David Wayne Walter
age ~65
from Anna, TX
- Also known as:
-
- David W Walter
- David M Walter
- Dave W Walter
- Lauren Walter
- Michelle Walter
- Walter Dave
David Walter Phones & Addresses
- Anna, TX
- Charleston, SC
- Manhattan, KS
- Frederick, MD
- 2821 Fox Pointe Cir, Wichita, KS 67226 • (316)6309520 • (316)6309521 • (316)6365901
- Posen, IL
- Hartford, CT
Wikipedia
David Walter (journalist)
view sourceDavid Charles Walter (1 February 1948 - 29 March 2012), was a British journalist and a former Political Correspondent for Independent Television News, the...
ISBN #
16
David Walter
view sourceDavid Walter. From Wikipedia, the free encyclopedia. Jump to: navigation, search. David Walter may refer to: Dave Walter (born 1964), American football...
ISBN #
6
Name / Title
Company / Classification
Phones & Addresses
CEO
Carenow Physical Therapy
Intermediate Care Facilities
Intermediate Care Facilities
14856 Preston Rd, Dallas, TX 75254
President
Carenow Inc
Management Consulting · Medical Doctor's Office
Management Consulting · Medical Doctor's Office
PO Box 260888, Plano, TX 75026
3821 W Spg Crk Pkwy, Plano, TX 75023
3821 W Spg Crk Pkwy, Plano, TX 75023
Governing Person
Heartland Realty Investors, Inc
Apartment Building Operator Nonresidential Building Operator Real Estate Agent/Manager · Apartment Building Operator
Apartment Building Operator Nonresidential Building Operator Real Estate Agent/Manager · Apartment Building Operator
(612)8236275
THE DAVID P. AND NANCY M. WALTER FAMILY LIMITED PARTNERSHIP
REBELTEK, LLC
2608 WARRENSVILLE LLC
WALTER PLUMBING LLC
WALTERWERKS LTD
License Records
David E Walter
License #:
AB041280A - Expired
Category:
Real Estate Commission
Type:
Associate Broker (AB)-Standard
David E Walter
License #:
RS095577A - Expired
Category:
Real Estate Commission
Type:
Real Estate Salesperson-Standard
Resumes
David Walter O'Fallon, MO
view sourceWork:
Deutsche Precision
2013 to 2000
CNC Operator Total Lock & Security
St. Louis, MO
Sep 2011 to Mar 2013
Installer/Dispatch Midwest Petroleum
O'Fallon, MO
Apr 2008 to Sep 2011
Assistant Manager
2013 to 2000
CNC Operator Total Lock & Security
St. Louis, MO
Sep 2011 to Mar 2013
Installer/Dispatch Midwest Petroleum
O'Fallon, MO
Apr 2008 to Sep 2011
Assistant Manager
Education:
Ranken Technical College
2014
Certificate in Precision MachiningTechnology Saint Louis Community College
May 1984
General Studies, Business Southeast Missouri State University
Southeast, Missouri, US
May 1983
General Studies, Computer Science
2014
Certificate in Precision MachiningTechnology Saint Louis Community College
May 1984
General Studies, Business Southeast Missouri State University
Southeast, Missouri, US
May 1983
General Studies, Computer Science
David Walter Tulsa, OK
view sourceWork:
CCC Group
Salt Lake City, UT
Oct 2013 to Aug 2014
Pipe/Structural Welder CCC Group
San Antonio, TX
Jan 2013 to Oct 2013
Iron Worker/Welder Midwest Erectors
Plano, TX
Jul 2012 to Dec 2012
Iron Worker Rigger
Salt Lake City, UT
Mar 2008 to Jul 2012
Iron Worker
Salt Lake City, UT
Oct 2013 to Aug 2014
Pipe/Structural Welder CCC Group
San Antonio, TX
Jan 2013 to Oct 2013
Iron Worker/Welder Midwest Erectors
Plano, TX
Jul 2012 to Dec 2012
Iron Worker Rigger
Salt Lake City, UT
Mar 2008 to Jul 2012
Iron Worker
Education:
Tulsa Welding School
Tulsa, OK
2015
High School Diploma Wright Junior Senior High School
Wright, WY
Tulsa, OK
2015
High School Diploma Wright Junior Senior High School
Wright, WY
Medicine Doctors
David S. Walter
view sourceSpecialties:
Family Medicine
Work:
Integrated Health AssociatesIHA After Hours Care
4200 Whitehall Dr STE 150, Ann Arbor, MI 48105
(734)9950308 (phone), (734)9950425 (fax)
4200 Whitehall Dr STE 150, Ann Arbor, MI 48105
(734)9950308 (phone), (734)9950425 (fax)
Languages:
English
Description:
Dr. Walter works in Ann Arbor, MI and specializes in Family Medicine.
