A. Hawkins - Livermore CA, US
Stephen A. Sampayan - Manteca CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

G02B 6/12

US Classification:

385 14

Abstract:

A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces, and at least one light-input surface. First metallic layers are formed on the electrode-interface surfaces, and one or more optical waveguides having input and output ends are bonded to the substrate so that the output end of each waveguide is bonded to a corresponding one of the light-input surfaces of the photo-conductive substrate. This forms a waveguide-substrate interface for coupling light into the photo-conductive wafer. A dielectric material such as epoxy is then used to encapsulate the photo-conductive substrate and optical waveguide so that only the metallic layers and the input end of the optical waveguide are exposed. Second metallic layers are then formed on the first metallic layers so that the waveguide-substrate interface is positioned under the second metallic layers.

US Patent:

20120271776, Oct 25, 2012

Filed:

Jun 28, 2012

Appl. No.:

13/535549

Inventors:

Albert R. DiPiero - Portland OR, US
David G. Sanders - Portland OR, US

International Classification:

G06Q 10/06

US Classification:

705322

Abstract:

Techniques and apparatus for managing contributions to an accruable health spending account in an employer-sponsored plan offering a member an employer-funded defined contribution, at least one insurance premium option and the ability to specify an allocation of the defined contribution for payment of option premiums and in turn, a directed contribution amount designated to such accruable account are disclosed. The accruable account may be used to reimburse the member for qualified medical expenses, and the member may pay any premium shortfall using a tax-advantaged process such as a premium only payment plan. Also disclosed are techniques and apparatus directed to presenting member-specific out-of-pocket expenses for a selected procedure offered by at least one health-care provider.

US Patent:

20130056842, Mar 7, 2013

Filed:

Oct 22, 2012

Appl. No.:

13/657746

Inventors:

Lawrence Livermore National Security, LLC - Livermore CA, US
David M. Sanders - Livermore CA, US
Steven A. Hawkins - Livermore CA, US
Stephen A. Sampayan - Manteca CA, US

Assignee:

Lawrence Livermore National Security, LLC - Livermore CA

International Classification:

H01L 31/0232
H01L 31/18

US Classification:

257432, 438 65, 257E31127, 257E31117

Abstract:

A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.