Dennis G Manzer

US Patent:

7511913, Mar 31, 2009

Filed:

Apr 20, 2006

Appl. No.:

11/409335

Inventors:

Dennis G. Manzer - Bedford Hills NY, US

Assignee:

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

International Classification:

G11B 21/02

US Classification:

360 75

Abstract:

Embodiments of the present invention provide an approach in the time domain, instead of the frequency domain, for analyzing and correcting for radial propagation instability in servo-writing. In one embodiment, a system for controlling a read/write head of a disk drive to correct propagation errors during self-servo writing on a disk comprises a time-domain based controller to provide closed-loop feedback control to an actuator for moving the read/write head, the controller including a state observer. The controller is configured to measure read head position information of the read/write head on the disk; provide the measured read head position information to the state observer which produces feedback variables for feedback control of the read/write head, the feedback variables being weighted by feedback gains which have been determined a prior; and apply the weighted feedback variables to provide the closed-loop feedback control to the actuator for moving the read/write head.

US Patent:

7513410, Apr 7, 2009

Filed:

Jun 11, 2007

Appl. No.:

11/760813

Inventors:

Glen N. Biggs - Wappingers Falls NY, US
Timothy J. Chainer - Putnam Valley NY, US
John P. Karidis - Ossining NY, US
Dennis G. Manzer - Bedford Hills NY, US
Christopher L. Tessler - Poughquag NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B23K 31/02
B22D 35/00

US Classification:

228256, 228 33, 222592

Abstract:

An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

US Patent:

7751924, Jul 6, 2010

Filed:

Jul 30, 2007

Appl. No.:

11/830349

Inventors:

Timothy J Chainer - Putnam Valley NY, US
Peter A Gruber - Mohegan Lake NY, US
Dennis G Manzer - Bedford Hills NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 19/00
H01L 23/544
B23K 31/02
B23K 35/36

US Classification:

700146, 2281801, 228190, 22826231, 22826242, 257620

Abstract:

An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein the position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors.

US Patent:

7882890, Feb 8, 2011

Filed:

Jul 13, 2007

Appl. No.:

11/777837

Inventors:

Dennis G Manzer - Bedford Hills NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

F28D 15/02

US Classification:

16510424, 16510433

Abstract:

A cooling system for a heat-generating device includes: coolant fluid; an evaporator for holding the coolant fluid and for heating the coolant fluid; said evaporator in close proximity to the heat-generating device for removing unwanted heat. The cooling system also includes a plurality of tubes for providing a flow path for the coolant fluid and gases produced by the evaporator; a heat exchanger through which the tubes pass for cooling the coolant fluid. The heat exchanger includes: a reservoir, a coolant, and a heating element for heating the gas so that it expands and pushes cool coolant fluid back to the evaporator. The heating element may be located inside the reservoir.

US Patent:

7955160, Jun 7, 2011

Filed:

Jun 9, 2008

Appl. No.:

12/135315

Inventors:

Michael A. Cobb - Croton on Hudson NY, US
Dinesh R. Koli - Hartsdale NY, US
Michael F. Lofaro - Stamford CT, US
Dennis G. Manzer - Bedford Hills NY, US
James A. Tornello - Cortlandt Manor NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24B 1/00

US Classification:

451 41, 451287, 451291

Abstract:

A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.

US Patent:

8535118, Sep 17, 2013

Filed:

Sep 20, 2011

Appl. No.:

13/237374

Inventors:

Michael A. Cobb - Croton on Hudson NY, US
Mahadevaiyer Krishnan - Hopewell Junction NY, US
Michael F. Lofaro - Hopewell Junction NY, US
Dennis G. Manzer - Bedford Hills NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B24B 1/00

US Classification:

451 41, 451194, 451195, 451209, 451212

Abstract:

An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.

US Patent:

20110162821, Jul 7, 2011

Filed:

Jan 5, 2010

Appl. No.:

12/652161

Inventors:

Dennis G. Manzer - Yorktown Heights NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

F28D 15/00

US Classification:

16510431, 16510433

Abstract:

A self-pumping liquid and gas cooling system for the cooling of solar cells and heat generating elements. A method for the self-pumping of liquid and gas coolants utilizes the cooling system. The essentially closed coolant system incorporates a heat exchanger having a length meandering tubing passing therethrough the opposite ends of which are, respectively, in communication with a driving pump and a return pump that are interconnected by a shaft. Hereby, tubing intermediate the circuit formed by the pumps extends through an evaporator structure containing the chip or heat-generating solar cell or cells.

US Patent:

20130072092, Mar 21, 2013

Filed:

Sep 6, 2012

Appl. No.:

13/605363

Inventors:

Michael F. Lofaro - Hopewell Junction NY, US
Mahadevaiyer Krishnan - Hopewell Junction NY, US
Michael A. Cobb - Croton on Hudson NY, US
Dennis G. Manzer - Bedford Hills NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

B24B 1/00

US Classification:

451 53

Abstract:

An apparatus for chemical mechanical planarization includes a spindle assembly structure and at least one substrate carrier, which make a linear lateral movement relative to each other while abrasive surfaces of a plurality of cylindrical spindles in the spindle assembly structure contact, and rotate against, at least one substrate mounted on the at least one substrate carrier. The direction of the linear lateral movement is within the plane that tangentially contacts the plurality of cylindrical spindles, and can be orthogonal to the axes of rotation of the plurality of cylindrical spindles.