David Scott Walter
view sourceSpecialties:
Family Medicine
Education:
Wayne State University (1985)
David Leland Walter
view sourceSpecialties:
Dermatology
Dermatopathology
Dermatopathology
Dermatopathology
Dermatopathology
Education:
The Ohio State University(1971)
Isbn (Books And Publications)
Amazon
Dragonwarrior: Tao of Shadow (The Dragonwarrior series)
view sourceJonathon's ordinary life in modern-day Scotland is haunted by dreams of warrior mystics from Ancient China. The dreams increasingly manifest themselves in his life, helping him to fight off attackers with martial arts he has never learned, allowing him to read a Chinese language he has never seen be...
Author
David Walters
Binding
Kindle Edition
Pages
296
Publisher
Posse Publishing
ISBN #
10
Mites: Ecology, Evolution & Behaviour: Life at a Microscale
view sourceMore than 40,000 species of mites have been described, and up to 1 million may exist on earth. These tiny arachnids play many ecological roles including acting as vectors of disease, vital players in soil formation, and important agents of biological control. But despite the grand diversity of mites...
Author
David Evans Walter, Heather Proctor
Binding
Hardcover
Pages
350
Publisher
Springer
ISBN #
9400771630
EAN Code
9789400771635
ISBN #
7
One Stood Tall
view sourceOutlaw Ned Taylor has come to town and killed the saloon owner and the town sheriff. The first steps in his plan to take over the town. There is no one who can stop him. That is until a drifter comes down from the mountains. Now only one man stands in the way of Ned Taylor and that one man must die.
Author
David C. Walters
Binding
Kindle Edition
Pages
24
ISBN #
6
Midnight Zone: Contemporary Romance with a Sensual Twist
view sourceSix epic adult stories of erotic encounters, sensual fulfillment, and romantic mystery. Foreplay in literary form, each story will delight your sensual senses and awaken desire...each with a intriguing twist or surprise.
Author
Walter David
Binding
Kindle Edition
Pages
135
Publisher
Synergy Books Publishing
ISBN #
9
Big John Terry
view sourceHunted for a murder he didn't commit John must defend his life from the men who have come to kill him. He must survive if he wants to enjoy the love from the woman he has spent his whole life searching for.
Author
David C. Walters
Binding
Kindle Edition
Pages
74
ISBN #
8
Being a Christian: a Study Book for Children
view sourceAn exciting Bible Study book, teaching children and teens, how to become a Christian and can be used to witness to their friends. This book is also available in Spanish.
Author
David Walters
Binding
Paperback
Pages
38
Publisher
Good News Fellowship Ministries
ISBN #
0962955922
EAN Code
9780962955921
ISBN #
4
Fact or Fantasy: a Study in Christian Apologetics for Children
view sourceA children's and teen's Bible Study book on Simple Christian Apologetic's (defend your faith). It helps answer the questions your friends ask you about what you believe.
Author
David Walters
Binding
Paperback
Pages
44
Publisher
Good News Fellowship Ministries
ISBN #
0962955906
EAN Code
9780962955907
ISBN #
3
Fruit of the Spirit: a Children's Bible Study of Galatians 5:22
view sourceAn exciting Bible Study book, teaching children and teens, how to be fruitful Christians. It is a study of Gal 5:22.
