Diane I Scott

US Patent:

6623337, Sep 23, 2003

Filed:

Jun 29, 2001

Appl. No.:

09/896588

Inventors:

Diane B. Scott - Portland OR
Tao Zhang - Irvine CA

Assignee:

Rodel Holdings, Inc. - Wilmington DE

International Classification:

B24B 100

US Classification:

451 41, 451527, 451533

Abstract:

The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.

US Patent:

8439994, May 14, 2013

Filed:

Sep 30, 2010

Appl. No.:

12/895529

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 11/00
B24D 3/00
B24D 18/00

US Classification:

51293, 451537

Abstract:

Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

US Patent:

8628384, Jan 14, 2014

Filed:

Sep 30, 2010

Appl. No.:

12/895465

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 3/28

US Classification:

451526, 451528, 451921, 451 6, 451287

Abstract:

Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

US Patent:

20010031612, Oct 18, 2001

Filed:

Jan 4, 2001

Appl. No.:

09/754528

Inventors:

Diane Scott - Vancouver WA, US
Craig Lack - Wilmington DE, US

International Classification:

B24B007/00
B24D011/00

US Classification:

451/065000, 451/533000

Abstract:

A polishing pad is retained on a platen by structures which do not require adhesive. In one embodiment, a polishing pad has a top polishing surface and an undersurface. The undersurface has a surface profile which is configured to interfit with a complementary surface profile on a platen. The surface profile of the undersurface may comprise an array of parallel ridges and grooves.

US Patent:

20020022082, Feb 21, 2002

Filed:

Aug 8, 2001

Appl. No.:

09/924825

Inventors:

Diane Scott - Portland OR, US

International Classification:

B05D005/12

US Classification:

427/096000

Abstract:

A wafer support member (), and a method of changing local compressibility of a wafer support member () to provide a seal, includes, dispensing a curable sealant material () onto a resiliently compressible wafer support member (), the support member having pores () for directing either fluid borne pressure or fluid borne vacuum between the wafer support member () and a backside of a wafer to be supported, wicking the sealant material () into pores () of the wafer support member (), curing the sealant material () to provide a film closing each of the pores () that are intercepted by the sealant material (), to change local compressibility of the edge margin () of the wafer support member (), and provide a seal.

US Patent:

20090311955, Dec 17, 2009

Filed:

Mar 16, 2009

Appl. No.:

12/381709

Inventors:

Robert Kerprich - Portland OR, US
Karey Holland - North Plains OR, US
Diane Scott - Portland OR, US
Sudhanshu Misra - San Jose CA, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 7/18

US Classification:

451548, 451527

Abstract:

CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof.

US Patent:

20110171883, Jul 14, 2011

Filed:

Jan 13, 2010

Appl. No.:

12/657135

Inventors:

William Allison - Beaverton OR, US
Ping Huang - St. Louis Park MN, US
Diane Scott - Portland OR, US
Richard Frentzel - Murrieta CA, US
Robert Kerprich - Portland OR, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 7/12
B24B 49/12
B24D 3/00
B24D 3/32
B24D 11/00

US Classification:

451 6, 451527, 51296

Abstract:

A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area;

US Patent:

20120009855, Jan 12, 2012

Filed:

Jul 8, 2010

Appl. No.:

12/832908

Inventors:

William Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Robert Kerprich - Portland OR, US
Ping Huang - St. Louis Park MN, US
Richard Frentzel - Murrieta CA, US

International Classification:

B24D 11/00
B24D 3/32
B24D 13/14

US Classification:

451527, 51296

Abstract:

Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.