Paul J. Sullivan - Sunnyvale CA George Kren - Los Altos Hills CA Rodney C. Smedt - Los Gatos CA Hans J. Hansen - Pleasanton CA David W. Shortt - Milpitas CA Daniel Ivanov Kavaldjiev - Santa Clara CA Christopher F. Bevis - Mountain View CA
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 2188
US Classification:
3562375, 3562372, 3562373, 382145
Abstract:
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.
Method And Apparatus For Scanning, Stitching, And Damping Measurements Of A Double-Sided Metrology Inspection Tool
Paul J. Sullivan - Sunnyvale CA George Kren - Los Altos Hills CA Rodney C. Smedt - Los Gatos CA Hans J. Hansen - Pleasanton CA David W. Shortt - Milpitas CA Daniel Ivanov Kavaldjiev - Santa Clara CA Christopher F. Bevis - Mountain View CA
Assignee:
KLA-Tencor Corporation - San Jose CA
International Classification:
G01N 2184
US Classification:
3562374, 3562375, 3562372
Abstract:
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.
Process For Identifying Defects In A Substrate Having Non-Uniform Surface Properties
George J. Kren - Los Altos Hills CA Mehdi Vaez-Iravani - Los Gatos CA David W. Shortt - Milpitas CA
Assignee:
KLA-Tencor Technologies Corporation - San Jose CA
International Classification:
G01N 2100
US Classification:
3562374, 3562372, 3562371, 356394
Abstract:
A surface inspection method of the invention includes scanning an inspection surface taking surface measurements. Determinations of various noise levels in the surface are made based on variations in the surface measurements. A dynamic threshold is then determined. The dynamic threshold adapts to the noise levels in the inspection surface to provide a varying threshold that can provide areas of high and low defect sensitivity on the same inspection surface. Defects are then identified by comparing surface measurements with the dynamic threshold. Additionally, the invention includes a surface inspection method that uses signal-to-noise ratios to identify defects. Such a method scans an inspection surface to obtain surface measurements. Noise levels associated with the inspection surface are then determined. Signal-to-noise ratios are determined for the surface measurements.
Darkfield Inspection System Having A Programmable Light Selection Array
Christopher F. Bevis - Los Gatos CA, US Paul J. Sullivan - Campbell CA, US David W. Shortt - Milpitas CA, US George J. Kren - Los Altos Hills CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 21/88
US Classification:
3562375
Abstract:
An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.
Method And Apparatus For Scanning, Stitching, And Damping Measurements Of A Double-Sided Metrology Inspection Tool
Paul J. Sullivan - Sunnyvale CA, US George Kren - Los Altos Hills CA, US Rodney C. Smedt - Los Gatos CA, US Hans J. Hansen - Pleasanton CA, US David W. Shortt - Milpitas CA, US Daniel Ivanov Kavaldjiev - Santa Clara CA, US Christopher F. Bevis - Mountain View CA, US
Assignee:
KLA-Tencor Corporation - San Jose CA
International Classification:
G01N 21/84
US Classification:
3562374, 3562375, 3562372
Abstract:
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.
Darkfield Inspection System Having Photodetector Array
Christopher F. Bevis - Los Gatos CA, US David W. Shortt - Milpitas CA, US
Assignee:
KLA-Tencor Technologies Corporation - San Jose CA
International Classification:
G01N 21/00
US Classification:
3562371, 3562374, 3562375
Abstract:
A darkfield surface inspection tool of the invention includes an illumination source for illuminating a workpiece and generating a light scattering pattern. The light scattering pattern being configured such that the positions of the light beams of the scattering pattern are uniquely related to the scattering angles of the light beams as they are scattered from the workpiece. The tool also includes a photodetector array positioned at a detector surface to detect the light scattering pattern as it reaches the detector surface. The photodetector array produces an electrical signal that is received by signal processing electronics of the tool and can be used to characterize defects on the workpiece. The invention also includes darkfield surface inspection methods.
Surface Inspection System And Method For Using Photo Detector Array To Detect Defects In Inspection Surface
A dark field surface inspection tool of the invention includes an illumination source for directing a light beam onto a work piece. The tool includes a scanning element for enabling selected inspection points on the work piece to be scanned by the light beam. During scanning, the light scattered by each inspection point generates light scattering patterns associated with the surface characteristics of the scanned inspection point. The tool includes a photo detector array having photosensitive elements arranged to receive light from the light scattering pattern, thereby capturing an image of the light scattering pattern for each inspection point. Comparison circuitry is included for comparing light scattering patterns with a reference image to enable the identification of defects at the inspection point. The invention also includes a dark field surface inspection method comprising illuminating an inspection surface with a light beam, capturing images of light scattered from the inspection surface and comparing those images with suitable reference images to detect defects in the inspection surface.
Darkfield Inspection System Having A Programmable Light Selection Array
Christopher F. Bevis - Los Gatos CA, US Paul J. Sullivan - Campbell CA, US David W. Shortt - Milpitas CA, US George J. Kren - Los Altos Hills CA, US
Assignee:
KLA-Tencor Technologies Corporation - Milpitas CA
International Classification:
G01N 21/88
US Classification:
3562375
Abstract:
An inspection tool embodiment includes an illumination source for directing a light beam onto a workpiece to generate scattered light that includes the ordinary scattering pattern of the workpiece as well as light scattered from defects of the workpiece. The embodiment includes a programmable light selection array that receives light scattered from the workpiece and selectively directs the light scattered from defects onto a photosensor which detects the defect signal. Processing circuitry receives the defect signal and conducts surface analysis of the workpiece that can include the characterizing of defects of the workpiece. The programmable light selection arrays can include, but are not limited to, reflector arrays and filter arrays. The invention also includes associated surface inspection methods.