Author
David Walters
Binding
Paperback
Pages
44
Publisher
Good News Fellowship Ministries
ISBN #
0962955930
EAN Code
9780962955938
ISBN #
2
Us Patents
-
Multi-Chip Integrated Circuit Module
view source -
US Patent:6400573, Jun 4, 2002
-
Filed:Oct 30, 1997
-
Appl. No.:08/960994
-
Inventors:Larry J. Mowatt - Allen TX
David Walter - Richardson TX -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H05K 720
-
US Classification:361719, 174252, 257724, 361764, 361795
-
Abstract:A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer ( ) having a hole ( ) disposed therein for receiving an integrated circuit chip die ( ). A lower core laminate layer ( ) having a conductive layer ( ) and conductive layer ( ) disposed on opposite sides thereof is laminated to the lower surface of the layer ( ). Plated-through holes ( ), ( ) and ( ) are formed through the two layers ( ) and ( ) to connect the conductive layer ( ) with a conductive layer ( ) on the upper surface of the layer ( ). A high-density interconnect layer includes two laminate layers ( ) and ( ), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer ( ) allow for connections from the die ( ) to the conductive layer ( ). The via interconnect structures formed in the layer ( ) allow interconnection from the upper surface of layer ( ) to via interconnects formed in the layer ( ).
-
Hid Land Grid Array Packaged Device Having Electrical And Optical Interconnects
view source -
US Patent:6707124, Mar 16, 2004
-
Filed:Feb 16, 2001
-
Appl. No.:09/788075
-
Inventors:Kurt P. Wachtler - Richardson TX
David N. Walter - Richardson TX
Larry J. Mowatt - Allen TX -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H01L 310203
-
US Classification:257433, 257432, 257434, 257435, 257668, 257678, 257711, 257774, 257700
-
Abstract:A high density interconnect device which creates a thin, electrically and thermally high performance package for semiconductor devices having a mechanically stable and high thermal conductivity substrate. Cavities in the substrate accommodate semiconductor devices attached directly to the substrate. The semiconductor devices include at least one optical receiver and/or transmitter. A thin film overlay having multiple layers interconnects the semiconductor devices to an array of pads on a surface of the thin film overlay facing away from the substrate. Connectors are attached to the pads to provide direct electrical and mechanical attachment to other system hardware. In one embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay. In another embodiment, the optical receiver and/or transmitter receives and/or transmits light signals through holes formed through the thin film overlay. The holes may be back filled with an optical quality material.
-
Array Molded Package-On-Package Having Redistribution Lines
view source -
US Patent:7944034, May 17, 2011
-
Filed:Jun 22, 2007
-
Appl. No.:11/767294
-
Inventors:Mark A. Gerber - Lucas TX, US
David N. Walter - Dallas TX, US -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H01L 23/48
H01L 23/12
B05C 13/00
B22D 19/08 -
US Classification:257686, 257E2301, 257E23003, 257E23021, 257E23124, 257E21504, 257E21511, 257778, 257723, 257777, 257680, 257774, 257773
-
Abstract:A semiconductor device with a sheet-like insulating substrate () integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads () in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures () at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material () to contact the pads. Metal-filled surface grooves () in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.
-
Array-Molded Package-On-Package Having Redistribution Lines
view source -
US Patent:8304285, Nov 6, 2012
-
Filed:Apr 5, 2011
-
Appl. No.:13/080435
-
Inventors:Mark A Gerber - Lucas TX, US
David N Walter - Dallas TX, US -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H01L 21/60
-
US Classification:438108, 438107, 438113, 438127, 257680, 257777, 257E21511
-
Abstract:A semiconductor device with a sheet-like insulating substrate () integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads () in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures () at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material () to contact the pads. Metal-filled surface grooves () in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.
-
Method For Fabricating Array-Molded Package-On-Package
view source -
US Patent:20080284045, Nov 20, 2008
-
Filed:May 18, 2007
-
Appl. No.:11/750757
-
Inventors:Mark A. Gerber - Plano TX, US
David N. Walter - Dallas TX, US -
Assignee:TEXAS INSTRUMENTS INCORPORATED - Dallas TX
-
International Classification:H01L 23/48
B05C 13/00
H01L 21/58 -
US Classification:257778, 118503, 438108, 257E2301, 257E21505
-
Abstract:A method and apparatus for fabricating a semiconductor device are disclosed. The method attaches semiconductor chips () on a sheet-like insulating substrate () integral with two or more patterned layers of conductive lines and vias and with contact pads () in pad locations. A mold is provided, which has a top portion () with metal protrusions () at locations matching the pad locations. The protrusions are shaped as truncated cones of a height suitable to approach the pad metal surface in the closed mold cavity. The substrate and the chip are loaded onto the bottom mold portion (); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions are aligned with the contact pads, approaching the pad surface. After pressuring encapsulation compound into the cavity, the mold is opened; the encapsulated device has apertures to the pad locations. Any residual compound formed on the pads is removed by laser, plasma, or chemical to expose the metal surface.
