David A Schroeder

US Patent:

6560710, May 6, 2003

Filed:

May 14, 1999

Appl. No.:

09/313553

Inventors:

Roger Leyden - Willow Springs IL
Peter Passuntino - Wheaton IL
David Schroeder - Elmhurst IL

Assignee:

Se-Kure Controls, Inc. - Franklin Park IL

International Classification:

G08B 1314

US Classification:

713200, 340572, 340568

Abstract:

The combination of an article to be monitored and a security system. The article to be monitored has a first component and a second component projecting angularly from the first component. The security system has a base and a cover movable guidingly relative to the base between first and second positions. The cover has a first opening through which the second component projects. The cover defines a receptacle for the first component with the second component projecting through the first opening. The cover has an entry opening which allows a) the second component to be selectively projected through and withdrawn from the first opening and b) the first component to be selectively placed in and removed from the receptacle with the cover in the first position. The base and cover cooperatively prevent c) the second component from being withdrawn from the first opening and d) the first component from being removed from the receptacle with the cover in the second position. The security system further includes a lock assembly which interconnects between the base and cover and is placeable selectively in locked and released states.

US Patent:

6612911, Sep 2, 2003

Filed:

Jan 11, 2002

Appl. No.:

10/044174

Inventors:

Phillip Carter - Naperville IL
Gregory H. Bogush - Aurora IL
Francesco M. De Rege - Naperville IL
Jeffrey P. Chamberlain - Aurora IL
David J. Schroeder - Aurora IL
Brian L. Mueller - Middleton DE

Assignee:

Cabot Microelectronics Corporation - Aurora IL

International Classification:

B24B 1900

US Classification:

451 41, 451 36, 451287, 51295, 51308

Abstract:

The invention provides a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, wherein the total ion concentration of the system is above the critical coagulation concentration. The invention also provides a method of planarizing or polishing a composite substrate comprising contacting the substrate with a the aforementioned polishing system or a polishing system comprising (a) a liquid carrier, (b) an alkali metal ion, (c) a compound comprising an amine group and at least one polar moiety, wherein the polar moiety contains at least one oxygen atom, and (d) a polishing pad and/or an abrasive, and polishing at least a portion of the substrate therewith in about 6 hours or less after the polishing system is prepared.

US Patent:

6726534, Apr 27, 2004

Filed:

Feb 28, 2002

Appl. No.:

10/085698

Inventors:

Gregory H. Bogush - Aurora IL
Jeffrey P. Chamberlain - Aurora IL
Paul M. Feeney - Aurora IL
Brian L. Mueller - Middleton DE
David J. Schroeder - Aurora IL
Alicia F. Walters - Naperville IL

Assignee:

Cabot Microelectronics Corporation - Aurora IL

International Classification:

B24B 100

US Classification:

451 36, 451 41, 451 59, 451 63, 451550, 51308, 51309

Abstract:

The invention provides a polishing system that comprises a liquid carrier, an alkali metal ion, hydroxide ions, and a polishing pad and/or an abrasive. The abrasive can be dispersed in the liquid carrier of the polishing system or bound to the polishing pad. The alkali metal ion can be any univalent group I metal ion and is present in the polishing system at a concentration of about 0. 05 M or more. Hydroxide ions are present in a sufficient amount to provide the system with a pH of about 9 or more. The liquid carrier of the polishing system can be any suitable polar solvent, such as water. The invention further provides a polishing method that involves polishing a portion of a substrate with the polishing system beginning about 6 hours or less after the polishing system is prepared.

