Deborah D Forray

US Patent:

7176044, Feb 13, 2007

Filed:

Jun 12, 2003

Appl. No.:

10/459601

Inventors:

Deborah Derfelt Forray - San Diego CA, US
Puwei Liu - San Diego CA, US
Benedicto delos Santos - San Diego CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

G01R 31/26

US Classification:

438 15, 427582, 257787, 257788

Abstract:

The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

US Patent:

7645637, Jan 12, 2010

Filed:

Oct 16, 2006

Appl. No.:

11/581759

Inventors:

Deborah Forray - San Diego CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

H01L 21/50
H01L 21/48
H01L 21/44
H01L 23/52
H01L 23/48
H01L 29/40
H01L 23/13

US Classification:

438118, 257783, 257782, 257E2304

Abstract:

The invention is based on the discovery that certain self-filleting die attach adhesives are useful in semiconductor die assemblies containing thin die. As used herein, the term “self-filleting” refers to any adhesive that when dispensed and then subjected to suitable cure conditions, will flow and fill up the area between two die or between a die and a substrate while not forming a bulky fillet that can overflow onto the top of the die. In addition, the invention is useful for tight tolerance semiconductor die assemblies, since the fillet from the die-attach adhesives employed in the methods of the invention does not cover bond fingers, thereby causing wire bond yield loss.

US Patent:

7851254, Dec 14, 2010

Filed:

Feb 9, 2007

Appl. No.:

11/673140

Inventors:

Deborah Derfelt Forray - San Diego CA, US
Puwei Liu - San Diego CA, US
Benedicto delos Santos - San Diego CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

H01L 21/44

US Classification:

438106

Abstract:

The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

US Patent:

20020062923, May 30, 2002

Filed:

May 24, 1999

Appl. No.:

09/317493

Inventors:

DEBORAH D. FORRAY - SAN DIEGO CA, US

International Classification:

B32B031/26

US Classification:

156/307100, 156/330000, 156/331100

Abstract:

In accordance with the present invention, adhesive formulations have been developed which enable curing of adhesively bonded assemblies (i.e., assemblies which comprise devices which have been adhesively bonded to substrates) with dramatically reduced occurrence of void formation upon curing. In many instances, void formation can be eliminated employing invention compositions. In accordance with another aspect of the present invention, methods employing the above-described adhesive formulations are also provided, as are substantially void-free articles produced thereby.

US Patent:

20040225045, Nov 11, 2004

Filed:

May 5, 2003

Appl. No.:

10/429039

Inventors:

Deborah Forray - San Diego CA, US

Assignee:

HENKEL LOCTITE CORPORATION

International Classification:

C08K005/24

US Classification:

524/262000, 524/548000, 524/555000, 524/612000, 524/439000, 524/431000

Abstract:

The present invention relates to resin compositions, particularly those having a high degree of conductivity. In particular, the present invention relates to highly conductive die attach compositions useful for attaching semiconductor devices to carrier substrates. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.

US Patent:

20120279697, Nov 8, 2012

Filed:

May 11, 2012

Appl. No.:

13/469679

Inventors:

Deborah Forray - San Diego CA, US
My Nhu Nguyen - Poway CA, US

International Classification:

C09K 5/14
F28F 21/00

US Classification:

165185, 252 79, 252 76

Abstract:

A thermal interface material comprises a phenyl ester and a thermally conductive filler. The material optionally contains an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid.

US Patent:

57170347, Feb 10, 1998

Filed:

Jul 29, 1996

Appl. No.:

8/688206

Inventors:

Stephen M. Dershem - San Diego CA
Deborah D. Forray - San Diego CA

Assignee:

Quantum Materials, Inc. - San Diego CA

International Classification:

C08F25900

US Classification:

525276

Abstract:

In accordance with the present invention, it has been discovered that perfluorinated hydrocarbon polymers can be used as fillers for the preparation of adhesive formulations having excellent dielectric properties, i. e. , very low conductivities. Invention compositions display excellent rheological properties, in addition to low dielectric constants. Invention formulations can be used for a variety of purposes, such as, for example, for the preparation of filled adhesive formulations with a reduced propensity to settle out, excellent dispensing characteristics due to the thixotropic nature thereof, and the like.