-
Method For Fabricating Array-Molded Package-On-Package
view source -
US Patent:20110165731, Jul 7, 2011
-
Filed:Mar 17, 2011
-
Appl. No.:13/050177
-
Inventors:Mark A. GERBER - Plano TX, US
David N. WALTER - Dallas TX, US -
Assignee:TEXAS INSTRUMENTS INCORPORATED - Dallas TX
-
International Classification:H01L 21/82
H01L 21/56
H01L 21/782 -
US Classification:438107, 438127, 438113, 257E21504, 257E21599, 257E21602
-
Abstract:An improved semiconductor device package is manufactured by attaching semiconductor chips () on an insulating substrate () having contact pads (). A mold is provided, which has a top portion () with metal protrusions () at locations matching the pad locations. The protrusions are shaped as truncated cones. The substrate and the chips are loaded onto the bottom mold portion (); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions approach the contact pads. Encapsulation compound is introduced into the cavity and the protrusions create apertures through the encapsulation compound towards the pad locations.
-
Hdi Land Grid Array Packaged Device Having Electrical And Optical Interconnects
view source -
US Patent:62743910, Aug 14, 2001
-
Filed:Oct 26, 1992
-
Appl. No.:7/966645
-
Inventors:Kurt P. Wachtler - Richardson TX
David N. Walter - Richardson TX
Larry J. Mowatt - Allen TX -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H01L 2100
H01L 2144
H01L 2148
H01L 2150 -
US Classification:438 6
-
Abstract:A high density interconnect land grid array package device combines various electronic packaging techniques in a unique way to create a very thin, electrically and thermally high performance package for single or multiple semiconductor devices. A thin and mechanically stable substrate or packaging material (12) is selected that also has high thermal conductivity. Cavities (14) in the substrate or packaging material (12) accommodate one or more semiconductor devices that are attached directly to the substrate or packaging material. At least one of said semiconductor devices includes at least one optical receiver and/or transmitter. A thin film overlay (18) having multiple layers interconnects the one or more semiconductor devices to an array of pads (20) on a surface of the thin film overlay facing away from the substrate or packaging material. Solder balls (22), conductive adhesive or elastomeric connectors are attached to the pads to provide direct electrical and mechanical attachment means to other system hardware. In one embodiment of the invention, the optical receiver and/or transmitter receives and/or transmits light signals through the thin film overlay.
-
Multi-Chip Integrated Circuit Module And Method For Fabrication Thereof
view source -
US Patent:53066707, Apr 26, 1994
-
Filed:Feb 9, 1993
-
Appl. No.:8/015510
-
Inventors:Larry J. Mowatt - Allen TX
David Walter - Richardson TX -
Assignee:Texas Instruments Incorporated - Dallas TX
-
International Classification:H01L 2160
-
US Classification:437209
-
Abstract:A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer (10) having a hole (14) disposed therein for receiving an integrated circuit chip die (56). A lower core laminate layer (16) having a conductive layer (18) and conductive layer (20) disposed on opposite sides thereof is laminated to the lower surface of the layer (10). Plated-through holes (36), (38) and (40) are formed through the two layers (10) and (16) to connect the conductive layer (20) with a conductive layer (12) on the upper surface of the layer (10). A high-density interconnect layer includes two laminate layers (126) and (138), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer (126) allow for connections from the die (56) to the conductive layer (12). The via interconnect structures formed in the layer (138) allow interconnection from the upper surface of layer (138) to via interconnects formed in the layer (126).