US Patent:

6821897, Nov 23, 2004

Filed:

Sep 18, 2002

Appl. No.:

10/246280

Inventors:

David J. Schroeder - Aurora IL
Phillip Carter - Naperville IL
Jeffrey P. Chamberlain - Aurora IL
Kyle Miller - Oswego IL
Isaac K. Cherian - Aurora IL

Assignee:

Cabot Microelectronics Corporation - Aurora IL

International Classification:

H01L 2144

US Classification:

438692, 438691, 438693

Abstract:

The invention provides a method of polishing a substrate comprising a metal layer comprising copper. The method comprises the steps of (i) providing a chemical-mechanical polishing system comprising a liquid carrier, a polishing pad, an abrasive, and a negatively-charged polymer or copolymer, (ii) contacting the substrate with the poloshing system, and (iii) abrading at least a portion of the substrate to polish the metal layer of the substrate. The negatively-charged polymer or copolymer comprises one or more monomers selected from sulfonic acids, sulfonates, sulfates, phosphonic acids, phosphonates, and phosphates, has a molecular weight of about 20,000 g/mol or more, and coats at least a portion of the abrasive such that the abrasive has a zeta potential value that is lowered upon interaction of the negatively-charged polymer or copolymer with the abrasive.

US Patent:

D507192, Jul 12, 2005

Filed:

Mar 23, 2004

Appl. No.:

29/201951

Inventors:

David Harvey Schroeder - Glen Ellyn IL, US
Russell Edward Schroeder - Horicon WI, US

International Classification:

1004

US Classification:

D10 60

US Patent:

6936543, Aug 30, 2005

Filed:

Oct 11, 2002

Appl. No.:

10/269864

Inventors:

David J. Schroeder - Aurora IL, US
Kevin J. Moeggenborg - Naperville IL, US
Homer Chou - Hoffman Estates IL, US
Jeffrey P. Chamberlain - Aurora IL, US
Joseph D. Hawkins - Aurora IL, US
Phillip Carter - Naperville IL, US

Assignee:

Cabot Microelectronics Corporation - Aurora IL

International Classification:

H01L021/302
C09K013/00

US Classification:

438692, 252 791, 252 794

Abstract:

The invention provides methods of polishing a substrate comprising (i) contacting a substrate comprising at least one metal layer comprising copper with a chemical-mechanical polishing (CMP) system and (ii) abrading at least a portion of the metal layer comprising copper to polish the substrate. The CMP system comprises (a) an abrasive, (b) an amphiphilic nonionic surfactant, (c) a means for oxidizing the metal layer, (d) an organic acid, (e) a corrosion inhibitor, and (f) a liquid carrier. The invention further provides a two-step method of polishing a substrate comprising a first metal layer and a second, different metal layer. The first metal layer is polishing with a first CMP system comprising an abrasive and a liquid carrier, and the second metal layer is polished with a second CMP system comprising (a) an abrasive, (b) an amphiphilic nonionic surfactant, and (c) a liquid carrier.

US Patent:

7091604, Aug 15, 2006

Filed:

Jun 4, 2004

Appl. No.:

10/861007

Inventors:

Ian W. Wylie - Naperville IL, US
Heinz H. Busta - Park Ridge IL, US
David J. Schroeder - Aurora IL, US
J. Scott Steckenrider - Plainfield IL, US
Yuchun Wang - Naperville IL, US

Assignee:

Cabot Microelectronics Corporation - Aurora IL

International Classification:

H01L 23/34

US Classification:

257713, 257278, 257706, 257712, 257714, 257715, 257716, 257717, 257721, 257E2308, 257E23082, 257E23097, 257E23098, 257E23099, 257E23101

Abstract:

A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more electrically connected integrated circuits, separated by a cooling channel.

US Patent:

D535875, Jan 30, 2007

Filed:

Nov 22, 2005

Appl. No.:

29/243247

Inventors:

Gary Herbert Carmichael - Des Plaines IL, US
Christopher Wright Dunkle - Chicago IL, US
Craig T. Wilkie - Marietta GA, US
David Allan Schroeder - Lombard IL, US
James Belcastro - Park Ridge IL, US

Assignee:

Kraft Foods Holdings, Inc. - Northfield IL

International Classification:

0903

US Classification:

D 9432