Lawyers & Attorneys
David Walter - Lawyer
view sourceOffice:
Baker & McKenzie
Specialties:
Dispute Resolution and Litigation
Insolvency & Corporate Restructuring
Dispute Resolution
Banking & Finance
Insolvency & Bankruptcy Litigation
Insolvency / Bankruptcy Advisory
Insolvency & Corporate Restructuring
Dispute Resolution
Banking & Finance
Insolvency & Bankruptcy Litigation
Insolvency / Bankruptcy Advisory
ISLN:
921128098
Admitted:
2004
University:
Macquarie University, B.B.A., 2003
Law School:
Macquarie University, LL.B., 2003; University of New South Wales, LL.M., 2004
Myspace
David Walter
view sourcePlaxo
David Walter
view source
david walter
view sourcePast: Director of Media Communications at Liberal Democrats, Correspondent/Presenter at BBC, ... Through his company First Take (www.first-takeuk.com) David Walter offers media, presentation and crisis training, speechwriting, webcasting and media... Through his company First Take (www.first-takeuk.com) David Walter offers media, presentation and crisis training, speechwriting, webcasting and media strategy. After a long career as a senior correspondent for ITN and the BBC, he now works with clients in the corporate, public and voluntary...
David Walters
view sourceDavid Walters
News
Turmoil in Asia Markets — Recap
view source- I think there are some opportunities without a doubt, the question is when do you dip a toe in, said David Walter, head of Asian research at fund-of-hedge-funds manager PAAMCO. Most people have got their helmet on, trying not to lose money at the moment.
- Date: Feb 12, 2016
- Category: Business
- Source: Google
JK Rowling novel tops fiction chart
view source- "By way of comparison, the latest phenomenon in the book trade, Fifty Shades of Grey, sold 664,000 in its highest week of sales so far," said David Walter from Nielsen BookScan, which has been monitoring book sales in the UK since 1998.
- Date: Oct 03, 2012
- Category: Entertainment
- Source: Google
Mylife
Youtube
Googleplus
David Walter
Work:
Proffessor Oak - The Very Best, that No One Ever Was (1994)
Education:
L'Anse Creuse
About:
Hi I'm David.
David Walter
Work:
Woods Hole Oceanographic Institution - Submarine Pilot
Education:
United States Naval Academy - Ocean Engineering
Relationship:
In_a_relationship
David Walter
Education:
Wilson Marriage - No Cool Skills, St Helena - Not Liking It
Tagline:
I wish I was a chestnut tree, nourished by the sun. With leaves and twigs and branches. And conkers by the ton.
David Walter
Work:
Pilot Travel Centers - Facility Maintenance Coordinator (2008)
Tagline:
I get s*%t done.
David “Luke” Walter
Education:
Norther Illinois University - Finance
David Walter
David Walter
David “Jack” Walter
Classmates
David Walter
view sourceSchools:
Richneck Elementary School Newport News VA 1985-1989
Community:
Frank Watson, Guy Schaller, Konra Kahl, Paul Beahm, Thomas Noyes
David Walter
view sourceSchools:
Paint Branch High School Burtonsville MD 1968-1972
Community:
Craig Medlicott, Geff Olufemi
David E. Walter, Jr.
view sourceSchools:
Morton Attendance Center High School Morton MS 1957-1961
Community:
Lisa Evers, Francis Cagle, Lisa Peek, Rita Prestage
David Walter
view sourceSchools:
North High School Minneapolis MN 1965-1969
Community:
Rondeana Sandbeck
David Walter
view sourceSchools:
North Catholic High School Pittsburgh PA 1951-1955
Community:
Sandra Osburn, Tim Kirby, Linda Simon, Stephen Cummings, Ronald Oswald
David Walter
view sourceSchools:
Elkton Christian High School Elkton MD 2000-2004
Community:
Frances Simpson, Carla Maynard, Cindy Thompson, Kate O'connor
David Walter
view sourceSchools:
Sacred Heart High School Muenster TX 1953-1957
Community:
Gracie Weatherly, Ray Wilde
David Walter
view sourceSchools:
Buena Vista High School Corona CA 1983-1987
Community:
Kathleen Bridges
Flickr
David Walter Rojas Torres
view source
Walter David Chavez
view source
Antnio David Walter Walter
view source
David Zivkovic Walter
view source
Jesus David Walter Luna
view source
David Alan Walter
view source
David Walter Gomez Morales
view source
David Walter Dino
view sourceGet Report for David Wayne Walter from Anna, TX, age ~65